JPS63165877U - - Google Patents
Info
- Publication number
- JPS63165877U JPS63165877U JP5890287U JP5890287U JPS63165877U JP S63165877 U JPS63165877 U JP S63165877U JP 5890287 U JP5890287 U JP 5890287U JP 5890287 U JP5890287 U JP 5890287U JP S63165877 U JPS63165877 U JP S63165877U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating film
- wiring board
- multilayer wiring
- circuit patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987058902U JPH0534138Y2 (US07754267-20100713-C00017.png) | 1987-04-17 | 1987-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987058902U JPH0534138Y2 (US07754267-20100713-C00017.png) | 1987-04-17 | 1987-04-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63165877U true JPS63165877U (US07754267-20100713-C00017.png) | 1988-10-28 |
| JPH0534138Y2 JPH0534138Y2 (US07754267-20100713-C00017.png) | 1993-08-30 |
Family
ID=30889893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987058902U Expired - Lifetime JPH0534138Y2 (US07754267-20100713-C00017.png) | 1987-04-17 | 1987-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0534138Y2 (US07754267-20100713-C00017.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004214586A (ja) * | 2002-11-14 | 2004-07-29 | Kyocera Corp | 多層配線基板 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5578585A (en) * | 1978-12-07 | 1980-06-13 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPS5792896A (en) * | 1980-12-02 | 1982-06-09 | Matsushita Electric Ind Co Ltd | Multilayer printed circuit board with conductor in inner layer |
| JPS5998597A (ja) * | 1983-11-02 | 1984-06-06 | 松下電器産業株式会社 | 多層プリント配線板 |
| JPS6124298A (ja) * | 1984-07-12 | 1986-02-01 | 富士通株式会社 | 多層プリント板の製造方法 |
-
1987
- 1987-04-17 JP JP1987058902U patent/JPH0534138Y2/ja not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5578585A (en) * | 1978-12-07 | 1980-06-13 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPS5792896A (en) * | 1980-12-02 | 1982-06-09 | Matsushita Electric Ind Co Ltd | Multilayer printed circuit board with conductor in inner layer |
| JPS5998597A (ja) * | 1983-11-02 | 1984-06-06 | 松下電器産業株式会社 | 多層プリント配線板 |
| JPS6124298A (ja) * | 1984-07-12 | 1986-02-01 | 富士通株式会社 | 多層プリント板の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004214586A (ja) * | 2002-11-14 | 2004-07-29 | Kyocera Corp | 多層配線基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0534138Y2 (US07754267-20100713-C00017.png) | 1993-08-30 |
