JPS63178360U - - Google Patents
Info
- Publication number
- JPS63178360U JPS63178360U JP6925787U JP6925787U JPS63178360U JP S63178360 U JPS63178360 U JP S63178360U JP 6925787 U JP6925787 U JP 6925787U JP 6925787 U JP6925787 U JP 6925787U JP S63178360 U JPS63178360 U JP S63178360U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- lead frames
- molded
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6925787U JPS63178360U (lv) | 1987-05-08 | 1987-05-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6925787U JPS63178360U (lv) | 1987-05-08 | 1987-05-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63178360U true JPS63178360U (lv) | 1988-11-18 |
Family
ID=30909824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6925787U Pending JPS63178360U (lv) | 1987-05-08 | 1987-05-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63178360U (lv) |
-
1987
- 1987-05-08 JP JP6925787U patent/JPS63178360U/ja active Pending
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