JPS63167741U - - Google Patents
Info
- Publication number
- JPS63167741U JPS63167741U JP6032887U JP6032887U JPS63167741U JP S63167741 U JPS63167741 U JP S63167741U JP 6032887 U JP6032887 U JP 6032887U JP 6032887 U JP6032887 U JP 6032887U JP S63167741 U JPS63167741 U JP S63167741U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor module
- heat
- heat dissipation
- insulated
- heat sinks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000005192 partition Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6032887U JPS63167741U (fi) | 1987-04-21 | 1987-04-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6032887U JPS63167741U (fi) | 1987-04-21 | 1987-04-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63167741U true JPS63167741U (fi) | 1988-11-01 |
Family
ID=30892646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6032887U Pending JPS63167741U (fi) | 1987-04-21 | 1987-04-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63167741U (fi) |
-
1987
- 1987-04-21 JP JP6032887U patent/JPS63167741U/ja active Pending