JPS63164243U - - Google Patents
Info
- Publication number
- JPS63164243U JPS63164243U JP5591187U JP5591187U JPS63164243U JP S63164243 U JPS63164243 U JP S63164243U JP 5591187 U JP5591187 U JP 5591187U JP 5591187 U JP5591187 U JP 5591187U JP S63164243 U JPS63164243 U JP S63164243U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead terminals
- lead terminal
- soldered portion
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5591187U JPS63164243U (ro) | 1987-04-15 | 1987-04-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5591187U JPS63164243U (ro) | 1987-04-15 | 1987-04-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63164243U true JPS63164243U (ro) | 1988-10-26 |
Family
ID=30884248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5591187U Pending JPS63164243U (ro) | 1987-04-15 | 1987-04-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63164243U (ro) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0567010U (ja) * | 1992-02-10 | 1993-09-03 | アイワ株式会社 | 面実装電子部品 |
-
1987
- 1987-04-15 JP JP5591187U patent/JPS63164243U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0567010U (ja) * | 1992-02-10 | 1993-09-03 | アイワ株式会社 | 面実装電子部品 |