JPS6210833A - Manufacture of display device - Google Patents

Abstract

PURPOSE:To improve the workability for the connection of the electrode to the wiring layer by hardening the glass by heating and pressuring simultaneously after placing the electrode on the electro-conductive layer provided on the edge part of the wiring layer on a substrate and placing the insulating member applied with low-melting glass on the said electrode. CONSTITUTION:The wiring layers 121-123 are produced on the substrate 11 constructing a part of the tight envelope, and one side ends of the layers are leaded out of the substrate 11 and on the other side ends of which conductive layers 131-133 of carbon silver or the like made by thick film printing are adhered. Then the grid electrodes 141-143 combined as an unit with a frame are placed on the surface of the said conductive layers 131-133, and the spacer member 15 applied with low-melting glass 16 is placed on the said grid electrodes. Then by applying a pressure 17 and heating the frame so as to harden the low-melting glass 16 the grid electrodes of such as fluorescent character display tube is mounted on the substrate. Therefore the fixing and the connection of the electrodes to the wiring layer can be conductive simultaneously to improve the workability.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a display device such as a fluorescent display tube, and particularly relates to a method for manufacturing a display device such as a fluorescent display tube, and particularly relates to a method for manufacturing a display device such as a fluorescent display tube. The present invention relates to a metal electrode connection method in which a metal electrode is attached to a substrate, the metal electrode is conductively connected to a wiring layer formed on the substrate, and the metal electrode is led to the outside.

[Conventional technology]

Conventionally, in the assembly process of a fluorescent display tube, in order to conductively connect a grid electrode as a metal electrode (also referred to as a metal electrode) to a wiring layer on a substrate and lead it out to the outside, each of the wiring layers formed on the substrate is As shown in FIG. A method is used in which one end side of the grid electrode 5 attached to the spacers 4a and 4b is wire-bonded using the wire wire 6. In addition, as another method, a part of each grid electrode is directly passed through the sealed part with the envelope sealed on the substrate to the outside of the airtight container consisting of the substrate and the envelope and to the outside of the tb tube. There is also a way to derive it.

[Problem that the invention seeks to solve]

However, in the connection method using conductive paste, when the connection pitch of each grid electrode becomes fine, short circuits between adjacent grid electrodes are likely to occur due to the flow of the conductive paste. Further, although the method using wire bonding allows connection even if the connection pitch of each grid electrode becomes fine, extra space is required for wire bonding.

Furthermore, in the case where a part of the grid electrode is directly led out of the tube, the pitch of each lead terminal as an external connection terminal is limited to the pitch of each grid electrode, and the pitch of each lead terminal can be widened or shortened. Hateful. Furthermore, since the grid electrode penetrates the sealed portion between the substrate and the envelope, there is a problem in that the surface thereof must be oxidized.

The present invention has been made in view of these points, and by directly making a conductive connection between a metal electrode and a wiring layer on a substrate by pressure bonding with low-melting glass, without using conductive paste or wire, The present invention provides a method for manufacturing a display device that solves the above-described conventional problems.

[Means for solving problems]

In the method for manufacturing a display device according to the present invention, an airtight container is formed from a substrate and an envelope sealed on the substrate, and a metal electrode to be mounted on the substrate in the airtight container is placed on the substrate. In a method for manufacturing a display device in which a conductive connection is made to a wiring layer formed on the substrate to lead it out to the outside, a fixed end portion of the metal electrode is brought into contact with and positioned at a terminal portion of a wiring layer formed on the substrate; A fixing insulating member whose bottom surface is coated with low melting point glass is placed on the contact surface of the metal electrode, and the low melting point glass is thermally hardened while the insulating member is pressurized. The metal electrode is electrically connected to the metal electrode, and at the same time, the metal electrode is fixed onto the substrate.

[Effect]

In the present invention, the metal electrode and the wiring layer on the substrate are electrically connected by pressure bonding using low melting point glass.
The metal electrode can be fixed on the substrate and connected to the wiring layer at the same time.

〔Example〕

Hereinafter, the present invention will be explained based on embodiments shown in the drawings.

Figures 1 and 2 are basic process sectional views showing a method of connecting metal electrodes according to an embodiment of the present invention. The implementation above is shown below. In FIG. 1, reference numeral 11 denotes a substrate made of glass and forming a part of an airtight container. On this substrate 11, there are a plurality of wiring layers each having a predetermined wiring pattern to lead each of the grid electrodes to the outside, which will be described later. 121, 122, 123 are formed. These wiring layers 121 to 123 are made of thin film layers such as aluminum (Al), and the lead portions of one of them are connected to the outside of an airtight container formed by sealing an envelope (not shown) on the substrate 11. Conductive layers 131, 132, 133 of carbon or silver printed with a thick film are led out of the multi-tube and at the other end are in conductive contact with each grid electrode inside the tube.
wiring layers 121 to 12 on the substrate 11 formed in this way.
In order to conductively connect each of the grid electrodes to the grid electrode 3, a normal grid electrode frame in which these grid electrodes 141, 142, 143 are integrally connected by a frame (not shown) is prepared. One fixed end of each of the grid electrodes 141 to 143 in this grid electrode frame is brought into contact with the surface of the conductive layers 131 to 133 of each wiring layer 121 to 123 formed on the substrate 11, and the other This grid electrode frame is positioned by placing the fixed end portion at a predetermined location on the substrate 1. Next, a strip-shaped grid fixing spacer member 15 whose bottom surface is coated with low melting point glass 16 is placed on the fixed end surfaces of both of the grid electrodes 141 to 1430. Next, a pressing force 17 shown in the arrow direction in FIG. 1 is applied to these spacer members 15 using a jig (not shown) to separate each wiring layer 12.
Conductive layers 131 to 133 on 1 to 123 and grid electrode 1
One fixed end of each of the grid electrodes 41 to 143 is pressed against the substrate 11, and the other fixed end of each of the grid electrodes 141 to 143 is pressed onto the substrate 11.

By thermally curing the low melting point glass 16 in a heating furnace under pressure contact with
21 to 123 and the grid electrodes 141 to 143 can be electrically connected, and at the same time, both fixed ends of each grid electrode 141 to 143 can be pressed with the spacer member 15 to fix these grid electrodes 141 to 143 on the substrate 11. . Finally, by cutting the frame of the seven grid electrodes, the grid electrodes 141 to 14n can be arranged and mounted on the substrate 11 at equal intervals, as shown in FIG.

In this case, the spacer member 15 includes each grid electrode 1
This is for fixing both ends of the wiring layers 121 on the substrate 11, and a rectangular insulating plate made of glass or ceramic, or a metal plate with an insulating layer on the mounting surface can be used. When the conductive layers 123 to 123 are made of a thick conductive layer such as silver, the conductive layers 131 to 133 at the connection portions with the grid electrodes at the respective terminal portions may be omitted. Further, as shown in FIG. 4, a thick insulating layer 18 is formed around the connection portion between each of the wiring layers 121 to 123 on the substrate 11 and each of the grid electrodes 141 to 143. When pressure bonding is difficult, a conductive layer 191 made of silver or carbon is added on top of it.
Forming 192 and 193 facilitates pressure bonding.

Therefore, according to the above embodiment, the grid electrode 141
Fixing ~143 to the substrate 11 and wiring layers 121 to 123
connection to each grid electrode 141 at the same time, and furthermore, each grid electrode 141
Even if the connection pitch between the wiring layers 121 to 143 is about 0.5 mm or less, conductive connection with the wiring layers 121 to 123 on the substrate 11 is easily possible.

FIG. 5 shows another embodiment of the present invention, and is a partial side sectional view showing a state after connection of a grid electrode as a metal electrode. The difference in FIG. 5 from the above-described embodiment is as follows.
The terminal portion of each wiring layer 12 formed on the substrate 11 to be connected to the grid electrode 14 is located within the sealing portion 22 between the substrate 11 and the face glass 21 serving as an envelope.

Then, a conductive layer 20 made of silver or carbon and having the same thickness as the insulating layer 18 is formed adjacent to the end face of the insulating layer 18 deposited on the substrate 11 at the terminal portion of the wiring layer 12. , one fixed end of the grid electrode 14 is placed in contact with the conductive layer 20 on these wiring layers 12 . Thereafter, these are pressed into contact with the face glass 21 whose sealing surface is coated with a low melting point glass 23 and the low melting point glass 23 is thermally hardened to form a sealed portion 22 between the substrate 11 and the face glass 21. Each grid electrode 14 and the wiring layer 12 on the substrate 11 are electrically connected to each other by pressure bonding with a low melting point glass 23 inside.

According to such embodiments, therefore, grid electrode 14
0 fixation to the substrate 11 and connection to the wiring layer 12 on the substrate,
Furthermore, sealing of the face glass 21 can be completed in one step. However, depending on the shape of the grid electrode 14, it may be more convenient for manufacturing to fix it on the substrate 11 before the sealing process, or it may be done separately.

Further, since the connecting portion between the grid electrode 14 and the substrate 11 is completely covered with the low melting point glass 23 of the sealing agent, there is no problem of vacuum tightness. Moreover, since a part of the face glass 21 also serves to fix the grid electrode 14, there is an advantage that the spacer member 15 shown in FIG. 1 is not required.

Furthermore, an insulating layer 18 is usually formed on the substrate 11 that forms the inside of the pipe to protect the wiring inside the pipe, and this thickness creates a gap between the wiring layer 12 outside the pipe and the grid electrode 14. However, the connection status may deteriorate. In addition, the material of the wiring layer 12 is mainly a thick silver layer or a thin aluminum layer, and in the case of a thin film, it is difficult to obtain a sufficient conduction state. According to the example,
By forming another conductive layer 20 at the connection portion of each wiring layer 12 with the grid electrode 14, the grid electrode 14
You can easily connect with

However, if there is no insulating layer 18 around the pressure contact portion between the wiring layer 12 and the grid electrode 14, and the material of the wiring layer 12 outside the tube has good contact with the grid electrode 14, such as a thick film silver layer, It is also possible to press the grid electrode 14 directly to the terminal portion on the extra-tube wiring layer 12.

In each of the above embodiments, the metal electrode is a grid electrode used for assembling a fluorescent display tube.
The present invention is not limited thereto, and can of course be applied to various types of display devices in which a filament support or a metal electrode such as an anode is conductively connected to a wiring layer on a substrate and led to the outside.

〔Effect of the invention〕

As explained above, according to the present invention, the metal electrode is fixed on the substrate and connected to the wiring layer by electrically connecting the wiring layer on the substrate and the metal electrode by pressure bonding with low melting point glass. can be done at the same time. Therefore, there is no short circuit between the metal electrodes due to the flow of conductive paste as in the past, and there is no need for space for wire bonding, and the connection pitch of each metal electrode can be reduced. This has the effect of increasing the reliability of the system.

[Brief explanation of drawings]

1 and 2 are basic cross-sectional views showing one embodiment of the present invention, FIG. 3 is a schematic plan view showing the state of connection of the metal electrode (grid electrode) to the substrate in the above embodiment, and FIG. FIG. 4 is a process sectional view equivalent to FIG. 2 showing a modification of the above embodiment, FIG. 5 is a partial side sectional view of a connecting portion illustrating another embodiment of the present invention, and FIG. 6 is a conventional process sectional view. FIG. 3 is an explanatory diagram showing an example of a method of connecting grid electrodes.

Claims (3)

[Claims] (1) An airtight container is formed from a substrate and an envelope sealed on the substrate, and a metal electrode to be mounted on the substrate in this airtight container is conductively connected to a wiring layer formed on the substrate. In the method for manufacturing a display device in which a fixed end portion of the metal electrode is brought into contact with and positioned at a terminal portion of a wiring layer formed on the substrate, and on a contact surface of the metal electrode, A fixing insulating member coated with low melting point glass is placed on the bottom surface, and the low melting point glass is thermally hardened while pressurizing the insulating member, thereby electrically connecting the wiring layer and the metal electrode at the same time. . A method of manufacturing a display device, comprising fixing the metal electrode on the substrate. (2) The display according to claim 1, characterized in that the wiring layer is composed of thin film layers having a predetermined wiring pattern, and a thick conductive layer is formed at the end portions of the thin film layers. Method of manufacturing the device. (3) The terminal portion to be conductively connected to the metal electrode of the wiring layer is located within the sealed part between the board and the envelope, and a part of the envelope is also used as a fixing insulating member. A method for manufacturing a display device according to claim 1 or 2.