JPS63174170U - - Google Patents
Info
- Publication number
- JPS63174170U JPS63174170U JP1987034762U JP3476287U JPS63174170U JP S63174170 U JPS63174170 U JP S63174170U JP 1987034762 U JP1987034762 U JP 1987034762U JP 3476287 U JP3476287 U JP 3476287U JP S63174170 U JPS63174170 U JP S63174170U
- Authority
- JP
- Japan
- Prior art keywords
- panel
- connector
- utility
- sides
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 1
- 230000013011 mating Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本発明の基本的構成を示す平面図、第
２図はバツクパネルへのプリント基板の取付け前
後の状態を示す側面図、第３図は実施例に関連し
たシステム回路図、第４図は実施例１に係るバツ
クパネルとプリント基板の関係を示す平面図、第
５図は側面図、第６図は実施例２に係る筐体の要
部断面図、第７図は同筐体の背面図である。
１…バツクパネル、２…コネクタ、３…電子部
品類、４…プリント基板、５…コネクタ、６…シ
エルフ、７…筐体側、ａ，ｂ…バツクパネルの面
。
Fig. 1 is a plan view showing the basic configuration of the present invention, Fig. 2 is a side view showing the state before and after the printed circuit board is attached to the back panel, Fig. 3 is a system circuit diagram related to the embodiment, and Fig. 4 is a plan view showing the relationship between the back panel and the printed circuit board according to the first embodiment, FIG. 5 is a side view, FIG. 6 is a cross-sectional view of the main part of the casing according to the second embodiment, and FIG. 7 is the back side of the casing. It is a diagram. 1... Back panel, 2... Connector, 3... Electronic parts, 4... Printed circuit board, 5... Connector, 6... Shelf, 7... Housing side, a, b... Back panel surface.
Claims (1)
り、且つパネル両面にプリント基板を装着するた
めのコネクタを装着した高密実装用バツクパネル
。 (2) コネクタの嵌合接続方向がパネル面と平行
になるようにコネクタをパネル面に装着した実用
新案登録請求の範囲第(1)項記載の高密実装用バ
ツクパネル。[Scope of Claim for Utility Model Registration] (1) A back panel for high-density mounting that has conductor patterns formed on both sides of the panel and connectors for mounting printed circuit boards on both sides of the panel. (2) The back panel for high-density mounting according to claim (1) of the utility model registration, in which the connector is attached to the panel surface so that the direction of mating and connection of the connector is parallel to the panel surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987034762U JPS63174170U (en) | 1987-03-10 | 1987-03-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987034762U JPS63174170U (en) | 1987-03-10 | 1987-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63174170U true JPS63174170U (en) | 1988-11-11 |
Family
ID=30843617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987034762U Pending JPS63174170U (en) | 1987-03-10 | 1987-03-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63174170U (en) |
-
1987
- 1987-03-10 JP JP1987034762U patent/JPS63174170U/ja active Pending
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