JPS63164397A - Manufacture of multilayer printed interconnection board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a multilayer printed wiring board, and in particular, a multilayer printed wiring board suitable for laminating an outer layer base material in which a conductor circuit pattern is provided on the outermost layer in advance. Relating to a manufacturing method.

[Conventional technology]

A general manufacturing method for a conventional multilayer printed wiring board is shown in FIG. After interposing the inner layer laminate 6 with conductor circuit patterns formed on both sides of the insulating layer 5 in advance and a layer of prepreg 7 to form a laminate structure, the upper and lower parts are directly heated and pressed using a laminate mold 8 to be integrated. It is chemically molded. However, the pressure during lamination is concentrated on the outermost conductive circuit pattern 1, as shown in FIG. 4 as a multilayered substrate 30 after lamination.

There was a defect in that the laminate 3 was corrugated by the thickness of the conductive circuit pattern 1.

As a countermeasure against this, for example, as described in Japanese Patent Application Laid-open No. 60-241295, the upper and lower portions of the laminated body.

There is a method in which a heat-resistant rubber sheet is inserted into a releasable film, and the heat-resistant rubber sheet is integrally molded by heating and pressurizing, and then the releasable film is removed from the heat-resistant rubber sheet.

[Problem that the invention seeks to solve]

In the method of using a releasable film with a heat-resistant rubber sheet interposed therein, the outer layer surface that does not require pre-adhesion treatment is processed (soft etching, oxide film formation, etc.), which wastes processing liquid. There is a problem of shortening the life of the sump liquid. Also,
Both the release film and the heat-resistant rubber sheet are consumables, and there is also the problem of increased costs due to the wasteful work of inserting and removing them before and after adhesion.

[Means for solving problems]

The present invention is characterized in that a solder resist is applied in advance on the conductor circuit pattern of the outermost layer of the laminated body, and the solder resist coated surface is placed facing outward and heated and pressurized.

[For production]

By applying a solder resist in advance on the conductor circuit pattern of the outermost layer of the laminated body, only the inner layer surface that requires pre-adhesion treatment is treated, thereby eliminating wasteful consumption of treatment liquid and extending the life. Further, even if the laminated bodies are integrated by heating and pressurizing them using a direct lamination press machine, the pressure is evenly transmitted to the entire surface of the laminated bodies.

This makes it possible to prevent the outermost layer of the laminate from waving, and also to save the effort of inserting and removing the heat-resistant rubber sheet from the release film.

(Embodiment) An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 is a sectional view showing the laminated structure of a six-layer printed wiring board. First, conductor circuit patterns 1 and 4 are formed on both sides of each insulating layer 2 and 5 to form a laminate 3°6, and then solder resist 9 is applied to the outer layer surfaces of the pair of laminates 3 by screen printing and dried. First, laminates 3 and 6
In this case, since the solder resist 9 is applied to the outer layer surface which does not require pre-treatment, only the inner layer pattern is processed. A pair of laminate plates 3 coated with solder resist 9 are arranged with the laminate plate 6 on which the pattern 4 is formed in the center, with the solder resist coated surfaces facing outward. In this state, using a laminating press machine, the whole laminated mold 8 is heated and pressurized directly to integrally mold.

FIG. 2 shows a cross-sectional view of the multilayered board after lamination, and the multilayer printed wiring board 20 can eliminate the wavy state like the multilayer printed wiring board 30 shown in FIG. The outermost layer laminate 3 can be formed evenly.

(Effects of the Invention) As is clear from the above description, according to the present invention, by applying a solder resist in advance on the conductor circuit pattern of the outermost layer of the laminated body, it is possible to perform soft etching, oxide film formation, etc. before adhesion. Since the treatment is applied only to the necessary inner layer surfaces, unnecessary consumption of treatment liquid is eliminated, and the outermost layer of the laminate can be formed flat.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing the laminated structure of the multilayer printed wiring board according to the present invention, FIG. 2 is a cross-sectional view of the multilayered board after lamination shown in FIG. 1, and FIG. 3 is the laminated structure of the conventional multilayer printed wiring board. FIG. 4 is a cross-sectional view of the multilayered substrate shown in FIG. 3 after lamination. 1.4... Conductor circuit pattern, 2,5... Insulating layer, 3.6... Laminate board, 7... Prepreg, 8...
・Laminated mold, 9...Solder resist. Figure 1 Figure 2 Figure 9 yn-day resist

Claims (1)

[Claims] (1) After applying a solder resist on the conductor circuit pattern on each one side of a pair of laminates having a conductor circuit pattern formed on at least one side in advance, place the solder resist coated side facing outside as the outermost layer, and place the solder resist on the outermost layer, and 1. A method for manufacturing a multilayer printed wiring board, which comprises interposing one or more sets of a laminate and a prepreg layer on which a conductive circuit pattern has been formed in advance to form a laminate structure, and integrating the laminate by heating and pressing.