JPS63166432U - - Google Patents
Info
- Publication number
- JPS63166432U JPS63166432U JP6004787U JP6004787U JPS63166432U JP S63166432 U JPS63166432 U JP S63166432U JP 6004787 U JP6004787 U JP 6004787U JP 6004787 U JP6004787 U JP 6004787U JP S63166432 U JPS63166432 U JP S63166432U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- heating element
- power supply
- common power
- emitters
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electronic Switches (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6004787U JPS63166432U (fi) | 1987-04-21 | 1987-04-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6004787U JPS63166432U (fi) | 1987-04-21 | 1987-04-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63166432U true JPS63166432U (fi) | 1988-10-28 |
Family
ID=30892111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6004787U Pending JPS63166432U (fi) | 1987-04-21 | 1987-04-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63166432U (fi) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0396357A (ja) * | 1989-09-08 | 1991-04-22 | Graphtec Corp | サーマルヘッド |
JPH0414661A (ja) * | 1990-05-08 | 1992-01-20 | Sony Corp | カセットローディング機構 |
-
1987
- 1987-04-21 JP JP6004787U patent/JPS63166432U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0396357A (ja) * | 1989-09-08 | 1991-04-22 | Graphtec Corp | サーマルヘッド |
JPH0414661A (ja) * | 1990-05-08 | 1992-01-20 | Sony Corp | カセットローディング機構 |