JPS63162563U - - Google Patents
Info
- Publication number
- JPS63162563U JPS63162563U JP5560687U JP5560687U JPS63162563U JP S63162563 U JPS63162563 U JP S63162563U JP 5560687 U JP5560687 U JP 5560687U JP 5560687 U JP5560687 U JP 5560687U JP S63162563 U JPS63162563 U JP S63162563U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- metal layer
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 2
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5560687U JPS63162563U (zh) | 1987-04-13 | 1987-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5560687U JPS63162563U (zh) | 1987-04-13 | 1987-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63162563U true JPS63162563U (zh) | 1988-10-24 |
Family
ID=30883654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5560687U Pending JPS63162563U (zh) | 1987-04-13 | 1987-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63162563U (zh) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135591A (ja) * | 1996-10-29 | 1998-05-22 | Matsushita Electric Ind Co Ltd | 熱伝導性基板および熱伝導性配線基板 |
| JP2006173290A (ja) * | 2004-12-15 | 2006-06-29 | Nec Corp | 携帯端末機器及び放熱方法 |
| JP2007019214A (ja) * | 2005-07-07 | 2007-01-25 | Nec Corp | 電子機器 |
| JP2009224720A (ja) * | 2008-03-18 | 2009-10-01 | Tdk Corp | 電子モジュールおよび電子装置 |
-
1987
- 1987-04-13 JP JP5560687U patent/JPS63162563U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135591A (ja) * | 1996-10-29 | 1998-05-22 | Matsushita Electric Ind Co Ltd | 熱伝導性基板および熱伝導性配線基板 |
| JP2006173290A (ja) * | 2004-12-15 | 2006-06-29 | Nec Corp | 携帯端末機器及び放熱方法 |
| JP4556174B2 (ja) * | 2004-12-15 | 2010-10-06 | 日本電気株式会社 | 携帯端末機器及び放熱方法 |
| JP2007019214A (ja) * | 2005-07-07 | 2007-01-25 | Nec Corp | 電子機器 |
| JP4529823B2 (ja) * | 2005-07-07 | 2010-08-25 | 日本電気株式会社 | 電子機器 |
| JP2009224720A (ja) * | 2008-03-18 | 2009-10-01 | Tdk Corp | 電子モジュールおよび電子装置 |