JPS63178325U - - Google Patents

Info

Publication number
JPS63178325U
JPS63178325U JP1987069498U JP6949887U JPS63178325U JP S63178325 U JPS63178325 U JP S63178325U JP 1987069498 U JP1987069498 U JP 1987069498U JP 6949887 U JP6949887 U JP 6949887U JP S63178325 U JPS63178325 U JP S63178325U
Authority
JP
Japan
Prior art keywords
wire bonding
pad
thin metal
metal wires
bonding pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987069498U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987069498U priority Critical patent/JPS63178325U/ja
Publication of JPS63178325U publication Critical patent/JPS63178325U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07541Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/59Bond pads specially adapted therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads
    • H10W72/934Cross-sectional shape, i.e. in side view

Landscapes

  • Wire Bonding (AREA)
JP1987069498U 1987-05-09 1987-05-09 Pending JPS63178325U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987069498U JPS63178325U (enExample) 1987-05-09 1987-05-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987069498U JPS63178325U (enExample) 1987-05-09 1987-05-09

Publications (1)

Publication Number Publication Date
JPS63178325U true JPS63178325U (enExample) 1988-11-18

Family

ID=30910285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987069498U Pending JPS63178325U (enExample) 1987-05-09 1987-05-09

Country Status (1)

Country Link
JP (1) JPS63178325U (enExample)

Similar Documents

Publication Publication Date Title
JPS63178325U (enExample)
JPS6395271U (enExample)
JPS61177479U (enExample)
JPS5993408U (ja) エレクトロパラトグラフ用人工口蓋
JPS6279368U (enExample)
JPH0356153U (enExample)
JPH0325272U (enExample)
JPS6399643U (enExample)
JPH0284328U (enExample)
JPS6397236U (enExample)
JPS6176988U (enExample)
JPS62163945U (enExample)
JPS6122363U (ja) ボンデイングパツドの膜構成
JPH02108359U (enExample)
JPS61138298U (enExample)
JPH0237415U (enExample)
JPS63177043U (enExample)
JPH03109374U (enExample)
JPS624063U (enExample)
JPH03121846U (enExample)
JPH0158659U (enExample)
JPH0286134U (enExample)
JPH0477240U (enExample)
JPS6393637U (enExample)
JPH0336839U (enExample)