JPS63170826A - Circuit breaking element - Google Patents
Circuit breaking elementInfo
- Publication number
- JPS63170826A JPS63170826A JP214587A JP214587A JPS63170826A JP S63170826 A JPS63170826 A JP S63170826A JP 214587 A JP214587 A JP 214587A JP 214587 A JP214587 A JP 214587A JP S63170826 A JPS63170826 A JP S63170826A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- insulating
- substrate
- particles
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 7
- 239000011230 binding agent Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（ａｌ産業上の利用分野
この発明は、過電流などによって回路を遮断する回路遮
断素子に関する。DETAILED DESCRIPTION OF THE INVENTION (Al Industrial Application Field) This invention relates to a circuit breaking element that breaks a circuit due to overcurrent or the like.
（ｂ）従来の技術
何らかの原因で回路に過電流が流れた際、その回路に流
れる電流が遮断されるように、回路遮断素子を他の部品
とともに予め回路ＨＨ上にｆ、１）み込むごとが従来よ
り行われている。(b) Conventional technology In order to cut off the current flowing through the circuit when an overcurrent flows through the circuit for some reason, a circuit breaker element is placed in advance on the circuit HH along with other components. has traditionally been carried out.
第４図はこの種の回路遮断素子の構造を表す図である。FIG. 4 is a diagram showing the structure of this type of circuit interrupting element.
図において１４．１４はリードフレームから構成された
リード端子を表し、この二つのリード端子の素子内部の
端部間に金線１５がワイヤーボンディングされ、その周
囲が樹脂１６によってモールドされている。このような
回路遮断素子の場合、リード端子１４．１４間に一定電
流以上の電流が流れた際、金線１５が溶断し、リード端
子１４．１４間が絶縁状態となる。In the figure, reference numeral 14.14 represents a lead terminal constituted by a lead frame, a gold wire 15 is wire-bonded between the ends of the two lead terminals inside the element, and the periphery thereof is molded with resin 16. In the case of such a circuit breaking element, when a current equal to or higher than a certain current flows between the lead terminals 14 and 14, the gold wire 15 melts and the lead terminals 14 and 14 become insulated.
第５図は従来考えられている他の回路遮断素子の構造を
表す断面図である。図において、１０は絶縁体からなる
円柱状の基材であり、その表面に低融点の絶縁材ＪＷＩ
Ｉが形成され、さらにその表面に銅などの金属抵抗皮膜
層１２が形成され、回路遮断素子本体２０が構成されて
いる。この素子２０の両端にはリード端子１４．１４を
それぞれ接続した導電性キャップ１３．１３が固着され
、全体が絶縁性カバー１７などによって被覆されている
。このように構成された回路遮断素子の場合、リード端
子１４．１４間に過電流が流れた際、金属抵抗皮膜Ｎ１
２の発熱により絶縁材層１）が溶断し、それとともに金
属抵抗皮膜Ｊｉ１２が溶断し、リード端子１４．１４間
を遮断する。FIG. 5 is a sectional view showing the structure of another conventionally considered circuit breaking element. In the figure, 10 is a cylindrical base material made of an insulator, and a low melting point insulating material JWI is coated on its surface.
A metal resistance film layer 12 made of copper or the like is further formed on the surface of the metal resistance film 12 to constitute a circuit breaker element main body 20. Conductive caps 13 and 13 to which lead terminals 14 and 14 are respectively connected are fixed to both ends of this element 20, and the entire element is covered with an insulating cover 17 or the like. In the case of the circuit breaker element configured in this way, when an overcurrent flows between the lead terminals 14 and 14, the metal resistance film N1
The insulating material layer 1) is fused due to the heat generated by 2, and the metal resistance film Ji12 is fused at the same time, cutting off the connection between the lead terminals 14 and 14.
（Ｃ）発明が解決しようとする問題点
ところが、このような従来の回路遮断素子はいずれもリ
ード端子を備えた素子であり、回路基板に対して表面実
装を行うことが困難であった。仮に、チップ型に構成す
るとしても、溶断配線部分を如何にして小形に構成する
かが問題であった。(C) Problems to be Solved by the Invention However, all such conventional circuit interrupting devices are devices equipped with lead terminals, making it difficult to surface-mount them on a circuit board. Even if it were to be constructed in a chip type, the problem was how to make the fused wiring portion small.
このため、従来は表面実装用の他の電子部品とともに用
いることができず、回路基板全体をあまり小型化できな
いという問題があった。また、リード端子には浮遊容量
や浮遊インダクタンスが存在するため、高周波回路には
適さない。For this reason, there has been a problem in the past that it cannot be used together with other electronic components for surface mounting, and that the overall size of the circuit board cannot be reduced much. Furthermore, lead terminals have stray capacitance and stray inductance, so they are not suitable for high-frequency circuits.
この発明は、リード端子を設けることなく、回路基板に
対して容易に表面実装できるようにした回路遮断素子を
提供することを目的としている。An object of the present invention is to provide a circuit interrupting element that can be easily surface-mounted on a circuit board without providing lead terminals.
（ｄ）問題点を解決するための手段
この発明の回路遮断素子は、熱溶融性絶縁性粒子と導電
性粒子とバインダの混合体からなる導電性ペーストを焼
成して回路遮断配線部を基板表面に形成してなる回路遮
断素子において、前記基板表面に前記熱溶融性絶縁性粒
子と同質の絶縁膜を設け、その膜上に前記回路遮断配線
部を形成したことを特徴としている。(d) Means for Solving the Problems The circuit interrupting element of the present invention is produced by baking a conductive paste made of a mixture of heat-melting insulating particles, conductive particles, and a binder to form a circuit interrupting wiring portion on a substrate surface. The circuit interrupting element is characterized in that an insulating film of the same quality as the heat-melting insulating particles is provided on the surface of the substrate, and the circuit interrupting wiring portion is formed on the film.
（Ｑ）作用
この発明の回路遮断素子においては、基板の表面に形成
された絶縁膜上にその絶縁膜と同質の熱溶融性絶縁性粒
子と導電性粒子とバインダの混合体からなる導電性ペー
ストを焼成することによって、回路遮断配線部が形成さ
れる。この回路遮断配線部に過電流が流れると、発熱に
より熱溶融性絶縁性粒子が局部的に溶融するため、導電
性粒子が相互に遊離、拡散して導電性粒子間の導電路が
遮断される。このとき、基板と回路遮断配線部間に形成
されている絶縁膜は、回路遮断配線部の熱溶融性絶縁性
粒子と同質であるため、導電性粒子がこの絶縁膜にまで
拡散し、導電路の遮断が円滑かつ確実に行われる。また
、この絶縁膜は上記の性質から導電性ペーストとの接合
強度が大きく機械的安定性の優れた回路遮断配線部が形
成される（ｆ）実施例
第１図はこの発明の実施例である回路遮断素子の製造途
中における状態を表す斜視図、第２図は完成された回路
遮断素子の構造を表す断面図である。両図において、１
はアルミナなどからなる絶縁性基板である。その表面に
ガラス質膜２が形成されている。さらにその表面に導電
性ペーストの塗布／焼結によって回路遮断配線部３と外
部接続用電極の下地電極３ａ、３ｂが同時に形成されて
いる。第１図に示すようにこの回路遮断配線部３は幅の
細い配線パターンから構成されている。回路遮断配線部
が遮断に至るまでの時間と電流の特性は、第１図に示し
た回路遮断配線部３の膜厚。(Q) Function In the circuit breaker element of the present invention, a conductive paste consisting of a mixture of heat-melting insulating particles, conductive particles, and a binder of the same quality as the insulating film is applied on the insulating film formed on the surface of the substrate. By firing, a circuit breaking wiring part is formed. When an overcurrent flows through this circuit-breaking wiring, heat-melting insulating particles locally melt due to heat generation, which causes the conductive particles to separate and diffuse into each other, cutting off the conductive path between the conductive particles. . At this time, since the insulating film formed between the substrate and the circuit-breaking wiring section is of the same quality as the heat-melting insulating particles of the circuit-breaking wiring section, the conductive particles diffuse into this insulating film, leading to the conductive path. is shut off smoothly and reliably. In addition, due to the above-mentioned properties, this insulating film has a high bonding strength with the conductive paste, forming a circuit breaking wiring part with excellent mechanical stability. (f) Embodiment FIG. 1 shows an embodiment of the present invention. FIG. 2 is a perspective view showing a state in the middle of manufacturing the circuit breaker element, and FIG. 2 is a sectional view showing the structure of the completed circuit breaker element. In both figures, 1
is an insulating substrate made of alumina or the like. A glassy film 2 is formed on its surface. Furthermore, a circuit interrupting wiring portion 3 and base electrodes 3a and 3b of external connection electrodes are simultaneously formed on the surface by applying and sintering a conductive paste. As shown in FIG. 1, this circuit interrupting wiring section 3 is composed of a narrow wiring pattern. The time and current characteristics until the circuit breaker wiring part is cut off are determined by the film thickness of the circuit breaker wiring part 3 shown in FIG.
幅、長さ、および材料によって定まる。ここで用いられ
る導電性ペーストは、導電性粒子としてＡｇとＰｄが用
いられ、絶縁性粒子として、前記基板上に形成されたガ
ラス質膜２と同質のガラスフリフトが用いられる。また
バインダとして樹脂および溶剤が用いられ、たとえば重
量比として、Ａｇ７０％、Ｐｄ０〜１０％、ガラスフリ
ット１０％、バインダ１０％の導電性ペーストを用いる
ことができる。この場合、塗布／焼結後の面積抵抗は膜
厚１０〜１５μのとき５〜１５ｍΩである。Determined by width, length, and material. In the conductive paste used here, Ag and Pd are used as conductive particles, and glass lift, which is the same as the glassy film 2 formed on the substrate, is used as insulating particles. Further, a resin and a solvent are used as the binder, and for example, a conductive paste having a weight ratio of 70% Ag, 0 to 10% Pd, 10% glass frit, and 10% binder can be used. In this case, the sheet resistance after coating/sintering is 5 to 15 mΩ when the film thickness is 10 to 15 μm.
また、配線パターンの寸法はたとえば幅０．１ｍｍ、長
さ１．８ｍｍである。Further, the dimensions of the wiring pattern are, for example, a width of 0.1 mm and a length of 1.8 mm.
このようにして、回路遮断配線部と外部接続用電極の下
地電極を形成した後、回路遮断配線部３と外部接続用電
極の下地電極３ａ、３ｂの一部にわたってガラス質膜か
らなる保護膜４を被覆し、さらに、基板１の上面両端部
に露出している外部接続用電極の下地電極３ａ、３ｂの
表面から基板１の両側面を介して両端部の下面の一部に
まで導電性ペーストを塗布し、焼結することによって内
部電極５ａ、５ｂを形成する。さらに、この内部電極の
表面に耐半田性を高めるためＮｉメッキを行い、Ｎｉメ
ッキＮ５ａ、５ｂを形成する。さらにその表面に半田付
は性を良好にするため、半田メッキを行い、半田メッキ
層７ａ、７ｂを形成する。After forming the base electrodes of the circuit break wiring part 3 and the external connection electrode in this way, a protective film 4 made of a glassy film is formed over part of the circuit break wiring part 3 and the base electrodes 3a and 3b of the external connection electrode. Furthermore, a conductive paste is applied from the surface of the base electrodes 3a and 3b of the external connection electrodes exposed on both ends of the upper surface of the substrate 1 to a part of the lower surface of both ends via both side surfaces of the substrate 1. The internal electrodes 5a and 5b are formed by coating and sintering. Furthermore, Ni plating is performed on the surfaces of these internal electrodes to improve solder resistance, thereby forming Ni plating N5a and 5b. Furthermore, in order to improve solderability, solder plating is performed on the surface to form solder plating layers 7a and 7b.
以上のように構成したことにより、半田メッキ層７ａ、
７ｂは回路遮断配線部３の両端と電気的に接続され、外
部接続用の電極として用いられる。すなわち、この回路
遮断素子を回路基板上に取り付ける際、この外部接続用
電極を直接半田付けすることによって容易に表面実装す
ることができる。With the above configuration, the solder plating layer 7a,
7b is electrically connected to both ends of the circuit breaking wiring section 3, and is used as an electrode for external connection. That is, when mounting this circuit interrupting element on a circuit board, it can be easily surface mounted by directly soldering this external connection electrode.
第３図（Ａ）、 （Ｂ）は以上のように構成された回
路遮断素子の遮断時間と電流との関係を表す二側である
。たとえば同図（Ａ）の素子では、約２．９ （Ａ）の
とき１秒で遮断され、同図（Ｂ）の素子では、約２．２
（Ａ）のとき１秒で遮断される。FIGS. 3(A) and 3(B) are two views showing the relationship between the breaking time and current of the circuit breaking element configured as described above. For example, the device shown in the figure (A) is cut off in 1 second when the voltage is about 2.9 (A), and the device shown in the figure (B) is cut off at about 2.2 (A).
In case (A), it is shut off in 1 second.
なお、上記実施例の説明では、チップ型の回路遮断素子
１個分についてのみ表したが、従来のチップ抵抗等の場
合と同様に、−板の基板上に多数の素子を形成し、これ
を分断することにより容易に大量生産することができる
。Note that in the explanation of the above embodiment, only one chip-type circuit breaker element was described, but as in the case of conventional chip resistors, a large number of elements are formed on a -plate substrate, and these elements are connected. It can be easily mass-produced by dividing it.
なお、実施例は基板材料としてアルミナを用いて絶縁膜
としてガラス質膜を用い、さらに導電性ペーストの絶縁
性材料としてガラスフリット、導電性粒子として金属粒
子を用いた例であったが、これらを全て、あるいは一部
を樹脂系の材料で置き換えることも可能である。例えば
、絶縁膜として絶縁性樹脂材料を用い、導電性ペースト
として同質の樹脂系絶縁材料中に導電性粒子を分散させ
たものを用いることができる。In addition, in the example, alumina was used as the substrate material, a glassy film was used as the insulating film, glass frit was used as the insulating material of the conductive paste, and metal particles were used as the conductive particles. It is also possible to replace all or part of it with a resin-based material. For example, an insulating resin material can be used as the insulating film, and a material in which conductive particles are dispersed in a homogeneous resin-based insulating material can be used as the conductive paste.
（ｇ）発明の効果
以上のようにこの発明によれば、他のチップ型電子部品
と同様に、リード端子を用いることなく、回路基板上に
表面実装することができ、回路基板に対する部品の組み
立てが容易となる。また、部品の高密度化ができ、装置
全体を小型化することができる。さらに、回路遮断素子
の浮遊容量や浮遊インダクタンスが低減され、高周波回
路にも用いることができるようになる。さらに、この発
明の回路遮断素子を製造する際、基板に対して導電性ペ
ーストや絶縁性ペーストの塗布／焼結によって構成部分
の殆どを製造することができるため、容易に大量生産す
ることができ、コストダウンが図れる。(g) Effects of the Invention As described above, according to the present invention, like other chip-type electronic components, it can be surface mounted on a circuit board without using lead terminals, and the components can be assembled on the circuit board. becomes easier. In addition, parts can be densely packed, and the entire device can be downsized. Furthermore, the stray capacitance and stray inductance of the circuit interrupting element are reduced, allowing it to be used in high frequency circuits. Furthermore, when manufacturing the circuit breaker element of the present invention, most of the constituent parts can be manufactured by applying conductive paste or insulating paste to the substrate and sintering it, so mass production is easy. , costs can be reduced.
第１図はこの発明の実施例である回路遮断素子の製造途
中における状態を表す斜視図、第２図は完成された回路
遮断素子の構造を表す断面図、第３図（Ａ）、 （Ｂ
）は同回路遮断素子の特性を表す図、第４図と第５図は
従来の回路遮断素子の構造を表す図である。
１一基板、２−絶縁膜、３−回路遮断配線部、７ａ、７
ｂ−外部接続用電極。Fig. 1 is a perspective view showing a state in the process of manufacturing a circuit breaker element according to an embodiment of the present invention, Fig. 2 is a sectional view showing the structure of a completed circuit breaker element, and Figs. 3 (A), (B).
) is a diagram showing the characteristics of the circuit breaker element, and FIGS. 4 and 5 are diagrams showing the structure of the conventional circuit breaker element. 1 - substrate, 2 - insulating film, 3 - circuit interrupting wiring section, 7a, 7
b-External connection electrode.
Claims (1)
合体からなる導電性ペーストを焼成して回路遮断配線部
を基板表面に形成してなる回路遮断素子において、 前記基板表面に前記熱溶融性絶縁性粒子と同質の絶縁膜
を設け、その膜上に前記回路遮断配線部を形成した回路
遮断素子。(1) In a circuit interrupting element in which a conductive paste made of a mixture of heat-melting insulating particles, conductive particles, and a binder is fired to form a circuit interrupting wiring portion on the surface of the substrate, the heat is applied to the surface of the substrate. A circuit interrupting element comprising an insulating film of the same quality as the meltable insulating particles, and the circuit interrupting wiring portion is formed on the insulating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP214587A JPS63170826A (en) | 1987-01-08 | 1987-01-08 | Circuit breaking element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP214587A JPS63170826A (en) | 1987-01-08 | 1987-01-08 | Circuit breaking element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170826A true JPS63170826A (en) | 1988-07-14 |
Family
ID=11521181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP214587A Pending JPS63170826A (en) | 1987-01-08 | 1987-01-08 | Circuit breaking element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170826A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0714491A (en) * | 1993-04-16 | 1995-01-17 | Avx Corp | High-voltage laminar thin-film fuse of type mounted on surface, and manufacture thereof |
| US5586014A (en) * | 1994-04-28 | 1996-12-17 | Rohm Co., Ltd. | Fuse arrangement and capacitor containing a fuse |
| US6768481B2 (en) | 1997-07-25 | 2004-07-27 | Seiko Epson Corporation | Display device and electronic equipment employing the same |
| JP2013505539A (en) * | 2009-09-16 | 2013-02-14 | リッテルフューズ，インコーポレイティド | Metal thin film surface mount fuse |
| JP2014002887A (en) * | 2012-06-18 | 2014-01-09 | Murata Mfg Co Ltd | Electronic component and method for manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4935043A (en) * | 1972-08-01 | 1974-04-01 | ||
| JPS55117201A (en) * | 1979-03-01 | 1980-09-09 | Tdk Electronics Co Ltd | Glazed ceramic substrate |
-
1987
- 1987-01-08 JP JP214587A patent/JPS63170826A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4935043A (en) * | 1972-08-01 | 1974-04-01 | ||
| JPS55117201A (en) * | 1979-03-01 | 1980-09-09 | Tdk Electronics Co Ltd | Glazed ceramic substrate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0714491A (en) * | 1993-04-16 | 1995-01-17 | Avx Corp | High-voltage laminar thin-film fuse of type mounted on surface, and manufacture thereof |
| US5586014A (en) * | 1994-04-28 | 1996-12-17 | Rohm Co., Ltd. | Fuse arrangement and capacitor containing a fuse |
| US6768481B2 (en) | 1997-07-25 | 2004-07-27 | Seiko Epson Corporation | Display device and electronic equipment employing the same |
| JP2013505539A (en) * | 2009-09-16 | 2013-02-14 | リッテルフューズ，インコーポレイティド | Metal thin film surface mount fuse |
| JP2014002887A (en) * | 2012-06-18 | 2014-01-09 | Murata Mfg Co Ltd | Electronic component and method for manufacturing the same |
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