JPS63165067A - Method and device for soldering - Google Patents

Abstract

PURPOSE:To improve the quality of a joining part by forming the pumping container of a solder in U pipe shape and providing the difference in the heights at upward both ends of container thereof. CONSTITUTION:A solder pumping up container 2 is formed in U pipe shape and a difference in the height of the upward facing both ends 2a and 2b in U pipe shape is provided. After removing the oxide on the upper face of the solder 3 inside a solder tank 1 by a scraper a solder 3 is filled up in the container 2 by sinking the container 2 in the solder 3. A soldering is then performed by lifting the container 2 and a soldering joining part is dipped in the pipe port 2c of lower part. In this case, the oxide unable to be removed by the scraper and that existed on the upper face of the 1st pipe port 2c are completely removed. The quality of the joining part is thus improved because of impurities being eliminated on the solder joining part.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a pump-up soldering method and an apparatus therefor, and in particular to a method for using small protrusions that can effectively remove oxides generated on the upper surface of solder. This article relates to a soldering method and device suitable for soldering.

(Prior art) Conventionally, in order to automatically solder thin uneven parts such as terminals of small coil windings, molten solder was pumped up from a solder bath with a small ladle-shaped container and applied to the parts to be joined. Soldering is done by dipping.

FIG. 3 is a cross-sectional view of an example of such a device, and FIG.
FIG. 2 is a perspective view of the device shown in the figure, showing only essential parts.

As shown in the figure, the peripheral walls and bottom of the solder bath 1 are covered with a panel 1b in which a cylindrical heater 1a is incorporated.

Solder is placed inside a solder bath 1 and heated by a heater 1a to melt the solder. Inside the molten solder 3,
A small container 12 made of ceramic or metal is inserted, filled with molten solder 3, and pulled out. Note that this figure shows the lifting amount in a large scale, but in reality, the container 1
In order to prevent the solder inside 2 from cooling, the bottom of the container 12 is often immersed in a bath.

The part to be soldered to the solder 3 inside the container 12, for example, the winding terminal pin 14a of the coil bobbin 14
immerse and solder.

The surface of the melted solder 3 is in contact with air, and is further heated to a high temperature to form a large amount of oxide. These oxides not only make the soldering look ugly, but also cause molten solder3.
This impairs heat conduction from to the joint.

Therefore, a stainless steel scraper 5 is generally used to remove the oxides on the surface.

(Problems to be Solved by the Invention) In the conventional soldering method using a solder bath as described above, in order to remove oxides generated on the surface of molten solder,
A scraper 5 is used as shown in FIG.

If the scraper 5 is moved while the pumping container 12 that pumps up the molten solder 3 is submerged in the solder bath, the entire upper surface of the molten solder 3 cannot be scraped up because the supporting portion 12e of the pumping container 12 gets in the way. However, oxides will remain in some areas.

Further, if the scraper 5 is moved to remove oxides on the surface and then the pumping container 12 is submerged in the solder 3 in the solder bath, a small amount of oxides will begin to be generated during that time.

Furthermore, when the pumping container 12 is submerged in the solder bath, the oxides removed by the scraper 5 draw in a wide range of solder on the surface, so there is a risk that the oxides may get mixed in. In any case, it is difficult to completely remove the oxides on the surface. There is a problem.

The purpose of the present invention is to solve these problems and to remove oxides generated on the upper surface of molten solder more efficiently than conventional methods during soldering in which molten solder is pumped up from a solder bath and dipped into the soldering area. An object of the present invention is to provide a soldering method and apparatus that can be removed.

(Means for Solving the Problems) In order to achieve the above object, the soldering method according to the present invention involves pumping up the solder 3 in a molten state from the solder bath 1 and immersing the parts to be joined. In the soldering method to be carried out, the pumping container 2 for pumping up the solder 3 is shaped like a 0-shaped tube, and the heights of the upwardly facing ends 2a and 2b of the pumping container 2 are different, and the lower end 2a
The opening located at is the first opening 2C, and the higher end 2b
The opening in the pumping container 2 is defined as the second opening 2d.
is entirely submerged in the molten solder 3 of the solder bath 1 and then pulled up, and molten solder corresponding to the difference in height between the first opening 2c and the second opening 2d flows from the first opening 2c. Immediately after overflowing, the part to be joined is inserted into the first opening 2C and immersed in the molten solder 3.

Further, the soldering device according to the present invention is a device that performs soldering by pumping up the solder 3 in a molten state from the solder bath 1 and immersing the parts to be joined, in which the pumping container 2 for pumping up the solder 3 is operated at zero temperature. It is shaped like a tube, and the heights of the upwardly facing ends 2a and 2b of the pumping container 2 are different, and the lower opening 2c of the openings at both ends 2a and 2b of the pumping container 2 that communicate with the inside of the container is , the structure is such that the part to be soldered is inserted into the insertion port for immersion in the solder 3.

(Example) Next, an example according to the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing essential parts of an embodiment of a soldering apparatus according to the present invention.

FIG. 2 is a sectional view showing various modifications of the pumping container 2 for pumping up the molten solder 3 used in the embodiment of FIG.

The solder bath 1 shown in FIG. 1 is generally surrounded by a wall and a bottom made up of a panel 1b incorporating a heater 1a, as conventionally known, and heats the solder 3 to a molten state at an appropriate temperature.

The feature of this embodiment lies in the shape of the pumping container 2 that pumps up the molten solder 3.

The pumping container 2 is shown in FIGS. 1 and 2 (a) and (b).
l.

(C1, (dl) has a U-shaped tubular shape, and has a difference in height between the upwardly facing ends 2a and 2b of the U-shaped tubular shape.

Now, connect the opening of the 0-shaped tube at the lower end 2a to the first
The pipe port at the higher end 2b is the second pipe port 2d, and the lower pipe port (first pipe port 2c) is the insertion port for the joint to be soldered.

The first pipe port 2C and the second pipe port 2d are connected by a U-shaped pipe 2u, and if the inside of the container 2 is filled with a fluid such as molten solder 3, the second pipe port 2
The upper surface of the solder 3 in d is lowered to the position of the upper end 2a of the first pipe port, and an amount corresponding to the volume inside the second pipe port 2d corresponding to the difference in height between both ends 2b and 2a of the pumping container 2 is applied. The solder 3 overflows from the first pipe port 2C.

Next, how to use this embodiment will be explained.

First, the solder bath 1 is heated by the heater 1a, and the solder 3
to a molten state at an appropriate temperature.

Next, the oxide on the top surface of the solder is removed by a conventionally known method using a scraper (not shown), and then the pumping container 2 is lowered to the position shown by the two-dot chain line in FIG. 1, and the solder 3 is filled in the pumping container 2. .

Next, the pumping container 2 is pulled up to the position shown by the solid line in FIG. 1, and the joint to be soldered is inserted into the first pipe port 2C as shown in the figure and soldered.

FIG. 1 shows a situation in which the terminal pin of the coil winding and the tangled portion of the end of the winding are soldered in this manner.

Note that in this figure, the lifting amount of the container 2 is exaggerated, but in order to prevent the solder inside from cooling, the 2u
It is preferable to use this part while it is immersed in solder.

By soldering in this way, oxides that could not be removed with a scraper (not shown) can be removed from the first pipe port 2C and the second pipe port 2d when the pumping container 2 is pulled up from the solder bath 1. When the solder corresponding to the height difference flows out from the first pipe port 2C, the slight amount of oxide on the top surface of the first pipe port 2C is also completely flowed out, so it is always clean and free of oxides. The solder side is immersed in the joint,
Able to perform highly reliable soldering.

Note that since the oxide is removed immediately before soldering, it is not necessary to remove the oxide on the top surface of the solder in the solder bath using a scraper every time soldering is performed.

In addition, in order to increase the amount of solder flowing out from the first pipe port 2c, as shown in Figs. 1 and 2 (b), (C1゜(
As shown in d), the second opening area may be made larger than the opening area of the first pipe port 2C.

Figure 2 (Al pumping container 2 is a U-shaped vibrator,
Since they all have the same diameter, it is necessary to make a larger difference in height between the ends 2a and 2b than in other cases.
The structure is the simplest.

Figure 2 is (b), (C1, (d) is the first pipe port 2C
This part is made into a cylindrical or box shape to match the shape of the joint to be soldered, and +d) in the same figure is a U-shaped pipe connecting the first pipe port 2C and the second pipe port 2d. The portion 2u is modified and connected with a straight pipe to reduce the overall height of the pumping container.

In addition, various modifications can be considered to the shape of the pumping container 2, but any of them may be used as long as they comply with the gist of the present invention.

(Effects of the Invention) As explained above, the present invention provides a soldering method and apparatus in which molten solder is pumped up from a solder bath and a joint part is immersed in the solder for soldering. is shaped like a U-shaped tube, with a difference in height between the two upward ends of the pumping container, and by inserting a joint into the pipe opening at the lower end, the oxides generated on the top surface of the solder can be pumped out of the container. Let it flow out;
The joint can always be immersed in clean, impurity-free solder.

Therefore, the soldering obtained by such a method and apparatus has higher reliability than ever before, and also has effects such as a beautiful appearance.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing essential parts of an embodiment of a soldering apparatus according to the present invention. , FIG. 2 is a sectional view showing a modification of the pumping container used in the embodiment of FIG. 1. FIG. 3 is a sectional view showing the main parts of an example of a conventional soldering device. FIG. 4 is a perspective view showing essential parts of the conventional example shown in FIG. 1...Solder bath 1a...Solder bath heater 1b...Solder bath heating panel 2.12...Pumping containers 2a, 2b...Upward end of pumping container 2C...
First pipe port 2d...Second pipe port 2e, 12e...Support part 2u of pumping container...U
Shape tube part 3... Solder 4.14... Winding coils 4a, 4b... Winding terminal pin 5... Scraper Patent applicant Tanaka Seiki Co., Ltd. agent Patent attorney Hisashi Inoro/l- Figure 1 Figure 2

Claims (2)

[Claims] (1) In a soldering method in which soldering is performed by pumping up molten solder from a solder bath and immersing the parts to be joined, the pumping container for pumping up the solder is shaped like a U-shaped tube, and the top of the pumping container is Make a difference in height between the two ends facing the same direction, and use the opening at the lower end as the first opening and the opening at the higher end as the second opening, and solder the entire pumping container. After being submerged in molten solder in a tank, the first opening and the second opening are removed.
Immediately after molten solder corresponding to the height of the opening overflows from the first opening, the part to be joined is inserted into the first opening and soldered by immersing it in the molten solder. A soldering method characterized by: (2) In a device that performs soldering by pumping up molten solder from a solder bath and immersing the parts to be joined, the pumping container for pumping up the solder is shaped like a U-shaped tube, and the top of the pumping container is directed upward. The lower opening of the openings at both ends of the pumping container communicating with the inside of the container is used as an insertion port into which the part to be soldered is inserted for immersion in the solder. A soldering device characterized by: