JPS63163150A - Printed circuit board inspecting device - Google Patents
Printed circuit board inspecting deviceInfo
- Publication number
- JPS63163150A JPS63163150A JP31135586A JP31135586A JPS63163150A JP S63163150 A JPS63163150 A JP S63163150A JP 31135586 A JP31135586 A JP 31135586A JP 31135586 A JP31135586 A JP 31135586A JP S63163150 A JPS63163150 A JP S63163150A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- holes
- arithmetic processing
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 claims abstract description 10
- 238000007689 inspection Methods 0.000 claims abstract description 5
- 238000001514 detection method Methods 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95692—Patterns showing hole parts, e.g. honeycomb filtering structures
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明はプリント基板の穴の数、穴の大きさ。[Detailed description of the invention] Industrial applications The present invention is concerned with the number of holes and the size of the holes on the printed circuit board.
穴の形状等を自動的に判別するプリント基板検査装置に
関する。The present invention relates to a printed circuit board inspection device that automatically determines the shape of holes, etc.
従来の技術
従来は第４図で示すようなカメラ１による穴検出が一般
的で、光源４より出た光の内、コンベア６により供給さ
れたプリント基板３の穴を通過した光をカメラ１で検出
し、コントローラ２で演算処理する方式である。2. Description of the Related Art Conventionally, it has been common practice to detect holes using a camera 1 as shown in FIG. This is a method in which the information is detected and the controller 2 performs arithmetic processing.
発明が解決しようとする問題点
しかし従来の方式では、レンズの倍率、焦点合わせなど
光学系の煩雑な調整が必要であり、又カメラの視野周辺
部での光量低下９分解能劣化等により測定精度が悪くな
り、測定可能穴径が大きく制限される問題があった。Problems to be Solved by the Invention However, the conventional method requires complicated adjustments of the optical system such as lens magnification and focusing, and also reduces measurement accuracy due to a decrease in the amount of light at the periphery of the camera's field of view9 and deterioration in resolution. There was a problem in that the measurable hole diameter was greatly limited.
問題点を解決するための手段
本発明は、上記のような問題を解決しようとするもので
、穴検出に密着形イメージセンサを利用したものである
。Means for Solving the Problems The present invention attempts to solve the above-mentioned problems, and utilizes a contact type image sensor for hole detection.
、 作 用
本発明は、上記構成により、被検査体であるプリント基
板を当劾密着形イメージセンサから一定の距離の所を通
過するようにして、視野周辺部での光漬低下２分解能の
劣化を起こすことなく穴検出を行なうものである。密着
形イメージ七／すの構造図である第２図に示すように、
光源２６から出ｆＣ′Ｊｔ、の内プリント基板２３の穴
を通過した元は。According to the above configuration, the present invention allows the printed circuit board, which is the object to be inspected, to pass at a certain distance from the contact type image sensor, thereby reducing optical immersion in the peripheral area of the visual field and deterioration in resolution. This method detects holes without causing any damage. As shown in Figure 2, which is a structural diagram of the close contact type image 7/su,
Of the light fC'Jt emitted from the light source 26, the original light passes through the hole in the printed circuit board 23.
ほぼ平行光線のまま受光素子群２で検出できるため、測
定面全域にて一様の検出が可能である。Since the light receiving element group 2 can detect the almost parallel light beams, uniform detection is possible over the entire measurement surface.
実施例
以下本発明の一実施例を添付図面にもとづいて説明する
。EXAMPLE Hereinafter, an example of the present invention will be described based on the accompanying drawings.
第３図は構成図を示すが、３１はプリント基板の穴検出
部で、穴の検出、穴の大きさを測定する。FIG. 3 shows a configuration diagram. Reference numeral 31 denotes a hole detection section of the printed circuit board, which detects holes and measures the size of the holes.
３３は入力回路で外部装置３６からの測定条件等の信号
を受ける回路である。３２は演算処理部で。Reference numeral 33 denotes an input circuit which receives signals such as measurement conditions from an external device 36. 32 is an arithmetic processing unit.
穴検出部３１からの信号を入力回路３３より送られた測
定条件に従がって必要な演算を行う。３４は出力回路で
、演算処理部２からの信号を必要な形態に変換し外部装
置３６に出力する。次に具体例について説明する。Necessary calculations are performed on the signal from the hole detection section 31 according to the measurement conditions sent from the input circuit 33. 34 is an output circuit that converts the signal from the arithmetic processing section 2 into a necessary form and outputs it to the external device 36. Next, a specific example will be explained.
第１図において１３は密着形イメージセンサであり、被
検査体であるプリント基板１６をコンベア１６にて密着
形イメージセンサ１３の下を通過させる。この時光源１
４からの元がプリント基板１５の穴を通過して、密着形
イメージセンサ３内の受光面に穴の大きさ、配列に応じ
た明暗模様を作り、受光素子により明暗模様に応じた電
気信号に変換される。この信号変換はプリント基板６が
密着形イメージセンサ３の下を通過している間連続的に
行われる。In FIG. 1, reference numeral 13 denotes a contact type image sensor, and a printed circuit board 16, which is an object to be inspected, is passed under the contact type image sensor 13 on a conveyor 16. At this time, light source 1
The source from 4 passes through the holes in the printed circuit board 15, creates a bright and dark pattern on the light-receiving surface of the contact image sensor 3 according to the size and arrangement of the holes, and is converted into an electrical signal by the light-receiving element according to the bright and dark pattern. converted. This signal conversion is continuously performed while the printed circuit board 6 passes under the contact type image sensor 3.
上記受光素子により電気信号に変換された信号は、マイ
クロコンピュータを組み込んだコントローラ１２内の演
算処理部に送られる。この演算処理部では上記受光素子
からの電気信号を基に、被検査プリント基板１６内の穴
の数、穴の大きさ。The signal converted into an electric signal by the light receiving element is sent to an arithmetic processing section in the controller 12 incorporating a microcomputer. This arithmetic processing section determines the number of holes and the size of the holes in the printed circuit board 16 to be inspected based on the electric signal from the light receiving element.
穴の形状等を予かしめ外部入力装置１１より入力された
測定条件に従がって演算を行う。プリント基板１６が密
着形イメージセンサ１３の下を通過し終った時点で、上
記演算処理部はコントローラ１２内の出力回路に演算結
果を送り出す。この出力回路は外部に接続される装置１
１に応じた信号を出力するために必要な信号変換を行う
。この実施列では外部人出装置としてパソコンを使用し
たもので、検査結果の一例を第１表に示す。The shape of the hole, etc. is determined in advance, and calculations are performed according to the measurement conditions inputted from the external input device 11. When the printed circuit board 16 finishes passing under the contact image sensor 13, the arithmetic processing section sends the arithmetic result to the output circuit in the controller 12. This output circuit is connected to the device 1 externally.
Performs signal conversion necessary to output a signal according to 1. In this implementation series, a personal computer was used as the device for external identification, and an example of the test results is shown in Table 1.
第１表
発明の効果
この発明は以上説明したように、密着形イメ°−ジセン
サの視野全体に渡り一様な検出特性があるため、被検査
体のプリント基板全面に渡り精度良く且つ密着形イメー
ジセンサの持つ分解能いっばいの小さな穴まで測定可能
である。しかも従来技術に比べて光学系の調整の簡素化
と光路長の大幅な削減が可能で、システムの小形がはか
れる効果がある。又密着形イメージセンサはファクシミ
リ装置に使用されており大量に生産されており非常に低
価格で入手可能のためのシステムの低価格化にも効果が
ある。Table 1 Effects of the Invention As explained above, this invention has uniform detection characteristics over the entire field of view of the contact type image sensor, so that it can accurately and closely image the entire printed circuit board of the object to be inspected. It is possible to measure even the smallest holes with the highest resolution of the sensor. Moreover, compared to the conventional technology, it is possible to simplify the adjustment of the optical system and significantly reduce the optical path length, which has the effect of making the system more compact. Further, contact image sensors are used in facsimile machines, are produced in large quantities, and are available at very low prices, which is effective in reducing the cost of the system.
第１図は本発明の一実施例におけるプリント基板検査装
置の概略斜視図、第２図は密着形イメージセンサの断面
図、第３図はプリント基板検査装置１・・・・・・外部
入出力装置、１２・・・・・・コントローラ％１３・・
・・・・密着形イメージセンサ、１４・・・・・・光源
。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第３
図
第４図Fig. 1 is a schematic perspective view of a printed circuit board inspection device according to an embodiment of the present invention, Fig. 2 is a sectional view of a contact type image sensor, and Fig. 3 is a printed circuit board inspection device 1...external input/output. Device, 12... Controller% 13...
...Contact image sensor, 14...Light source. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 3
Figure 4
Claims (1)
する装置で、プリント基板の穴検出部と、この穴検出部
からの測定データと予め設定した基準値とを比較しプリ
ント基板の良否を判断する演算処理部とから構成され、
プリント基板の穴検出部が密着形イメージセンサを使用
したことを特徴とするプリント基板検査装置。This is a device that inspects the number of holes, hole size, hole shape, etc. on a printed circuit board, and compares the measurement data from the hole detection section of the printed circuit board with a preset reference value. It consists of an arithmetic processing unit that determines the quality of the
A printed circuit board inspection device characterized in that a hole detection section of the printed circuit board uses a contact type image sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31135586A JPS63163150A (en) | 1986-12-25 | 1986-12-25 | Printed circuit board inspecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31135586A JPS63163150A (en) | 1986-12-25 | 1986-12-25 | Printed circuit board inspecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63163150A true JPS63163150A (en) | 1988-07-06 |
Family
ID=18016158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31135586A Pending JPS63163150A (en) | 1986-12-25 | 1986-12-25 | Printed circuit board inspecting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63163150A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02105155U (en) * | 1989-02-08 | 1990-08-21 | ||
| JPH03276092A (en) * | 1990-03-26 | 1991-12-06 | Rohm Co Ltd | Article array state detecting device for jig for article array |
| WO2000007031A1 (en) * | 1998-07-28 | 2000-02-10 | Matsushita Electric Works, Ltd. | Inspection system for inspecting discrete wiring patterns formed on a continuous substrate sheet of a flexible material |
| KR101195694B1 (en) | 2010-06-18 | 2012-10-29 | 마하비전 아이엔씨. | Method for inspecting defects of power layer and ground layer of pcb |
| ITMI20122131A1 (en) * | 2012-12-13 | 2014-06-14 | Bancor Srl | OPTICAL READER FOR DOCUMENTS WITH PRINTED AND / OR PERFORATED AREAS |
| CN105699386A (en) * | 2016-02-29 | 2016-06-22 | 东华大学 | Automatic cloth inspection marking method adopting contact image sensor |
| CN105738376A (en) * | 2016-02-29 | 2016-07-06 | 东华大学 | Automatic cloth inspection machine using contact image sensor |
| CN105784712A (en) * | 2016-02-29 | 2016-07-20 | 东华大学 | Automatic cloth inspecting method adopting contact type image sensor |
| CN111929305A (en) * | 2020-09-22 | 2020-11-13 | 维嘉数控科技（苏州）有限公司 | Detection device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62276443A (en) * | 1986-05-24 | 1987-12-01 | Kyoei Sangyo Kk | Automatic inspection machine for flaw of hole |
-
1986
- 1986-12-25 JP JP31135586A patent/JPS63163150A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62276443A (en) * | 1986-05-24 | 1987-12-01 | Kyoei Sangyo Kk | Automatic inspection machine for flaw of hole |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02105155U (en) * | 1989-02-08 | 1990-08-21 | ||
| JPH03276092A (en) * | 1990-03-26 | 1991-12-06 | Rohm Co Ltd | Article array state detecting device for jig for article array |
| WO2000007031A1 (en) * | 1998-07-28 | 2000-02-10 | Matsushita Electric Works, Ltd. | Inspection system for inspecting discrete wiring patterns formed on a continuous substrate sheet of a flexible material |
| US6700603B1 (en) | 1998-07-28 | 2004-03-02 | Matsushita Electric Works, Ltd. | Inspection system for inspecting discrete wiring patterns formed on a continuous substrate sheet of a flexible material |
| KR101195694B1 (en) | 2010-06-18 | 2012-10-29 | 마하비전 아이엔씨. | Method for inspecting defects of power layer and ground layer of pcb |
| ITMI20122131A1 (en) * | 2012-12-13 | 2014-06-14 | Bancor Srl | OPTICAL READER FOR DOCUMENTS WITH PRINTED AND / OR PERFORATED AREAS |
| EP2743863A1 (en) * | 2012-12-13 | 2014-06-18 | Bancor SRL | Optical reader for documents with perfored and printed zones |
| CN105699386A (en) * | 2016-02-29 | 2016-06-22 | 东华大学 | Automatic cloth inspection marking method adopting contact image sensor |
| CN105738376A (en) * | 2016-02-29 | 2016-07-06 | 东华大学 | Automatic cloth inspection machine using contact image sensor |
| CN105784712A (en) * | 2016-02-29 | 2016-07-20 | 东华大学 | Automatic cloth inspecting method adopting contact type image sensor |
| CN111929305A (en) * | 2020-09-22 | 2020-11-13 | 维嘉数控科技（苏州）有限公司 | Detection device |
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