JPS63171095U - - Google Patents
Info
- Publication number
- JPS63171095U JPS63171095U JP6325687U JP6325687U JPS63171095U JP S63171095 U JPS63171095 U JP S63171095U JP 6325687 U JP6325687 U JP 6325687U JP 6325687 U JP6325687 U JP 6325687U JP S63171095 U JPS63171095 U JP S63171095U
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- voice coil
- lead wire
- electroacoustic transducer
- electrodynamic electroacoustic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 230000005520 electrodynamics Effects 0.000 claims 2
- 238000000016 photochemical curing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案実施例の振動板の接着剤の塗布
状態を示す図、第２図は振動系の組立状態断面図
、第３図は実施例の断面図である。
１は振動板、２は接着剤、３はボイスコイル、
４はリード線、５は磁気回路、６はフレームであ
る。
FIG. 1 is a diagram showing a state in which adhesive is applied to a diaphragm according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the assembled vibration system, and FIG. 3 is a cross-sectional view of the embodiment. 1 is the diaphragm, 2 is the adhesive, 3 is the voice coil,
4 is a lead wire, 5 is a magnetic circuit, and 6 is a frame.
Claims (1)
されて一体となつた振動系を有する動電型電気音
響変換器に於て、前記振動板１の全表面、若しく
はボイスコイル３及びリード線４の接着部位に塗
布された光硬化型接着剤２により、前記ボイスコ
イル３及びリード線４が振動板１に接着されてい
ることを特徴とする動電型電気音響変換器。 In an electrodynamic electroacoustic transducer having an integrated vibration system in which the voice coil 3 is directly bonded to the back surface of the diaphragm 1, the entire surface of the diaphragm 1 or the voice coil 3 and the lead wire 4 An electrodynamic electroacoustic transducer characterized in that the voice coil 3 and the lead wire 4 are bonded to the diaphragm 1 by a photocuring adhesive 2 applied to the bonding site.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6325687U JPS63171095U (en) | 1987-04-24 | 1987-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6325687U JPS63171095U (en) | 1987-04-24 | 1987-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63171095U true JPS63171095U (en) | 1988-11-08 |
Family
ID=30898309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6325687U Pending JPS63171095U (en) | 1987-04-24 | 1987-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63171095U (en) |
-
1987
- 1987-04-24 JP JP6325687U patent/JPS63171095U/ja active Pending
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