JPS63174458U - - Google Patents
Info
- Publication number
- JPS63174458U JPS63174458U JP1986191534U JP19153486U JPS63174458U JP S63174458 U JPS63174458 U JP S63174458U JP 1986191534 U JP1986191534 U JP 1986191534U JP 19153486 U JP19153486 U JP 19153486U JP S63174458 U JPS63174458 U JP S63174458U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- space
- semiconductor device
- semiconductor chip
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986191534U JPS63174458U (US06633600-20031014-M00021.png) | 1986-12-12 | 1986-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986191534U JPS63174458U (US06633600-20031014-M00021.png) | 1986-12-12 | 1986-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63174458U true JPS63174458U (US06633600-20031014-M00021.png) | 1988-11-11 |
Family
ID=31145764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986191534U Pending JPS63174458U (US06633600-20031014-M00021.png) | 1986-12-12 | 1986-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63174458U (US06633600-20031014-M00021.png) |
-
1986
- 1986-12-12 JP JP1986191534U patent/JPS63174458U/ja active Pending
