JPS63172166U - - Google Patents

Info

Publication number

JPS63172166U

JPS63172166U JP6609987U JP6609987U JPS63172166U JP S63172166 U JPS63172166 U JP S63172166U JP 6609987 U JP6609987 U JP 6609987U JP 6609987 U JP6609987 U JP 6609987U JP S63172166 U JPS63172166 U JP S63172166U

Authority

JP

Japan

Prior art keywords

plating layer

insulating substrate

thermally conductive

aluminum

conductive plate

Prior art date

1987-04-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
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• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
• 238000007747 plating Methods 0.000 claims description 7
• VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
• 229910052759 nickel Inorganic materials 0.000 claims description 4
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
• 229910052782 aluminium Inorganic materials 0.000 claims description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
• 229910052802 copper Inorganic materials 0.000 claims description 2
• 239000010949 copper Substances 0.000 claims description 2
• 239000000463 material Substances 0.000 claims 5
• 239000000758 substrate Substances 0.000 claims 3