JPS63164148A - Fluorescent character display tube and its manfuacture - Google Patents
Fluorescent character display tube and its manfuactureInfo
- Publication number
- JPS63164148A JPS63164148A JP30964486A JP30964486A JPS63164148A JP S63164148 A JPS63164148 A JP S63164148A JP 30964486 A JP30964486 A JP 30964486A JP 30964486 A JP30964486 A JP 30964486A JP S63164148 A JPS63164148 A JP S63164148A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- insulating
- substrate
- anode
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 82
- 238000007789 sealing Methods 0.000 claims abstract description 23
- 239000004020 conductor Substances 0.000 claims description 35
- 239000011521 glass Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
- 239000005394 sealing glass Substances 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229910019589 Cr—Fe Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は蛍光表示管に関し、特に表示部の駆動回路を真
空容器内部に内臓した構造を有する蛍光表示管に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a fluorescent display tube, and more particularly to a fluorescent display tube having a structure in which a drive circuit for a display section is housed inside a vacuum container.
従来、蛍光表示管の表示部の駆動回路は、真空容器外に
設けられ蛍光表示管の外部端子に接続して使用されてい
たが、表示部の駆動回路を真空容器内に内臓したチップ
イングラス構造を有する蛍光表示管が開発され実用化さ
れるようになった。Conventionally, the drive circuit for the display section of a fluorescent display tube was installed outside the vacuum container and connected to the external terminal of the fluorescent display tube, but chip-in-glass technology has built the drive circuit for the display section inside the vacuum container. A fluorescent display tube with this structure has been developed and put into practical use.
第6図は従来の蛍光表示管の一例を示す斜視図である。FIG. 6 is a perspective view showing an example of a conventional fluorescent display tube.
陽極基板1上に表示部とICチップ13から成る駆動回
路が設けられているが、この構造では陽極2によって構
成される表示部と駆動回路用ICチップ13の搭載部が
陽極基板1上に配置されているため陽極基板1全体の面
積に占る表示部の領域が小さくなり表示部の領域に対し
非常に大型の蛍光表示管となり品質価値を十分高めるこ
とが出来ない結果となっていた。これらの問題を解決す
るために、陽極基板lと対向して配置されている絶縁基
板8内面にICチップ13を搭載し各々の基板上の配線
を種々の方法で接続する試みがなされている。A drive circuit consisting of a display section and an IC chip 13 is provided on the anode substrate 1. In this structure, the display section constituted by the anode 2 and the mounting section of the drive circuit IC chip 13 are arranged on the anode substrate 1. As a result, the area of the display section in the entire area of the anode substrate 1 becomes small, resulting in a fluorescent display tube that is extremely large compared to the area of the display section, and the quality value cannot be sufficiently increased. In order to solve these problems, attempts have been made to mount an IC chip 13 on the inner surface of an insulating substrate 8 placed opposite to the anode substrate 1, and to connect the wiring on each substrate using various methods.
第7図は従来の蛍光表示管の接続構造の第1の例を説明
するための分解斜視図である。FIG. 7 is an exploded perspective view for explaining a first example of a conventional fluorescent display tube connection structure.
真空容器の絶縁基板18にあらかじめ厚膜印刷等により
銀配線層23を設は陽極基板1上の第1の導体パッド4
と絶縁基板8上の第2のパッド11に接続する、
第8図は従来の蛍光表示管の接続構造の第2の例を説明
するための分解斜視図である。A silver wiring layer 23 is preliminarily formed on the insulating substrate 18 of the vacuum container by thick film printing or the like, and the silver wiring layer 23 is formed on the first conductor pad 4 on the anode substrate 1.
FIG. 8 is an exploded perspective view for explaining a second example of a conventional fluorescent display tube connection structure.
真空管容器内部の陽極基板1の第1の導体パッド4上に
ばね性を有する金属条24を配置し、もう一方の端部が
絶縁基板8の対応する導体パッド11に接続する。A metal strip 24 having spring properties is arranged on the first conductor pad 4 of the anode substrate 1 inside the vacuum tube container, and the other end thereof is connected to the corresponding conductor pad 11 of the insulating substrate 8.
上述したように、従来のチップイングラス構造を有する
蛍光表示管では、絶縁基板18に厚膜印刷にて銀配線層
23を設けるには絶縁基板18の正面部と側面部間時に
銀配線層23を設けることが出来ず少なくとも2〜3回
に分けて配線印刷する必要があり、更に絶縁基板18の
稜部での接続を確実に行うことが難しく、筆塗りまたは
筆塗りによる修理が必要になるなど工程が複雑になり、
また印刷法では銀配線層23の厚さを厚くすることが難
しく、このため絶縁側板18の銀配線層23と陽極基板
1上の第1の導体パッド4.絶縁基板8上の第2の導体
パッド1】との接続が確実に行われない等の重大な問題
点があった。As described above, in a fluorescent display tube having a conventional chip-in-glass structure, in order to provide the silver wiring layer 23 on the insulating substrate 18 by thick film printing, the silver wiring layer 23 is formed between the front and side surfaces of the insulating substrate 18. It is necessary to print the wiring in at least two or three times because it is not possible to provide the wiring, and furthermore, it is difficult to connect reliably at the ridge of the insulating substrate 18, and repair by brush painting or brush painting is required. The process becomes complicated,
Furthermore, it is difficult to increase the thickness of the silver wiring layer 23 using the printing method, and therefore the silver wiring layer 23 of the insulating side plate 18 and the first conductor pad 4. There were serious problems such as the inability to securely connect the second conductor pad 1 on the insulating substrate 8.
一方、ばね性を有する金属条24の少なくとも一端は固
着せずに遊離させておく必要があり対応する導体パッド
11の位置対しピッチが乱れることなく確実に接続する
ことは困難であり、特に銀配線層23の本数が多かった
り精細化した場合には非常に困難になる等の重大な問題
点があった。On the other hand, at least one end of the metal strip 24 having spring properties needs to be left free without being fixed, and it is difficult to reliably connect the corresponding conductor pads 11 without disturbing their pitches, especially the silver wires. There are serious problems such as when the number of layers 23 is large or the layers 23 are fine, it becomes extremely difficult.
本発明の目的は、表示部を駆動回路を内臓したチップイ
ングラス構造で作業効率が良く、確実な接続構造を有す
る蛍光表示管とその製造方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a fluorescent display tube having a chip-in-glass structure with a built-in drive circuit for a display portion, which has high working efficiency and a reliable connection structure, and a method for manufacturing the same.
本発明の蛍光表示管は、透明ガラス基板の表面に陽極が
形成されている陽極基板と、前記陽極上に塗布された蛍
光体層と、前記陽極に対して間隔をおいて張られたフィ
ラメントと、前記陽極と前記フィラメントとの中間に配
置された格子と、前記陽極基板上に形成され前記陽極と
前記フィラメントと前記格子に接続する第1の配線と前
記第1の配線を被覆する第1の絶縁層と、前記第1の配
線に接続して前記陽極基板の両端部に設けられた第1の
導体パッドと、絶縁基板上に形成された第2の配線と、
該第2の配線を被覆する第2の絶縁層と、該第2の絶縁
層上に固着され電極端子がボンディングに結線されたI
Cチップと、前記結線とICチップを覆って前記絶縁基
板上の前記第2の絶縁層上に設けられたシールドと、前
記第2の配線に接続して前記絶縁基板の両端部に設けら
れた第2の導体パッドと、前記陽極基板と前記絶縁基板
を間隔をおいて対向させそれらの周縁を真空封止するよ
うに設けられ前記第1の配線と前記第2の配線とに直角
に配置された第1の絶縁側板及び平行に配置された第2
の絶縁側板と、前記第1の絶縁側板の内面と封着面の少
なくともいずれが一方の端面に固定され前記第1の導体
パッドと前記第2の導体パッドに接続し前記陽極基板と
前記絶縁基板の少なくともいずれか一方の封着部に前記
第1の配線と第2の配線に平行に封止されたリードを有
している。The fluorescent display tube of the present invention includes an anode substrate having an anode formed on the surface of a transparent glass substrate, a phosphor layer coated on the anode, and a filament stretched at a distance from the anode. , a lattice disposed between the anode and the filament, a first wiring formed on the anode substrate and connecting to the anode, the filament, and the lattice, and a first wiring covering the first wiring. an insulating layer, first conductor pads connected to the first wiring and provided at both ends of the anode substrate, and a second wiring formed on the insulating substrate;
a second insulating layer covering the second wiring; and an I bonded to the second insulating layer and having an electrode terminal connected by bonding.
a C chip, a shield provided on the second insulating layer on the insulating substrate to cover the wiring and the IC chip, and a shield provided on both ends of the insulating substrate connected to the second wiring. a second conductor pad, which is provided so that the anode substrate and the insulating substrate face each other with a space therebetween and vacuum-seal their peripheries, and is arranged at right angles to the first wiring and the second wiring; a first insulating side plate and a second insulating side plate arranged in parallel.
at least one of the inner surface and the sealing surface of the first insulating side plate is fixed to one end surface and connected to the first conductive pad and the second conductive pad, and the anode substrate and the insulating substrate At least one of the sealed parts has a lead sealed in parallel to the first wiring and the second wiring.
本発明の蛍光表示管の製造方法は、透明ガラス基板に厚
膜印刷法等により陽極と第1の配線と該第1の配線に接
続して第1の導体パッドを形成し第1の絶縁層を被覆し
た後前記陽極に蛍光体層を塗布した陽極基板上にフィラ
メントと格子を組立てる第1の工程と、絶縁基板上に第
2の配線と該第2の配線に接続してボンディングパッド
と第2の導体パッドを形成し第2の絶縁層を被覆した後
電極端子がボンディングパッドと結線されたICチップ
を前記第2の絶縁層上に固着し前記結線とICチップを
覆うように前記第2の絶縁層上にシールドを設ける第2
の工程と、金属薄板をプレス打抜き法等で各リードが互
いに平行で両端が共通フレームに一体連結されているリ
ードフレームを第1の絶縁側板の内面と封着面の少なく
ともいずれか一方の端面に前記第1の配線と第2の配線
に平行に封止されるように整形した後共通フレームが前
記端面から外に出るよう前記第1の絶縁側板に組込み前
記陽極基板上の前記第1の導体パッドと前記絶縁基板上
の前記第2の導体パッドの各々が前記第1の絶縁側板の
リードに対応するように位置合せして容器に組立てる第
3の工程と、組立てた前記容器を耐熱クリップで固定し
封着部で封着する第4の工程と、封着後前記容器の外に
出ている前記共通フレームを切断する第5の工程とを含
んで構成される。In the method for manufacturing a fluorescent display tube of the present invention, an anode, a first wiring, and a first conductive pad connected to the first wiring are formed on a transparent glass substrate by a thick film printing method or the like, and a first insulating layer is formed. a first step of assembling a filament and a grid on the anode substrate coated with a phosphor layer on the anode; a second wiring connected to the second wiring on the insulating substrate, and a bonding pad and a second wiring connected to the second wiring; After forming two conductor pads and covering the second insulating layer, an IC chip whose electrode terminals are connected to the bonding pads is fixed on the second insulating layer, and the second The second step is to provide a shield on the insulating layer of
A lead frame, in which each lead is parallel to each other and both ends are integrally connected to a common frame, is attached to at least one of the inner surface and the sealing surface of the first insulating side plate using a press punching method or the like from a thin metal plate. The first conductor on the anode substrate is shaped so that the first wiring and the second wiring are sealed in parallel, and then the common frame is assembled into the first insulating side plate so as to protrude from the end surface. a third step of aligning the pads and the second conductor pads on the insulating substrate to correspond to the leads of the first insulating side plate and assembling the container; and fixing the assembled container with heat-resistant clips. The container is configured to include a fourth step of fixing and sealing with a sealing portion, and a fifth step of cutting the common frame protruding from the container after the sealing.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第1図は第1の発明の蛍光表示管の第1の実施例を示す
断面図である。FIG. 1 is a sectional view showing a first embodiment of a fluorescent display tube according to the first invention.
透明ガラス基板より成る陽極基板1上には、蛍光体層を
塗布した陽極2と陽極2に対して間隔をおいて張られた
フィラメント7と陽極2とフィラメント7との中間に格
子6が配置され、これら陽極2.フィラメント7、格子
6の電極は陽極基板1上に形成された配線3に接続し配
線3は絶縁層5によって被覆され、陽極基板1の両端部
に設けられた第1の導体パッド4に接続している。一方
絶縁基板8上には配線9が形成され、配線9は絶縁層1
2で被覆される。絶縁層12上にICチップ13が固着
され、その電極はボンディングワイヤー14でボンディ
ングパッド10に結線され、ボンディングワイヤー14
とICチップ13を覆ってシールド20が絶縁層12上
に設けられ、絶縁基板8の両端に設けられた第2の導体
パッド11が配線9に接続している。絶縁側基板18に
は内面と封着面の両面に密着し、封着面で配線3と配線
9に平行にリード15が固定されている。On an anode substrate 1 made of a transparent glass substrate, an anode 2 coated with a phosphor layer, a filament 7 stretched at a distance from the anode 2, and a grid 6 are arranged between the anode 2 and the filament 7. , these anodes 2. The electrodes of the filament 7 and the grid 6 are connected to wiring 3 formed on the anode substrate 1, and the wiring 3 is covered with an insulating layer 5 and connected to first conductor pads 4 provided at both ends of the anode substrate 1. ing. On the other hand, a wiring 9 is formed on the insulating substrate 8, and the wiring 9 is connected to the insulating layer 1.
2. An IC chip 13 is fixed on the insulating layer 12 , and its electrodes are connected to the bonding pads 10 with bonding wires 14 .
A shield 20 is provided on the insulating layer 12 to cover the IC chip 13, and second conductive pads 11 provided at both ends of the insulating substrate 8 are connected to the wiring 9. A lead 15 is fixed to the insulating substrate 18 in close contact with both the inner surface and the sealing surface, and parallel to the wiring 3 and the wiring 9 on the sealing surface.
陽極基板1と絶縁基板8は対向し絶縁基板18を介して
陽極基板lの導体パッド4と絶縁基板8の導体パ・ソド
11が絶縁側板18のリード15と互いに接続してシー
ルガラス1つにて封止されり一層15が封着部に固着さ
れる。The anode substrate 1 and the insulating substrate 8 are opposed to each other, and the conductor pad 4 of the anode substrate 1 and the conductor pad 11 of the insulating substrate 8 are connected to the leads 15 of the insulating side plate 18 through the insulating substrate 18 to form one seal glass. The layer 15 is then sealed to the sealing portion.
第2図(a)〜(e)は第2の発明の蛍光表示管の製造
方法の第1の実施例を説明するための主な製造工程にお
ける接続構造の斜視図である。FIGS. 2(a) to 2(e) are perspective views of the connection structure in the main manufacturing steps for explaining the first embodiment of the method for manufacturing a fluorescent display tube according to the second invention.
板厚0.2tの42%Ni−6%Cr−Fe合金をプレ
ス打板き法等によりリードフレームを形成する。各リー
ド15は共通フレーム115に一体連結されている。こ
のリードフレームを絶縁側板18の内面と両方の封着面
に接触するように共通フレーム115に平行にコの字形
に整形する。A lead frame is formed from a 42% Ni-6% Cr-Fe alloy having a thickness of 0.2 t by a pressing method or the like. Each lead 15 is integrally connected to a common frame 115. This lead frame is shaped into a U-shape parallel to the common frame 115 so as to contact the inner surface of the insulating side plate 18 and both sealing surfaces.
整形加工したリードフレームはシールガラス】9が塗布
された絶縁側板18に共通フレームが容器の外に出るよ
うに組込み陽極基板1の導体パッド4と絶縁基板8の導
体パッド11との各々が対応する絶縁側板18のリード
15に対応するように位置合せして容器に組立てる5組
立てた容器を耐熱クリップで固定し、封着部で封着する
ことにより気密封止を行う。封着後容器の外に出ている
共通フレーム115の切断を行うことにより各々のり一
層15は電気的に分離され気密封止された容器を排気す
ることにより作業効率が良く、確実な接続構造を有する
チップイングラス構造の蛍光表示管が得られる。The shaped lead frame is assembled into the insulating side plate 18 coated with seal glass 9 so that the common frame protrudes outside the container, and the conductor pads 4 of the anode substrate 1 and the conductor pads 11 of the insulating substrate 8 correspond to each other. 5. The assembled container is assembled into a container by aligning the container so as to correspond to the leads 15 of the insulating side plate 18. The assembled container is fixed with heat-resistant clips and sealed at the sealing portion to perform airtight sealing. After sealing, by cutting the common frame 115 protruding from the container, each glue layer 15 is electrically isolated and the hermetically sealed container is evacuated, resulting in a reliable connection structure with high working efficiency. A fluorescent display tube having a chip-in-glass structure is obtained.
第3図は第1の発明の蛍光表示管の第2の実施例を示す
断面図である。FIG. 3 is a sectional view showing a second embodiment of the fluorescent display tube of the first invention.
陽極基板1と絶縁基板8は第1の実施例と同じ構造であ
るが、リード15は陽極基板1側では第1の実施例と同
じく陽極基板1と絶縁側板18の間に挟み込まれ封着部
に固着されている。絶縁基板8側では容器の内側で第2
の導体パッド11と接続し、補強ガラス板17とフリッ
トガラス16を用いて固着する。The anode substrate 1 and the insulating substrate 8 have the same structure as in the first embodiment, but the leads 15 are sandwiched between the anode substrate 1 and the insulating side plate 18 on the anode substrate 1 side, as in the first embodiment, and form a sealing part. is fixed to. On the insulating substrate 8 side, a second
It is connected to the conductor pad 11 of and fixed using the reinforcing glass plate 17 and the frit glass 16.
第4図(a)〜(d)は第2の発明の蛍光表示管の製造
方法の第2の実施例を説明するための主な製造工程にお
ける接続構造の斜視図である。FIGS. 4(a) to 4(d) are perspective views of the connection structure in the main manufacturing steps for explaining a second embodiment of the method for manufacturing a fluorescent display tube according to the second invention.
形成されたリードフレームを陽極基板1側では絶縁側板
18の内面と封着面に接触するように折曲げ、絶縁基板
8側では絶縁側板18の内面に接触し絶縁基板8と平行
に容器の内側方向に折曲げるように整形する。整形加工
したリードフレームはあらかじめ絶縁側板18をシール
ガラス1つで封着した絶縁基板8の導体パッド11にリ
ード15の片側の端部を位置合せしフリットガラス16
を塗布した補強ガラス板17にてリード15を押えて焼
成しリード15を絶縁基板8上に固着して共通フレーム
を切断する。切断後陽極基板1上の導体パッド4を対応
するリード15に位置合せして容器に組立て封着する。The formed lead frame is bent on the anode substrate 1 side so as to contact the inner surface of the insulating side plate 18 and the sealing surface, and on the insulating substrate 8 side, it is bent so as to contact the inner surface of the insulating side plate 18 and parallel to the insulating substrate 8 inside the container. Shape it so that it bends in the direction. For the shaped lead frame, one end of the lead 15 is aligned with the conductor pad 11 of the insulating substrate 8, which has been sealed with the insulating side plate 18 using a piece of sealing glass.
The leads 15 are held down by a reinforcing glass plate 17 coated with the same and fired to fix the leads 15 on the insulating substrate 8, and then the common frame is cut. After cutting, the conductor pads 4 on the anode substrate 1 are aligned with the corresponding leads 15, and assembled and sealed in a container.
封着後容器の外に出た共通フレーム115を切断除去す
ることにより各々のリード15は電気的に分離される。After sealing, each lead 15 is electrically isolated by cutting and removing the common frame 115 that has come out of the container.
第5図(a)〜(d)は第1の発明の蛍光表示管の第3
の実施例の接続構造部の断面図である。FIGS. 5(a) to 5(d) show the third part of the fluorescent display tube of the first invention.
FIG. 3 is a cross-sectional view of the connection structure of the embodiment.
リード15と導体パッド4.11の接続をより確実にす
るためリード15に突出部を設けた構造を示す。突出部
21はフォトエツチング法によりリードフレームを形成
する場合に部分的にハーフエツチングを施し導体パッド
4,11に押圧接触させる部分に導体パッド4.11側
に向けてり−ド15の板厚の差による突出部21を設け
る。突出部22はプレス加工によりリードフレームを形
成する場合に導体パッド4.11に押圧接触させる部分
に導体パッド4,11側に向けて突出部22を形成する
。A structure is shown in which a protrusion is provided on the lead 15 in order to more securely connect the lead 15 and the conductor pad 4.11. When the lead frame is formed by the photo-etching method, the protrusion 21 is partially half-etched, and the part that is brought into pressure contact with the conductor pads 4 and 11 is oriented toward the conductor pads 4 and 11 to reduce the thickness of the board 15. A protrusion 21 is provided by a difference. The protrusion 22 is formed toward the conductor pads 4 and 11 at a portion that is brought into pressure contact with the conductor pads 4 and 11 when forming the lead frame by press working.
以上説明したように、本発明は、チップイングラス構造
の蛍光表示管の陽極基板の配線と絶縁基板上の配線の各
々両端に接続して設けられた第1及び、第2の導体パッ
ドに対応して絶縁側板に設けられた各々のリードを押圧
接触させるための確実な接続が出来、突出部を設けるこ
とにより一層確実な接続構造とすることが出来る。更に
、共通フレームに一体となったままで第1及び第2の導
体パッドに接し、固着した後で共通フレームを切断除去
し各リードを分離するためリードの増加や精細化した場
合でもピッチ乱れを起すことなく作業効率が良く確実な
接続構造が得られるという効果がある。As explained above, the present invention corresponds to the first and second conductor pads connected to both ends of the wiring on the anode substrate and the wiring on the insulating substrate of a fluorescent display tube with a chip-in-glass structure. Thus, a reliable connection can be made by bringing each lead provided on the insulating side plate into pressure contact, and by providing the protrusion, an even more reliable connection structure can be achieved. Furthermore, since it contacts the first and second conductor pads while being integrated into the common frame and is fixed, the common frame is cut and removed to separate each lead, which causes pitch disturbance even when the number of leads increases or becomes finer. This has the effect of providing a reliable connection structure with good work efficiency without any problems.
第1図は第1の発明の蛍光表示管の第1の実施例を示す
断面図、第2図(a)〜(e)は第2の発明の蛍光表示
管の製造方法の第1の実施例を説明するための主な製造
工程における接続構造の斜視図、第3図は第1の発明の
蛍光表示管の第2の実施例を示す断面図、第4図(a)
〜(d)は第2の発明の蛍光表示管の製造方法の第2の
実施例を説明するための主な製造工程における接続構造
の斜視図、第5図(a)〜(d)は第1の発明の蛍光表
示管の第3の実施例の接続構造部の断面図、第6図は従
来の蛍光表示管の一例を示す斜視図、第7図、第8図は
従来の蛍光表示管の接続構造の第1及び第2の例を説明
するための分解斜視図である。
1・・・陽瘉基板、2・・・陽極、3・・・第1の配線
、4・・・第1の導体パッド、5・・・第1の絶縁層、
6・・・格子、7・・・・・・フィラメント、8・・・
絶縁基板、9・・・第2の配線、10・・・ボンディン
グパッド、11・・・第2の導体パッド、12・・・第
2の絶縁層、13・・・ICチップ、14・・・ボンデ
ィングワイヤ、15・・・リード、16・・・フリット
ガラス、17・・・補強ガラス板、18・・・第1の絶
縁側板、19・・・シールガラス、20・・・シールド
、21.22・・・突出部、23・・・銀配線層、24
・・・金属条、115・・・共通フレーム、118・・
・第2の絶縁側板。FIG. 1 is a sectional view showing a first embodiment of a fluorescent display tube according to the first invention, and FIGS. 2(a) to (e) are a first embodiment of a method for manufacturing a fluorescent display tube according to the second invention. A perspective view of the connection structure in the main manufacturing process for explaining an example, FIG. 3 is a sectional view showing a second embodiment of the fluorescent display tube of the first invention, and FIG. 4(a)
- (d) are perspective views of the connection structure in the main manufacturing steps for explaining the second embodiment of the method for manufacturing a fluorescent display tube according to the second invention, and Figs. FIG. 6 is a perspective view showing an example of a conventional fluorescent display tube, and FIGS. FIG. 3 is an exploded perspective view for explaining first and second examples of the connection structure of FIG. DESCRIPTION OF SYMBOLS 1... Positive substrate, 2... Anode, 3... First wiring, 4... First conductor pad, 5... First insulating layer,
6... Lattice, 7... Filament, 8...
Insulating substrate, 9... Second wiring, 10... Bonding pad, 11... Second conductor pad, 12... Second insulating layer, 13... IC chip, 14... Bonding wire, 15... Lead, 16... Frit glass, 17... Reinforced glass plate, 18... First insulating side plate, 19... Seal glass, 20... Shield, 21.22 ...Protrusion, 23...Silver wiring layer, 24
...Metal strip, 115...Common frame, 118...
-Second insulating side plate.
Claims (2)
極基板と、前記陽極上に塗布された蛍光体層と、前記陽
極に対して間隔をおいて張られたフィラメントと、前記
陽極と前記フィラメントとの中間に配置された格子と、
前記陽極基板上に形成され前記陽極と前記フィラメント
と前記格子に接続する第1の配線と前記第1の配線を被
覆する第1の絶縁層と、前記第1の配線に接続して前記
陽極基板の両端部に設けられた第1の導体パッドと、絶
縁基板と、該絶縁基板上に形成された第2の配線と、該
第2の配線を被覆する第2の絶縁層と、該第2の絶縁層
上に固着され電極端子がボンディングパッドに結線され
たICチップと、前記結線とICチップを覆って前記絶
縁基板上の前記第2の絶縁層上に設けられたシールドと
、前記第2の配線に接続して前記絶縁基板の両端部に設
けられた第2の導体パッドと、前記陽極基板と前記絶縁
基板を間隔をおいて対向させそれらの周縁を真空封止す
るように設けられ前記第1の配線と前記第2の配線とに
直角に配置された第1の絶縁側板及び平行に配置された
第2の絶縁側板と、前記第1の絶縁側板の内面と封着面
の少なくともいずれが一方の端面に固定され前記第1の
導体パッドと前記第2の導体パッドに接続し前記陽極基
板と前記絶縁基板の少なくともいずれか一方の封着部に
前記第1の配線と第2の配線に平行に封止されたリード
を有することを特徴とする蛍光表示管。(1) An anode substrate having an anode formed on the surface of a transparent glass substrate, a phosphor layer coated on the anode, a filament stretched at a distance from the anode, and the anode and the anode. a lattice placed between the filament and the filament;
a first wiring formed on the anode substrate and connected to the anode, the filament, and the grid; a first insulating layer covering the first wiring; and a first insulating layer connected to the first wiring and connected to the anode substrate. a first conductor pad provided at both ends of the insulating substrate, a second wiring formed on the insulating substrate, a second insulating layer covering the second wiring, and a second insulating layer covering the second wiring; an IC chip fixed on the insulating layer and having electrode terminals connected to bonding pads; a shield provided on the second insulating layer on the insulating substrate to cover the connection and the IC chip; a second conductor pad connected to the wiring and provided at both ends of the insulating substrate; and a second conductor pad provided so as to face the anode substrate and the insulating substrate with a space therebetween, and vacuum-seal their peripheral edges. a first insulating side plate disposed perpendicularly to the first wiring and the second wiring; a second insulating side plate disposed parallel to the first wiring; and at least one of the inner surface and the sealing surface of the first insulating side plate. is fixed to one end surface and connected to the first conductive pad and the second conductive pad, and the first wiring and the second wiring are connected to the sealed portion of at least one of the anode substrate and the insulating substrate. A fluorescent display tube characterized by having leads sealed in parallel to.
の配線と該第1の配線に接続して第1の導体パッドを形
成し第1の絶縁層を被覆した後前記陽極に蛍光体層を塗
布した陽極基板上にフィラメントと格子を組立てる第1
の工程と、絶縁基板上に第2の配線と該第2の配線に接
続してボンディングパッドと第2の導体パッドを形成し
第2の絶縁層を被覆した後電極端子がボンディングパッ
ドと結線されたICチップを前記第2の絶縁層上に固着
し前記結線とICチップを覆うように前記第2の絶縁層
上にシールドを設ける第2の工程と、金属薄板をプレス
打抜き法等で各リードが互いに平行で両端が共通フレー
ムに一体連結されているリードフレームを第1の絶縁側
板の内面と封着面の少なくともいずれか一方の端面に前
記第1の配線と第2の配線に平行に封止されるように整
形した後共通フレームが前記端面から外に出るよう前記
第1の絶縁側板に組込み前記陽極基板上の前記第1の導
体パッドと前記絶縁基板上の前記第2の導体パッドの各
々が前記第1の側板のリードに対応するように位置合せ
して容器に組立てる第3の工程と、組立てた前記容器を
耐熱クリップで固定し封着炉で封着する第4の工程と、
封着後前記容器の外に出ている前記共通フレームを切断
する第5の工程とを含むことを特徴とする蛍光表示管の
製造方法。(2) The anode and the first electrode are printed on a transparent glass substrate using a thick film printing method, etc.
A first step of assembling the filament and the grid on the anode substrate, which is connected to the wiring and the first wiring to form a first conductor pad and coated with a first insulating layer, and then coated with a phosphor layer on the anode.
A second wiring is connected to the second wiring on the insulating substrate to form a bonding pad and a second conductor pad, and after coating the second insulating layer, the electrode terminal is connected to the bonding pad. a second step of fixing the IC chip on the second insulating layer and providing a shield on the second insulating layer so as to cover the connections and the IC chip; are parallel to each other and both ends are integrally connected to a common frame. A lead frame is sealed in parallel to the first wiring and the second wiring on at least one of the inner surface and the sealing surface of the first insulating side plate. After shaping the common frame so that it is fixed, the common frame is assembled into the first insulating side plate so as to protrude from the end surface, and the first conductor pad on the anode substrate and the second conductor pad on the insulating substrate are connected to each other. a third step of assembling the containers into a container by aligning the respective leads so as to correspond to the leads of the first side plate; a fourth step of fixing the assembled containers with heat-resistant clips and sealing them in a sealing furnace;
A method for manufacturing a fluorescent display tube, comprising: a fifth step of cutting the common frame protruding from the container after sealing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30964486A JPS63164148A (en) | 1986-12-26 | 1986-12-26 | Fluorescent character display tube and its manfuacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30964486A JPS63164148A (en) | 1986-12-26 | 1986-12-26 | Fluorescent character display tube and its manfuacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63164148A true JPS63164148A (en) | 1988-07-07 |
Family
ID=17995522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30964486A Pending JPS63164148A (en) | 1986-12-26 | 1986-12-26 | Fluorescent character display tube and its manfuacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63164148A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010114015A (en) * | 2008-11-10 | 2010-05-20 | Futaba Corp | Fluorescent display tube having touch switch portion, and fluorescent display device |
-
1986
- 1986-12-26 JP JP30964486A patent/JPS63164148A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010114015A (en) * | 2008-11-10 | 2010-05-20 | Futaba Corp | Fluorescent display tube having touch switch portion, and fluorescent display device |
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