JPS63157949U - - Google Patents
Info
- Publication number
- JPS63157949U JPS63157949U JP5112387U JP5112387U JPS63157949U JP S63157949 U JPS63157949 U JP S63157949U JP 5112387 U JP5112387 U JP 5112387U JP 5112387 U JP5112387 U JP 5112387U JP S63157949 U JPS63157949 U JP S63157949U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- insulating resin
- electronic component
- hybrid integrated
- resin covering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000012528 membrane Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5112387U JPS63157949U (en:Method) | 1987-04-03 | 1987-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5112387U JPS63157949U (en:Method) | 1987-04-03 | 1987-04-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157949U true JPS63157949U (en:Method) | 1988-10-17 |
Family
ID=30875096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5112387U Pending JPS63157949U (en:Method) | 1987-04-03 | 1987-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157949U (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03167868A (ja) * | 1989-11-28 | 1991-07-19 | Nec Corp | シールド機能を有する集積回路装置及び製造方法 |
-
1987
- 1987-04-03 JP JP5112387U patent/JPS63157949U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03167868A (ja) * | 1989-11-28 | 1991-07-19 | Nec Corp | シールド機能を有する集積回路装置及び製造方法 |