JPS6316482U - - Google Patents
Info
- Publication number
- JPS6316482U JPS6316482U JP11112486U JP11112486U JPS6316482U JP S6316482 U JPS6316482 U JP S6316482U JP 11112486 U JP11112486 U JP 11112486U JP 11112486 U JP11112486 U JP 11112486U JP S6316482 U JPS6316482 U JP S6316482U
- Authority
- JP
- Japan
- Prior art keywords
- via hole
- conductor circuit
- layer
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 239000012212 insulator Substances 0.000 claims description 3
- 239000002952 polymeric resin Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11112486U JPS6316482U (US06168776-20010102-C00028.png) | 1986-07-18 | 1986-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11112486U JPS6316482U (US06168776-20010102-C00028.png) | 1986-07-18 | 1986-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6316482U true JPS6316482U (US06168776-20010102-C00028.png) | 1988-02-03 |
Family
ID=30990758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11112486U Pending JPS6316482U (US06168776-20010102-C00028.png) | 1986-07-18 | 1986-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6316482U (US06168776-20010102-C00028.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02281693A (ja) * | 1989-04-21 | 1990-11-19 | Matsushita Electric Works Ltd | 多層配線板の製造方法 |
| JPH02281692A (ja) * | 1989-04-21 | 1990-11-19 | Matsushita Electric Works Ltd | 多層配線板 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5183162A (ja) * | 1975-01-18 | 1976-07-21 | Nippon Electric Co | Tasopurintohaisenban |
| JPS53123868A (en) * | 1977-04-04 | 1978-10-28 | Hitachi Ltd | Method of producing multilayer printed circuit board provided with multiple through holes |
| JPS6151779B2 (US06168776-20010102-C00028.png) * | 1979-01-31 | 1986-11-10 | Canon Kk |
-
1986
- 1986-07-18 JP JP11112486U patent/JPS6316482U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5183162A (ja) * | 1975-01-18 | 1976-07-21 | Nippon Electric Co | Tasopurintohaisenban |
| JPS53123868A (en) * | 1977-04-04 | 1978-10-28 | Hitachi Ltd | Method of producing multilayer printed circuit board provided with multiple through holes |
| JPS6151779B2 (US06168776-20010102-C00028.png) * | 1979-01-31 | 1986-11-10 | Canon Kk |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02281693A (ja) * | 1989-04-21 | 1990-11-19 | Matsushita Electric Works Ltd | 多層配線板の製造方法 |
| JPH02281692A (ja) * | 1989-04-21 | 1990-11-19 | Matsushita Electric Works Ltd | 多層配線板 |
