JPS63164142U - - Google Patents

Info

Publication number

JPS63164142U

JPS63164142U JP5763987U JP5763987U JPS63164142U JP S63164142 U JPS63164142 U JP S63164142U JP 5763987 U JP5763987 U JP 5763987U JP 5763987 U JP5763987 U JP 5763987U JP S63164142 U JPS63164142 U JP S63164142U

Authority

JP

Japan

Prior art keywords

case

housed

lead terminal

opening

insulating bushing

Prior art date

1987-04-15

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

• Espacenet
• Global Dossier
• Discuss

• 238000007747 plating Methods 0.000 claims description 4
• 230000006835 compression Effects 0.000 claims description 3
• 238000007906 compression Methods 0.000 claims description 3
• 239000008188 pellet Substances 0.000 claims description 3
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
• 229910017052 cobalt Inorganic materials 0.000 claims description 2
• 239000010941 cobalt Substances 0.000 claims description 2
• GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
• 239000011347 resin Substances 0.000 claims description 2
• 229920005989 resin Polymers 0.000 claims description 2
• 238000007789 sealing Methods 0.000 claims description 2
• 229910052709 silver Inorganic materials 0.000 claims description 2
• 239000004332 silver Substances 0.000 claims description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
• 229910000881 Cu alloy Inorganic materials 0.000 claims 1
• 229910052802 copper Inorganic materials 0.000 claims 1
• 239000010949 copper Substances 0.000 claims 1