JPS63178324U - - Google Patents
Info
- Publication number
- JPS63178324U JPS63178324U JP6887287U JP6887287U JPS63178324U JP S63178324 U JPS63178324 U JP S63178324U JP 6887287 U JP6887287 U JP 6887287U JP 6887287 U JP6887287 U JP 6887287U JP S63178324 U JPS63178324 U JP S63178324U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- pedestal
- tool
- bonding tool
- pinching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987068872U JPH0510364Y2 (https=) | 1987-05-11 | 1987-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987068872U JPH0510364Y2 (https=) | 1987-05-11 | 1987-05-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63178324U true JPS63178324U (https=) | 1988-11-18 |
| JPH0510364Y2 JPH0510364Y2 (https=) | 1993-03-15 |
Family
ID=30909088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987068872U Expired - Lifetime JPH0510364Y2 (https=) | 1987-05-11 | 1987-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510364Y2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0397239A (ja) * | 1989-09-11 | 1991-04-23 | Nec Corp | ボンディング方法及びその装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5486272A (en) * | 1977-12-21 | 1979-07-09 | Nec Corp | Lead bonding device |
| JPS58142534A (ja) * | 1982-02-19 | 1983-08-24 | Nec Corp | フイルムキヤリアボンデイング装置 |
| JPS6220339A (ja) * | 1985-07-19 | 1987-01-28 | Marine Instr Co Ltd | テ−プボンデイング装置 |
-
1987
- 1987-05-11 JP JP1987068872U patent/JPH0510364Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5486272A (en) * | 1977-12-21 | 1979-07-09 | Nec Corp | Lead bonding device |
| JPS58142534A (ja) * | 1982-02-19 | 1983-08-24 | Nec Corp | フイルムキヤリアボンデイング装置 |
| JPS6220339A (ja) * | 1985-07-19 | 1987-01-28 | Marine Instr Co Ltd | テ−プボンデイング装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0397239A (ja) * | 1989-09-11 | 1991-04-23 | Nec Corp | ボンディング方法及びその装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0510364Y2 (https=) | 1993-03-15 |