JPS63167742U - - Google Patents
Info
- Publication number
- JPS63167742U JPS63167742U JP1987060208U JP6020887U JPS63167742U JP S63167742 U JPS63167742 U JP S63167742U JP 1987060208 U JP1987060208 U JP 1987060208U JP 6020887 U JP6020887 U JP 6020887U JP S63167742 U JPS63167742 U JP S63167742U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- substrate
- semiconductor device
- thickness
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987060208U JPS63167742U (ro) | 1987-04-21 | 1987-04-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987060208U JPS63167742U (ro) | 1987-04-21 | 1987-04-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63167742U true JPS63167742U (ro) | 1988-11-01 |
Family
ID=30892417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987060208U Pending JPS63167742U (ro) | 1987-04-21 | 1987-04-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63167742U (ro) |
-
1987
- 1987-04-21 JP JP1987060208U patent/JPS63167742U/ja active Pending