JPS63174442U - - Google Patents

Info

Publication number
JPS63174442U
JPS63174442U JP1987027017U JP2701787U JPS63174442U JP S63174442 U JPS63174442 U JP S63174442U JP 1987027017 U JP1987027017 U JP 1987027017U JP 2701787 U JP2701787 U JP 2701787U JP S63174442 U JPS63174442 U JP S63174442U
Authority
JP
Japan
Prior art keywords
wire
spool
surface roughness
winding drum
wound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987027017U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0541549Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987027017U priority Critical patent/JPH0541549Y2/ja
Publication of JPS63174442U publication Critical patent/JPS63174442U/ja
Application granted granted Critical
Publication of JPH0541549Y2 publication Critical patent/JPH0541549Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07168Means for storing or moving the material for the connector
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07502Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Wire Bonding (AREA)
JP1987027017U 1987-02-25 1987-02-25 Expired - Lifetime JPH0541549Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987027017U JPH0541549Y2 (https=) 1987-02-25 1987-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987027017U JPH0541549Y2 (https=) 1987-02-25 1987-02-25

Publications (2)

Publication Number Publication Date
JPS63174442U true JPS63174442U (https=) 1988-11-11
JPH0541549Y2 JPH0541549Y2 (https=) 1993-10-20

Family

ID=30828654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987027017U Expired - Lifetime JPH0541549Y2 (https=) 1987-02-25 1987-02-25

Country Status (1)

Country Link
JP (1) JPH0541549Y2 (https=)

Also Published As

Publication number Publication date
JPH0541549Y2 (https=) 1993-10-20

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