JPS63167735U - - Google Patents
Info
- Publication number
- JPS63167735U JPS63167735U JP6121687U JP6121687U JPS63167735U JP S63167735 U JPS63167735 U JP S63167735U JP 6121687 U JP6121687 U JP 6121687U JP 6121687 U JP6121687 U JP 6121687U JP S63167735 U JPS63167735 U JP S63167735U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- metal plate
- circuit element
- sealing frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6121687U JPH0414934Y2 (US20100268047A1-20101021-C00003.png) | 1987-04-21 | 1987-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6121687U JPH0414934Y2 (US20100268047A1-20101021-C00003.png) | 1987-04-21 | 1987-04-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63167735U true JPS63167735U (US20100268047A1-20101021-C00003.png) | 1988-11-01 |
| JPH0414934Y2 JPH0414934Y2 (US20100268047A1-20101021-C00003.png) | 1992-04-03 |
Family
ID=30894345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6121687U Expired JPH0414934Y2 (US20100268047A1-20101021-C00003.png) | 1987-04-21 | 1987-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414934Y2 (US20100268047A1-20101021-C00003.png) |
-
1987
- 1987-04-21 JP JP6121687U patent/JPH0414934Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0414934Y2 (US20100268047A1-20101021-C00003.png) | 1992-04-03 |
