JPS63160769A - Soldering robot - Google Patents
Soldering robotInfo
- Publication number
- JPS63160769A JPS63160769A JP30660186A JP30660186A JPS63160769A JP S63160769 A JPS63160769 A JP S63160769A JP 30660186 A JP30660186 A JP 30660186A JP 30660186 A JP30660186 A JP 30660186A JP S63160769 A JPS63160769 A JP S63160769A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- iron
- moving
- soldering iron
- place
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 140
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 108
- 229910052742 iron Inorganic materials 0.000 claims abstract description 54
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、コテを設置プたハンダ装置を備えるハンダ付
ロボットに関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a soldering robot equipped with a soldering device in which a soldering iron is installed.
（従来の技術）
ハンダ付作業を行うハンダ付ロボットは、ハンダ装置と
、ハンダ装置を移動させる移動装置と、移動５Ａ置の制
御を行う制御装置とから構成されている。(Prior Art) A soldering robot that performs soldering work includes a soldering device, a moving device that moves the soldering device, and a control device that controls the moving 5A position.
ハンダ装置には、ハンダ付が行われる箇所を加熱するコ
テと、ハンダをコテに供給する供給機構とが設けられて
いる。The soldering device is provided with a soldering iron that heats a location to be soldered, and a supply mechanism that supplies solder to the soldering iron.
コテは、ハンダ箇所に対し所定の角度を保持するように
設定され、コテ先の方向に移動可能にしてハンダ装置に
設【プられてている。The soldering iron is set to maintain a predetermined angle with respect to the soldering location, and is installed in the soldering device so as to be movable in the direction of the soldering iron tip.
そして、移動ｔＡ置は、ハンダ装置を立体的に移動させ
必要に応じハンダ装置の水平方向の回転を行う。In the movement tA position, the soldering device is moved three-dimensionally and the soldering device is rotated in the horizontal direction as required.
（従来技術の問題点）
以上のごとく構成されたハンダ付ロボットは、ハンダ装
置の移動制御を制御装置に組みこまれたプログラムによ
り行われ、同一作業の繰返し、また、プログラムの切替
により多品種少０生産に対応することが行われる。(Problems with the conventional technology) In the soldering robot configured as described above, the movement of the soldering device is controlled by a program built into the control device. Corresponding to zero production is carried out.
実際のハンダ付り作業は、一般に次のように行なわれて
いる。Actual soldering work is generally performed as follows.
まず、コテをプリント回路基盤また゛は端子等に装着さ
れている半導体や抵抗等の電気的素子のハンダ付箇所近
傍に移動させる。First, the soldering iron is moved to the vicinity of the soldering location of an electrical element such as a semiconductor or a resistor attached to a printed circuit board or a terminal.
その後、コテを設定された角度の方向に下降し、プリン
ト回路塁盤苫と電気的素子の足（リードともいう）とに
より作られるハンダ付対象箇所に移動させ、コテ先をハ
ンダ付箇所に当接し、当接面に所定の圧力が発生するま
で付勢する。After that, lower the iron in the direction of the set angle and move it to the soldering target area created by the printed circuit base plate and the legs (also called leads) of the electrical element, and touch the soldering iron tip to the soldering area. The contact surface is pressed until a predetermined pressure is generated on the contact surface.
しかし、加工物のハンダ付箇所が加工物の製作段階の材
料寸法の不均一、ないし加工誤差等により所定位置に対
しずれが発生することがある。However, the soldering part of the workpiece may deviate from the predetermined position due to non-uniformity of material dimensions or processing errors during the manufacturing stage of the workpiece.
このとき、従来のハンダ付ロボットは、コテの移動方向
が固定されることで、個々のパンダイ１箇所の位置ずれ
に対応することが不可能でめった。At this time, in conventional soldering robots, the direction of movement of the soldering iron is fixed, and it is therefore impossible to cope with the displacement of one position of each soldering die.
例えば、コテが所定の位置に移動した際、加工物のハン
ダ刊箇所が正規の位置に対してコテより遠ざかる状態に
ある場合は、コテとハンダ付箇所との間に隙間を生じハ
ンダ付が不完全となる。For example, when the soldering iron moves to a predetermined position, if the soldering part of the workpiece is moved away from the soldering iron from its normal position, a gap will be created between the soldering iron and the soldering part, resulting in failure of soldering. Become complete.
また、コテが近傍の位置にり所定の位置に移動する際に
、ハンダ付が行われる電気的素子の足のハンダ付箇所よ
り離れた箇所に直接当たり、電気的素子の足を折曲げる
ことが発生する。In addition, when the soldering iron moves to a nearby position and moves to a predetermined position, it may directly hit a part of the leg of the electrical element to be soldered that is far away from the soldering part, causing the leg of the electrical element to be bent. Occur.
第３図は、従来のハンダ付ロボットによりハンダ付箇所
が所定の位置よりずれた場合の不都合の発生状況の・−
例を示した図である。Figure 3 shows the situation where a problem occurs when the soldering point shifts from the predetermined position using a conventional soldering robot.
It is a figure showing an example.
本発明の目的は、簡易な構成で、所定位置からずれたハ
ンダ付箇所にコテが対応可能なハンダ付ロボットを提供
する。An object of the present invention is to provide a soldering robot that has a simple configuration and is capable of handling a soldering iron at a soldering location that is deviated from a predetermined position.
（問題点を解決するための手段）
以上の目的を達成するために、本発明において、コテを
設けたハンダ装置を備えるハンダ付ロボットにおいて、
ハンダ装置の支持機構にコテの移動方向と垂直に回転軸
を設（ブる。(Means for Solving the Problems) In order to achieve the above object, in the present invention, in a soldering robot equipped with a soldering device provided with a soldering iron,
A rotating shaft is installed in the support mechanism of the soldering device perpendicular to the direction of movement of the iron.
（作用）
ハンダ装置の支持機構にコテの移動方向に垂直な回転軸
を設【プたことにより、ハンダ装置を揺動可能にする。(Function) By providing the support mechanism of the soldering device with a rotating shaft perpendicular to the moving direction of the iron, the soldering device can be swung.
（実施例） 以下本発明の一実施例を図面に基づいて説明する。(Example) An embodiment of the present invention will be described below based on the drawings.
ハンダ付ロボット１には、ハンダに＠２を水平方向の回
転と立体的に移動させる図には示されていない移動装置
と、移動装置を駆動する駆動装置と、駆動装置とハンダ
装置２を制御する制ｔ！（Ｉ装置とが設けられている。The soldering robot 1 includes a moving device (not shown in the figure) that horizontally rotates and three-dimensionally moves @2 on the solder, a drive device that drives the moving device, and a drive device that controls the soldering device 2. The system to do it! (I device is provided.
ハンダ装置２は、移動装置の水平方向回転可能に構成さ
れた装着部にハンダ装置２の取付は部３が固定され、ハ
ンダ装置２が吊下げられた状態にて装着されている。The soldering device 2 has an attachment portion 3 fixed to a mounting portion of the moving device that is configured to be horizontally rotatable, and the soldering device 2 is mounted in a suspended state.
取付は部３には、ハンダ装置２に設けられるコテ４の移
動方向に対して、垂直な回転軸を設けた回転軸５が設け
られている。The mounting portion 3 is provided with a rotating shaft 5 that is perpendicular to the moving direction of a soldering iron 4 provided in the soldering device 2 .
そして、ハンダ装＠２には、ハンダ付を行うコテ４とコ
テ４の移動方向を規定する動作案内部６が設【プられ、
回転軸５に回動可能に取付けられている。The soldering iron 2 is provided with a soldering iron 4 and an operation guide section 6 that defines the moving direction of the soldering iron 4.
It is rotatably attached to the rotating shaft 5.
また、ハンダガイド装置７が、ハンダ付は作業に使用さ
れるハンダをコテ４に導くようハンダ装置２に設けられ
ている。Further, a solder guide device 7 is provided in the soldering device 2 to guide solder used for soldering work to the iron 4.
さらに、コテ４を前方に移動させる移動装置８が、弾性
体としてのスプリング９を介在させてコテ４の後方に設
けられている。Further, a moving device 8 for moving the iron 4 forward is provided behind the iron 4 with a spring 9 interposed therebetween as an elastic body.
コテ４は、移動装＠８によりハンダ付箇所１０に当接さ
れ、ざらにコテ４とハンダ付箇所１０との間に所定の圧
力を発生するため、前方に付勢される。The iron 4 is brought into contact with the soldering location 10 by the movable device @8, and is biased forward in order to roughly generate a predetermined pressure between the soldering iron 4 and the soldering location 10.
このとき、移動装置８の動作部がコテ４をハンダ付箇所
１０にイリカするために、コテ４が当接した際の位置よ
りざらに移動し、従って当接後のコテ４と移動装置８と
の闇の距離が変化する。At this time, in order to apply the soldering iron 4 to the soldering location 10, the operating part of the moving device 8 moves roughly from the position when the iron 4 made contact, so that the soldering iron 4 and the moving device 8 after making contact are The distance of darkness changes.
ここで、スプリング９がコテ４をハンダ付箇所１０に付
勢することで発生するコテ４と移動装置８の動作部との
間隔の変化を吸収する。Here, the spring 9 absorbs a change in the distance between the soldering iron 4 and the moving part of the moving device 8, which occurs when the soldering iron 4 is urged against the soldering location 10.
スプリング１１が、ハンダ装置２の姿勢を一定に保持す
る姿勢保持装置として、ハンダ装置２のコテ４とは反対
側に、ハンダ装置２と取付は部３とに掛けて設【プられ
ている。A spring 11 is provided on the side of the soldering device 2 opposite to the soldering iron 4, as a posture holding device for keeping the posture of the soldering device 2 constant, and hooked onto the soldering device 2 and the mounting portion 3.
ハンダ付を行う際には、まずハンダ装置２をハンダ付を
行う所定の位置に対してその近傍に移動し、ハンダ付箇
所１０がコテ４の動作方向の前方に位置する状態にする
。When performing soldering, first the soldering device 2 is moved near a predetermined position where soldering is to be performed, so that the soldering location 10 is positioned in front of the operating direction of the iron 4.
その後、ハンダ装置２をハンダ付箇所１０に移動させハ
ンダ付箇所１０にコテ４を当接させ、ざらに、コテ４と
ハンダ付箇所１０との間の圧力が所定の大きさになるま
で移動装置８を作動させる。Thereafter, the soldering device 2 is moved to the soldering location 10, the soldering iron 4 is brought into contact with the soldering location 10, and the moving device is roughly moved until the pressure between the soldering iron 4 and the soldering location 10 reaches a predetermined level. Activate 8.
この時、以上の構成により、コテ４が第２図に示される
ような動作をする。At this time, with the above configuration, the iron 4 operates as shown in FIG. 2.
第２図は、加工物のハンダ付箇所１０がハンダ装置２に
対し所定の位置より遠くにずれた状態を示している。FIG. 2 shows a state in which the soldering point 10 of the workpiece is displaced from a predetermined position with respect to the soldering device 2. As shown in FIG.
第２図において、一点鎖線にて示されたハンダ装置２の
外形はハンダ付箇所１０の近傍に移動した際の姿勢を示
し、実線にて示されたハンダ装置２の外形は近傍よりハ
ンダ装［２を所定のハンダ付位置に移動した際の姿勢を
示す。In FIG. 2, the outer shape of the soldering device 2 shown by the dashed line shows the attitude when it is moved near the soldering location 10, and the outer shape of the soldering device 2 shown by the solid line shows the soldering device 2 from the vicinity. 2 is shown when it is moved to a predetermined soldering position.
図に示されるように、ハンダ装置２をハンダ付位置の近
傍より、ハンダ付位置に移動することでコテ４は電気的
素子の足１２と当接する。As shown in the figure, by moving the soldering device 2 from the vicinity of the soldering position to the soldering position, the iron 4 comes into contact with the legs 12 of the electrical element.
さらに、当接後もハンダ装置２を移動し続けると、コテ
４は水平方向の抵抗力（矢印Ａ）を足１２より受【プ、
コテ４は抵抗力の分力（矢印Ｂ）により下に逃げるよう
移動する。Furthermore, if the soldering device 2 continues to be moved after contact, the soldering iron 4 will receive a horizontal resistance force (arrow A) from the foot 12.
The iron 4 moves downward due to the component of the resistance force (arrow B).
下に移動したコテ４は、ハンダ付箇所１０と当接し、ハ
ンダ装＠２の移動に従いハンダ付箇所１０に付勢される
。The iron 4 that has moved downward comes into contact with the soldering location 10 and is urged against the soldering location 10 as the soldering iron 2 moves.
以上のハンダ装置の支持機構にコテの移動方向に垂直な
回転軸を設けたことにより、ハンダ装置がコテの移動方
向に対して、揺動可能となる。By providing the support mechanism of the soldering device with a rotating shaft perpendicular to the moving direction of the iron, the soldering device can swing relative to the moving direction of the iron.
このように、ハンダ装置がコテに受ける抵抗力に従い、
抵抗力の分力を利用し、姿勢を変化させることが可能と
なる。In this way, according to the resistance force that the soldering device receives from the iron,
It becomes possible to change the posture by using the component of the resistance force.
また、ハンダ装置の姿勢が変化することで、ハンダ装置
を通常のハンダ付箇所の位置ずれに対応させることが可
能となる。Further, by changing the attitude of the soldering device, it becomes possible to adapt the soldering device to the positional shift of the normal soldering location.
（効采）
以上本発明の構成をとることにより、加工物のハンダ付
箇所の位置ずれに対応可能なハンダ付ロボットとなる。(Effectiveness) By employing the configuration of the present invention as described above, a soldering robot that can cope with misalignment of the soldering location of a workpiece can be obtained.
ざらに、ハンダ装置がハンダ付箇所の位置づれに対応可
能となることで、ハンダ付は作業を必要とする電ｔａ機
器の加工寸法ｒＪ度を緩和することが可能となる。In general, since the soldering device can cope with misalignment of the soldering location, it becomes possible to reduce the machining dimension rJ degree of the electrical equipment that requires soldering work.
第１図は、本発明によるハンダ付ロボットの構成の概要
を示す図、第２図は、本発明の一実施例によるのハンダ
装置の動作を示す図、第３図は、従来のハンダ付ロボッ
トによる不都合の発生状況の一例を示した図である。
１・・・ハンダ付ロボット、 ２・・・ハンダ装置、３
・・・取付は部、 ４・・・コテ、 ５・・・回転軸、
６・・・動作案内部、 ７・・・ハンダガイド装置、
８・・・移動装置、 ９．１１・・・スプリング、
１０・・・ハンダ付箇所、 １２・・・足。FIG. 1 is a diagram showing an outline of the configuration of a soldering robot according to the present invention, FIG. 2 is a diagram showing the operation of a soldering device according to an embodiment of the present invention, and FIG. 3 is a diagram showing a conventional soldering robot. FIG. 2 is a diagram showing an example of a situation where an inconvenience occurs due to. 1... Soldering robot, 2... Soldering device, 3
...Installation is done by 4.Tolding iron, 5.Rotating shaft,
6... Operation guide unit, 7... Solder guide device,
8...Movement device, 9.11...Spring,
10... Soldering point, 12... Feet.
Claims (1)
いて、ハンダ装置の支持機構にコテの移動方向に垂直な
回転軸を設けたことを特徴とするハンダ付ロボット。A soldering robot equipped with a soldering device provided with a soldering iron, characterized in that a support mechanism of the soldering device is provided with a rotation axis perpendicular to the moving direction of the soldering iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30660186A JPS63160769A (en) | 1986-12-24 | 1986-12-24 | Soldering robot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30660186A JPS63160769A (en) | 1986-12-24 | 1986-12-24 | Soldering robot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63160769A true JPS63160769A (en) | 1988-07-04 |
Family
ID=17959035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30660186A Pending JPS63160769A (en) | 1986-12-24 | 1986-12-24 | Soldering robot |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63160769A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH071115A (en) * | 1992-11-06 | 1995-01-06 | Tsukuba Seiki Kk | Automatic continuous soldering device and method for controlling feeding speed of thread solder |
| JP2010167473A (en) * | 2009-01-26 | 2010-08-05 | Shoichi Kitano | Wire actuator with automatic soldering iron |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54112758A (en) * | 1978-02-23 | 1979-09-03 | Nitto Seiko Kk | Automatic soldering machine |
-
1986
- 1986-12-24 JP JP30660186A patent/JPS63160769A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54112758A (en) * | 1978-02-23 | 1979-09-03 | Nitto Seiko Kk | Automatic soldering machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH071115A (en) * | 1992-11-06 | 1995-01-06 | Tsukuba Seiki Kk | Automatic continuous soldering device and method for controlling feeding speed of thread solder |
| JP2010167473A (en) * | 2009-01-26 | 2010-08-05 | Shoichi Kitano | Wire actuator with automatic soldering iron |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100374438B1 (en) | Electronic-parts Mounting Apparatus | |
| JP4100741B2 (en) | Component mounting apparatus and method | |
| JP6404957B2 (en) | Machining system with a robot that transports workpieces to the processing machine | |
| US6576183B1 (en) | Profile cutting apparatus | |
| JPS63160769A (en) | Soldering robot | |
| KR970030318A (en) | Component Mounting Device | |
| JPH05131389A (en) | Object handling device | |
| JP7145332B2 (en) | Robot control system and robot control method | |
| JPH0985671A (en) | Small-size articulated robot device | |
| JP2005081477A (en) | Automatic polishing device | |
| JPS5851026A (en) | Automatic assembly device | |
| JPH07185827A (en) | Welding equipment provided with turn table | |
| JP2636285B2 (en) | Electronic component mounting device | |
| JP2000079513A (en) | Automatic working device | |
| JPH0536584Y2 (en) | ||
| JP2002273673A (en) | Pick-and-place unit | |
| JP4765199B2 (en) | Component mounting equipment | |
| CN110139548B (en) | Suction nozzle assembly for component mounting machine and driving system of suction nozzle assembly | |
| JP6913718B2 (en) | Electronic component mounting system and board production method | |
| JP3813701B2 (en) | Electronic component mounting apparatus and method | |
| JPH02180580A (en) | Origin adjusting device for industrial robot | |
| JPS62187574A (en) | Welding robot with sensor | |
| KR200161516Y1 (en) | Apparatus for mounting part | |
| JPS6044052B2 (en) | bending machine | |
| JP2000039919A (en) | Method and device for positioning component |