JPS63164221U - - Google Patents
Info
- Publication number
- JPS63164221U JPS63164221U JP5773287U JP5773287U JPS63164221U JP S63164221 U JPS63164221 U JP S63164221U JP 5773287 U JP5773287 U JP 5773287U JP 5773287 U JP5773287 U JP 5773287U JP S63164221 U JPS63164221 U JP S63164221U
- Authority
- JP
- Japan
- Prior art keywords
- conductor base
- metal conductor
- semiconductor device
- matching substrate
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 8
- 239000003989 dielectric material Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5773287U JPS63164221U (enrdf_load_stackoverflow) | 1987-04-15 | 1987-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5773287U JPS63164221U (enrdf_load_stackoverflow) | 1987-04-15 | 1987-04-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63164221U true JPS63164221U (enrdf_load_stackoverflow) | 1988-10-26 |
Family
ID=30887701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5773287U Pending JPS63164221U (enrdf_load_stackoverflow) | 1987-04-15 | 1987-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63164221U (enrdf_load_stackoverflow) |
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1987
- 1987-04-15 JP JP5773287U patent/JPS63164221U/ja active Pending