JPS6317009A - Mold assembly - Google Patents

Abstract

PURPOSE:To eliminate the needs of full checking and recording by a manager for the management of molds and consequently facilitate the management of molds and, in addition, eliminate the generation of mis-recording by a method wherein at least the number of uses and preferably molding conditions such as working temperature, working pressure, repetition rate (cycle) and the like are memorized. CONSTITUTION:A mounting hole 3a, in which an IC memory 4 is mounted through heat insulating materials 5, is provided at a proper position, which does not affect the strength of an injection mold, the temperature distribution during use and the like, such as the side of a movable retainer plate 3, in the injection mold 1. the IC memory 4 consists of an IC chip 7, a cell 8 and connecting pins 9 and 9, all of which are arranged on a thin board 6, so as to connect the connecting pins 9 and 9 with the control device of an injection molder at the use of the mold 1. Number of uses and molding conditions such as temperature, pressure, repetition rate and the like in every use are memorized in the IC chip 7. Accordingly, the number of uses, working temperature, working pressure and the like of the particular mold can be known at any time by connecting the connecting pins 9 and 9 with a reader, which is equipped on the injection molder or prepared separately, so as to read the stored contents of the IC chip 7.

Description

[Detailed description of the invention] [Industrial application field] The present invention is applicable to casting processing, forging processing, drawing processing, pressing processing,
It relates to mold devices used in injection molding, extrusion molding, etc.

[Conventional technology]

In forging, casting, plastic molding, etc., a large number of molds of various shapes and sizes are created in advance according to the desired processing shape, and a number of molds are selected from among these molds according to each work. The desired mold is selected and used by attaching it to a processing device.

The desired shape and size differ depending on each job, and the molds used accordingly also differ, so the number of times each mold is used and the molding conditions used, such as temperature, pressure, and repetition rate (cycle), are different. It's coming.

As these molds repeatedly expand and contract with use, they become fatigued and their strength decreases, as well as their stiffness, so it is necessary to judge the degree of fatigue and replace them with new ones.

Therefore, it is necessary to manage a large number of types by checking and recording at least the total number of times each type has been used.

[Problem that the invention seeks to solve]

However, in order to manage this with conventional molds, for example, a number or symbol is attached to each mold, and the number or symbol is compared with the number or symbol recorded in the management book, and based on this, the number or symbol is checked. The administrator has to check and record each use, and there is a problem in that recording errors are likely to occur.

Furthermore, even if a computer is used to record and manage these data, checking the recorded data with the actual mold must be done manually, and the storage and recording of the mold must be done separately. Therefore, the verification process was extremely complicated, and the fatigue of the molds could hardly be discerned from the outside, so there was a problem with the reliability of the records.

[Means for solving problems]

In order to solve the above-mentioned problems, the present invention includes a built-in memory that can store at least the number of times of use.

In addition to the number of times of use, it is desirable to store molding conditions such as use temperature, use pressure, and repetition rate (cycle) in the memory.

[Effect]

By configuring as described above, molding conditions such as the number of times of use, temperature, pressure and repetition rate of use are automatically stored in each mold, and these can be read at any desired time using a simple reader. This is what happens.

With this method, the records of the history of molds are always kept together, so a wide variety of molds can be easily and reliably managed.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to the drawings.

Figure 1 is an explanatory diagram showing one embodiment of the present invention, Figure 2 is an IC
FIG. 2 is an explanatory diagram showing the configuration of a memory.

In Figures 1 and 2, 1 is an injection mold, 2 is a fixed side template, 3 is a movable side template, 3a is a mounting hole, 4 is an IC memory, 5 is a heat insulator, and 6 is an IC memory. board, 7 is an IC chip,
8 is a battery, and 9.9 is a connection pin.

Therefore, the injection mold l is placed at an appropriate position that does not affect its strength or temperature distribution during use, for example, the first
As shown in the figure, a mounting hole 3a large enough to mount an IC memory 4 is provided on the side of the movable template 3. It is attached.

The IC memory 4 includes an IC on a thin substrate 6, as shown in FIG.
A chip 7, a battery 8, and a connecting pin 9.9 are provided, and when the mold 1 is used, the connecting pin 9.9 is connected to a control device of an injection molding machine (not shown), and the IC is connected every - times of use.
The number of times and other molding conditions such as temperature, pressure and repetition rate are stored in the chip 7.

Therefore, by connecting the connecting pin 9.9 to a well-known reader equipped with the injection molding machine or separately prepared, and reading the memory contents of the IC chip 7, the number of times the mold has been used, the operating temperature, etc. can be determined at any time. It is possible to know the operating pressure, etc., thereby knowing the degree of fatigue of the mold, and managing the replacement period.

Note that the configuration of the present invention is not limited to the embodiments described above; for example, although an injection mold is shown in the embodiment, this may be applied to an extrusion mold, a casting mold, a forging mold, or a drawing mold. , a press mold, etc. (The present invention can be applied to any type of mold as long as the degree of fatigue increases depending on the frequency of use.

In addition, a ROM (e.g., EFROM (7) LSI chip is installed on the IC memory board 6, which stores the preferred molding conditions, pressure, temperature, repetition rate (cycle), etc. of the mold to be installed. By reading out the specified molding usage conditions stored in the molding machine and inputting them to the control side of the molding machine, the molding conditions can be set in the molding machine and the molding machine can be operated. Various configurations are possible, such as all of them being used as the above-mentioned IC chip.

〔Effect of the invention〕

Although the present invention is configured as described above, in accordance with the present invention, there is no need for an administrator to check and record each mold in order to manage the molds, which facilitates management and prevents recording errors. (It is what it is.

[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 is an explanatory diagram showing one embodiment of the present invention, and Fig. 2 is an explanatory diagram showing an embodiment of the present invention.
FIG. 2 is an explanatory diagram showing the configuration of a memory.

Claims (2)

[Claims] (1) A mold device characterized by having a built-in memory capable of storing at least the number of times of use. (2) The mold device according to claim 1, wherein the memory is capable of storing molding conditions such as usage temperature, usage pressure, and repetition rate in addition to the number of times the mold is used.