JPS63167768U - - Google Patents
Info
- Publication number
- JPS63167768U JPS63167768U JP6082587U JP6082587U JPS63167768U JP S63167768 U JPS63167768 U JP S63167768U JP 6082587 U JP6082587 U JP 6082587U JP 6082587 U JP6082587 U JP 6082587U JP S63167768 U JPS63167768 U JP S63167768U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- light emitting
- heat sink
- header
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6082587U JPS63167768U (pt) | 1987-04-22 | 1987-04-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6082587U JPS63167768U (pt) | 1987-04-22 | 1987-04-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63167768U true JPS63167768U (pt) | 1988-11-01 |
Family
ID=30893592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6082587U Pending JPS63167768U (pt) | 1987-04-22 | 1987-04-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63167768U (pt) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008258620A (ja) * | 2007-03-30 | 2008-10-23 | Seoul Semiconductor Co Ltd | 低い熱抵抗を有する発光ダイオードランプ |
-
1987
- 1987-04-22 JP JP6082587U patent/JPS63167768U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008258620A (ja) * | 2007-03-30 | 2008-10-23 | Seoul Semiconductor Co Ltd | 低い熱抵抗を有する発光ダイオードランプ |
EP1976032A3 (en) * | 2007-03-30 | 2009-11-25 | Seoul Semiconductor Co., Ltd. | Light emitting diode lamp with low thermal resistance |
JP2011216919A (ja) * | 2007-03-30 | 2011-10-27 | Seoul Semiconductor Co Ltd | 低い熱抵抗を有する発光ダイオードランプ |