JPS63167743U

JPS63167743U -

Info

Publication number: JPS63167743U
Application number: JP6033087U
Authority: JP
Priority date: 1987-04-21
Filing date: 1987-04-21
Publication date: 1988-11-01

Description

[Brief explanation of the drawing]

第１図はこの考案の一実施例によるフラツトベ
ース形半導体モジユールの取付け状態図、第２図
ａ，ｂはそれぞれ筒状のねじ挿入孔の金属板ベー
スへの取付け手順を示す説明図、第３図は樹脂ケ
ースの一部底面図、第４図〜第６図はそれぞれ従
来の半導体モジユールの平面図、正面図および側
面図、第７図は第４図の半導体モジユールにおけ
る樹脂ケースと金属板ベースとの取付孔構成図、
第８図は従来の半導体モジユールの放熱フインへ
の取付け構成図、第９図および第１０図はそれぞ
れ従来の他の半導体モジユールの平面図と正面図
、第１１図は第９図の半導体モジユールにおける
樹脂ケースと金属板ベースとの取付け構成図であ
る。１……金属板ベース、２……取付孔、３……樹
脂ケース、９……放熱フイン、１４……筒状のね
じ挿入孔、１５……金属製ねじ。なお、各図中同
一符号は同一又は相当部分を示す。 Fig. 1 is an installation diagram of a flat base type semiconductor module according to an embodiment of this invention, Figs. 2a and b are explanatory views showing the installation procedure of a cylindrical screw insertion hole to a metal plate base, and Fig. 3 is a partial bottom view of the resin case, FIGS. 4 to 6 are a plan view, front view, and side view of a conventional semiconductor module, respectively, and FIG. 7 is a diagram showing the resin case and metal plate base of the semiconductor module in FIG. Mounting hole configuration diagram,
FIG. 8 is a configuration diagram of a conventional semiconductor module attached to a heat dissipation fin, FIGS. 9 and 10 are a plan view and a front view of other conventional semiconductor modules, respectively, and FIG. 11 is a diagram of the semiconductor module in FIG. 9. FIG. 3 is a configuration diagram of the attachment of the resin case and the metal plate base. DESCRIPTION OF SYMBOLS 1...Metal plate base, 2...Mounting hole, 3...Resin case, 9...Radiation fin, 14...Cylindrical screw insertion hole, 15...Metal screw. Note that the same reference numerals in each figure indicate the same or equivalent parts.

補正昭６２．１０．９実用新案登録請求の範囲を次のように補正する
。Amendment October 9, 1982 The scope of claims for utility model registration is amended as follows.

【実用新案登録請求の範囲】半導体モジユールをねじ固定する取付孔を有す
る金属板ベースと、この取付孔に対応するねじ挿
入孔を有する半導体モジユールの樹脂ケースとを
備えたフラツトベース形半導体モジユールにおい
て、上記樹脂ケースと一体成形したねじ挿入孔が
筒状体であり、このねじ挿入孔が金属板ベースの
取付孔に挿入され、ねじ挿入孔の下端が取付孔に
カシメ加工されて固定され、上記ねじ挿入孔に金
属製のねじを挿入して放熱フインに固定可能にし
たことを特徴とするフラツトベース形半導体モジ
ユール。[Scope of Claim for Utility Model Registration] A flat base type semiconductor module comprising a metal plate base having a mounting hole for fixing the semiconductor module with screws, and a resin case for the semiconductor module having a screw insertion hole corresponding to the mounting hole, The screw insertion hole integrally molded with the resin case is cylindrical, and this screw insertion hole is inserted into the mounting hole of the metal plate base, and the lower end of the screw insertion hole is caulked into the mounting hole and fixed, and the screw is inserted. A flat base type semiconductor module characterized in that it can be fixed to a heat dissipation fin by inserting a metal screw into the hole.

Claims

[Scope of utility model registration request]

A flat base type semiconductor module comprising a metal plate base having a mounting hole for fixing the semiconductor module with a screw, and a resin case of the semiconductor module having a screw insertion hole corresponding to the mounting hole, the screw insertion being integrally molded with the resin case. The hole is cylindrical, this screw insertion hole is inserted into the mounting hole of the metal plate base, the lower end of the screw insertion hole is caulked and fixed to the mounting hole, and the metal screw is inserted into the screw insertion hole. A flat base type semiconductor module characterized by a resin case fixed to a heat dissipation fin.