JPS63170946U - - Google Patents
Info
- Publication number
- JPS63170946U JPS63170946U JP6267687U JP6267687U JPS63170946U JP S63170946 U JPS63170946 U JP S63170946U JP 6267687 U JP6267687 U JP 6267687U JP 6267687 U JP6267687 U JP 6267687U JP S63170946 U JPS63170946 U JP S63170946U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- semiconductor pellet
- lead
- sealing resin
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000002335 surface treatment layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6267687U JPH0442921Y2 (US06252093-20010626-C00008.png) | 1987-04-27 | 1987-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6267687U JPH0442921Y2 (US06252093-20010626-C00008.png) | 1987-04-27 | 1987-04-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63170946U true JPS63170946U (US06252093-20010626-C00008.png) | 1988-11-07 |
| JPH0442921Y2 JPH0442921Y2 (US06252093-20010626-C00008.png) | 1992-10-12 |
Family
ID=30897174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6267687U Expired JPH0442921Y2 (US06252093-20010626-C00008.png) | 1987-04-27 | 1987-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442921Y2 (US06252093-20010626-C00008.png) |
-
1987
- 1987-04-27 JP JP6267687U patent/JPH0442921Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442921Y2 (US06252093-20010626-C00008.png) | 1992-10-12 |
