JPS63165869U - - Google Patents
Info
- Publication number
- JPS63165869U JPS63165869U JP5979287U JP5979287U JPS63165869U JP S63165869 U JPS63165869 U JP S63165869U JP 5979287 U JP5979287 U JP 5979287U JP 5979287 U JP5979287 U JP 5979287U JP S63165869 U JPS63165869 U JP S63165869U
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- board
- hole
- notch
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5979287U JPS63165869U (US07860544-20101228-C00003.png) | 1987-04-20 | 1987-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5979287U JPS63165869U (US07860544-20101228-C00003.png) | 1987-04-20 | 1987-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63165869U true JPS63165869U (US07860544-20101228-C00003.png) | 1988-10-28 |
Family
ID=30891618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5979287U Pending JPS63165869U (US07860544-20101228-C00003.png) | 1987-04-20 | 1987-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63165869U (US07860544-20101228-C00003.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0689771A (ja) * | 1992-09-08 | 1994-03-29 | Maruwa Seisakusho:Kk | フレキシブル印刷配線板付金属成形品及びその製造方法 |
| JP2004521281A (ja) * | 2000-12-15 | 2004-07-15 | シーメンス ヴィディーオー オートモーティヴ コーポレイション | メカトロニクスセンサーの組立て方法 |
| JP2013045796A (ja) * | 2011-08-22 | 2013-03-04 | Yazaki Corp | 配線基板 |
| KR200465926Y1 (ko) * | 2010-12-23 | 2013-03-18 | 자원전자 주식회사 | 교차 결합구조를 갖는 피씨비 어셈블리 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60100495A (ja) * | 1983-11-07 | 1985-06-04 | キヤノン株式会社 | 電子部品の実装方法 |
-
1987
- 1987-04-20 JP JP5979287U patent/JPS63165869U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60100495A (ja) * | 1983-11-07 | 1985-06-04 | キヤノン株式会社 | 電子部品の実装方法 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0689771A (ja) * | 1992-09-08 | 1994-03-29 | Maruwa Seisakusho:Kk | フレキシブル印刷配線板付金属成形品及びその製造方法 |
| JP2004521281A (ja) * | 2000-12-15 | 2004-07-15 | シーメンス ヴィディーオー オートモーティヴ コーポレイション | メカトロニクスセンサーの組立て方法 |
| KR200465926Y1 (ko) * | 2010-12-23 | 2013-03-18 | 자원전자 주식회사 | 교차 결합구조를 갖는 피씨비 어셈블리 |
| JP2013045796A (ja) * | 2011-08-22 | 2013-03-04 | Yazaki Corp | 配線基板 |
| CN103843468A (zh) * | 2011-08-22 | 2014-06-04 | 矢崎总业株式会社 | 安装有部件的布线板 |
