JPS63167743U - - Google Patents

Info

Publication number

JPS63167743U

JPS63167743U JP6033087U JP6033087U JPS63167743U JP S63167743 U JPS63167743 U JP S63167743U JP 6033087 U JP6033087 U JP 6033087U JP 6033087 U JP6033087 U JP 6033087U JP S63167743 U JPS63167743 U JP S63167743U

Authority

JP

Japan

Prior art keywords

semiconductor module

screw insertion

mounting hole

resin case

screw

Prior art date

1987-04-21

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 14
• 238000003780 insertion Methods 0.000 claims description 11
• 230000037431 insertion Effects 0.000 claims description 11
• 239000002184 metal Substances 0.000 claims description 11
• 239000011347 resin Substances 0.000 claims description 9
• 229920005989 resin Polymers 0.000 claims description 9
• 230000017525 heat dissipation Effects 0.000 claims description 3
• 238000010586 diagram Methods 0.000 description 6
• 238000009434 installation Methods 0.000 description 2
• 230000005855 radiation Effects 0.000 description 1