JPS63157793A - Ni base crystalline rapidly solidified brazing filler metal foil - Google Patents
Ni base crystalline rapidly solidified brazing filler metal foilInfo
- Publication number
- JPS63157793A JPS63157793A JP30594986A JP30594986A JPS63157793A JP S63157793 A JPS63157793 A JP S63157793A JP 30594986 A JP30594986 A JP 30594986A JP 30594986 A JP30594986 A JP 30594986A JP S63157793 A JPS63157793 A JP S63157793A
- Authority
- JP
- Japan
- Prior art keywords
- less
- ribbon
- max
- corrosion resistance
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 30
- 239000002184 metal Substances 0.000 title abstract description 20
- 229910052751 metal Inorganic materials 0.000 title abstract description 20
- 239000000945 filler Substances 0.000 title abstract description 4
- 239000011888 foil Substances 0.000 title abstract 3
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 23
- 239000000956 alloy Substances 0.000 claims abstract description 23
- 238000001816 cooling Methods 0.000 claims abstract description 20
- 239000013078 crystal Substances 0.000 claims abstract description 14
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 abstract description 26
- 230000007797 corrosion Effects 0.000 abstract description 26
- 229910052750 molybdenum Inorganic materials 0.000 abstract description 4
- 238000007711 solidification Methods 0.000 abstract description 2
- 230000008023 solidification Effects 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 238000005304 joining Methods 0.000 description 7
- 238000010791 quenching Methods 0.000 description 7
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 241000272534 Struthio camelus Species 0.000 description 4
- 239000010953 base metal Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229910001339 C alloy Inorganic materials 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002178 crystalline material Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007712 rapid solidification Methods 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- BQJTUDIVKSVBDU-UHFFFAOYSA-L copper;sulfuric acid;sulfate Chemical compound [Cu+2].OS(O)(=O)=O.[O-]S([O-])(=O)=O BQJTUDIVKSVBDU-UHFFFAOYSA-L 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
- B23K35/304—Ni as the principal constituent with Cr as the next major constituent
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、Ni基粘結晶質冷凝固:1″1)、特に接合
部耐食性に優れたNi基拮晶實惣冷・疑固ろう薄帯およ
びその製造方法に関する。Detailed Description of the Invention (Industrial Field of Application) The present invention is directed to Ni-based viscous crystal cold solidification: 1"1), especially Ni-based viscous crystalline cold-solidified thin solidified solidified solidified solidified solidified solidified 1"1), which has particularly excellent joint corrosion resistance. Related to obi and its manufacturing method.
本発明にかかるろう薄帯は、各種ステンレス鋼、および
高合金鋼のろう接に特に有効である。The brazing ribbon according to the present invention is particularly effective for brazing various stainless steels and high alloy steels.
(従来の技術)
従来、ステンレス鋼等のろう付材料としてNi1合金の
ろう材が使用されてきているが、その融点を低下させる
ためにB、Si等を20 atχ程度添加した共晶近傍
の組成のものが用いられている。このようなり、Si等
の脆化元素を多量に添加したものでは圧延等によって1
板とすることはほとんど不可能であって、また、鋳塊の
切断等の方法でろう付インサート材に適した100μm
以下の厚さの薄板としても非常に跪く、切断作業時に破
壊してしまう。そこで、通常は、各成分を粉末状にしバ
インダーで固めて使用している。そのため、ろう付は接
合時にバインダーの昇華、および粉末表面の酸化等によ
り接合部にボイドが発生し接合強度、耐食性等の劣化を
引き起こしていた。(Prior art) Conventionally, a Ni1 alloy brazing material has been used as a brazing material for stainless steel, etc., but in order to lower the melting point, B, Si, etc. are added to about 20 atχ to create a near-eutectic composition. are used. In this way, when a large amount of embrittlement elements such as Si are added, rolling etc.
It is almost impossible to make a plate with a thickness of 100 μm, which is suitable for brazing insert material, by cutting an ingot or other methods.
Even thin plates with a thickness of less than 100 mL are very fragile and break during cutting operations. Therefore, each component is usually powdered and solidified with a binder before use. Therefore, during brazing, voids are generated in the joint due to sublimation of the binder and oxidation of the powder surface, resulting in deterioration of joint strength, corrosion resistance, etc.
また、近年、特公昭58−15234号で開示された溶
湯超急冷法によるNi基非晶質薄帯も用いられてきてい
る。この方法によれば、バインダーを用いずに頂板状に
形成されているため、ろう付は接合時にバインダーの昇
華等によるボイドは発生せず接合部の強度は改善される
も、ステンレス鋼を接合した場合、接合部の耐食性が母
材と同等以上にはならず腐食環境下で使用した場合、接
合部近傍が溶出分断するという欠点があった。Furthermore, in recent years, Ni-based amorphous ribbon produced by the molten metal ultra-quenching method disclosed in Japanese Patent Publication No. 15234/1983 has also been used. According to this method, since the top plate is formed without using a binder, brazing does not generate voids due to sublimation of the binder during joining and the strength of the joint is improved, but it is difficult to join stainless steel. In this case, the corrosion resistance of the joint was not equal to or better than that of the base metal, and when used in a corrosive environment, there was a drawback that the vicinity of the joint would elute and split.
一方、そのような非晶質薄帯は、作製時の冷却速度に強
く依存し、比較的厚い(50μを以上)薄帯を作製しよ
うとすると、薄いものを作る場合に比べ冷却速度が低下
し、非晶質とするのが困難である。非晶質となるような
り、Siの高い組成では非晶質化できなかった場合非常
に脆くなるため、このような組成では厚さ50〜200
μm程度の延性に富んだ薄帯を安定して製造すること
は困難である。比較的母材間隙の広い接合部のろう付の
場合に適合する50〜200 μmF¥のろう薄帯が製
造できないという欠点もあった。On the other hand, such amorphous ribbons strongly depend on the cooling rate during fabrication, and when attempting to fabricate relatively thick (more than 50μ) ribbons, the cooling rate decreases compared to when fabricating thin ones. , it is difficult to make it amorphous. If it cannot be made amorphous with a high Si content, it will become extremely brittle.
It is difficult to stably produce a ribbon with high ductility on the order of μm. Another drawback was that it was not possible to produce a solder ribbon of 50 to 200 μmF, which was suitable for brazing joints with a relatively wide gap between base materials.
(発明が解決しようとする問題点)
本発明の目的は、ステンレス鋼、Ni基合金等の高合金
の接合強度、接合部耐食性に優れたろう併用の均質で延
性に冨んだろう薄帯およびその製造方法を提供すること
である。(Problems to be Solved by the Invention) The object of the present invention is to provide a homogeneous and highly ductile brazing ribbon for use in combination with a brazing material, which has excellent joining strength and joint corrosion resistance for high alloys such as stainless steel and Ni-based alloys. An object of the present invention is to provide a manufacturing method.
(問題点を解決するための手段)
本発明者らは、上記目的を達成するため溶湯超急冷法に
よるろう薄帯の製造研究を積み重ねた結果、次のような
知見を得た。(Means for Solving the Problems) In order to achieve the above object, the present inventors have repeatedly conducted research on manufacturing wax ribbons using the molten metal super-quenching method, and have obtained the following knowledge.
(1) Cr、 Si、 Bを適量添加したNi基合金
を10μm以下、好ましくは2μm以下、より好ましく
は1μm以下の微細結晶粒からなる均質な薄帯とするこ
とで延性に冨んだ薄帯となる。(1) A thin ribbon with high ductility can be obtained by forming a homogeneous ribbon consisting of fine crystal grains of 10 μm or less, preferably 2 μm or less, more preferably 1 μm or less, from a Ni-based alloy to which appropriate amounts of Cr, Si, and B are added. becomes.
(2)B、Cr量が接合時の接合部耐食性に大きく影響
し、B:1wt%以下、Cr:10 wt%以上とする
ことにより、ステンレス鋼等の耐食性と同等以上の接合
部耐食性、および高い接合強度が得られる。(2) The amounts of B and Cr greatly affect the corrosion resistance of the joint during joining, and by setting B: 1 wt% or less and Cr: 10 wt% or more, the joint corrosion resistance is equal to or higher than that of stainless steel, etc. High bonding strength can be obtained.
(3)この合金組成では、従来の鋳造、圧延方法では非
常に脆く薄帯とできないにもかかわらず、溶湯超急冷法
を用いることで20〜200μm厚の薄帯に容易に成形
し得る。また、この方法により製造した薄帯は微細結晶
質となっているため従来の鋳造、圧延方法では考えられ
ないほどの延性を示し、ろう薄帯として十分な延性を有
している。(3) Although this alloy composition is extremely brittle and cannot be made into a thin strip using conventional casting and rolling methods, it can be easily formed into a thin strip with a thickness of 20 to 200 μm using a molten metal super-quenching method. Furthermore, since the ribbon produced by this method is finely crystalline, it exhibits ductility that would be unimaginable with conventional casting and rolling methods, and has sufficient ductility as a brazing ribbon.
(4)この合金組成は、特公昭58−15234号およ
び特公昭57−36075号に開示されている非晶質N
i基ろう薄帯の組成に近いが、Bを含有していても1w
t%以下と少量であるため、溶湯超急冷後でも完全に結
晶質となっており、これらの特許とは本質的に異なる。(4) This alloy composition is the amorphous N
The composition is close to that of i-based wax ribbon, but even though it contains B, it is 1w.
Since the amount is as small as t% or less, the molten metal remains completely crystalline even after ultra-quenching, which is essentially different from these patents.
また、非晶質となる組成でも板厚が50μm以上では冷
却速度が低下するため非晶質となりGこくく、非晶質と
ならない場合、非常に脆くなるが本発明合金では、もと
もと結晶質であるため板厚による影響を受けにく(容易
に50〜200μm厚の延性に冨んだ薄帯が製造可能で
ある。In addition, even if the composition is amorphous, if the plate thickness is 50 μm or more, the cooling rate decreases and the plate becomes amorphous.If it does not become amorphous, it becomes extremely brittle, but in the alloy of the present invention, it is originally crystalline. Therefore, it is not affected by the plate thickness (it is possible to easily produce a ductile ribbon with a thickness of 50 to 200 μm).
ここに、本発明の要旨とするところは、重量%で、
Cr: 10%以上、30%以下、Si:5%以上、1
0%以下、B : 0.001%以上、1 %以下、な
らびに、所望により、Fe: 30%以下、Co: 1
0%以下およびMo: 10%以下のうち少なくとも1
種をさらに含有し、残部が実質的にNiである、10μ
m以下の微細結晶からなるNi基結晶質急冷凝固ろう薄
帯である。Here, the gist of the present invention is, in weight%, Cr: 10% or more and 30% or less, Si: 5% or more, 1
0% or less, B: 0.001% or more, 1% or less, and if desired, Fe: 30% or less, Co: 1
0% or less and Mo: at least 1 of 10% or less
10μ further containing seeds, the remainder being substantially Ni
This is a Ni-based crystalline rapidly solidified wax ribbon consisting of microcrystals of less than m.
また、別の面からは、本発明の要旨とするところは
重量%で、
Cr: 10%以上、30%以下、Si:5%以上、1
0%以下、B : 0.001%以上、1%以下、なら
びに、所望によりFe: 30%以下、Co: 10%
以下およびMo: 10%以下のうち少なくとも1種を
さらに含有し、残部が実質的にll+である溶融合金を
移動更新する冷却体上に噴出し、10’’C/sec以
上の冷却速度で凝固冷却することを特徴とする10μm
以下の結晶粒からなるNt基結晶質急冷凝固ろう薄帯の
製造方法である。In addition, from another aspect, the gist of the present invention is in terms of weight%, Cr: 10% or more and 30% or less, Si: 5% or more, 1
0% or less, B: 0.001% or more, 1% or less, and optionally Fe: 30% or less, Co: 10%
A molten alloy further containing at least one of the following and Mo: 10% or less, the remainder being substantially ll+, is ejected onto a moving and renewing cooling body, and solidified at a cooling rate of 10''C/sec or more. 10μm characterized by cooling
This is a method for producing an Nt-based crystalline rapidly solidified brazing ribbon consisting of the following crystal grains.
(作用)
ここに、本発明において、合金組成を上述のように限定
した理由について詳述する。(Function) Here, in the present invention, the reason why the alloy composition is limited as described above will be explained in detail.
Cr:接合部の耐食性を向上させるため10wt%以上
添加し、一方、過剰に添加すると合金の融点が上昇し、
また接合部にσ相が析出し脆化するため30wt%以下
とする。好ましくは15〜25−t%である。Cr: Added at least 10 wt% to improve the corrosion resistance of the joint; on the other hand, excessive addition increases the melting point of the alloy.
Further, since the σ phase precipitates in the joint and causes embrittlement, the content should be 30 wt% or less. Preferably it is 15-25-t%.
Si:合金の融点が低下し、溶融時の流動性が向上し、
さらにろう付時の溶融ろうが接合部間隙の全体にゆきわ
たり易くするため、5wt%以上添加し、一方、過剰に
添加すると薄帯が脆化するため19wt%以下とする。Si: The melting point of the alloy is lowered, the fluidity during melting is improved,
Further, in order to make it easier for the molten solder during brazing to spread throughout the joint gap, it is added at least 5 wt %, and on the other hand, since the ribbon becomes brittle if added in excess, the amount is set at 19 wt % or less.
好ましくは6〜9&4t%である。Preferably it is 6 to 9&4t%.
B:合金の溶融時の流動性を向上させ、ろう付時の溶融
ろうが接合部間隙の全体にゆきわたり易くするため添加
するのが好ましい。しかし、余り多量に加えると薄帯が
脆化し、また、ろう付接合部の耐食性が劣化するため、
1胃(%以下とする。好ましくはQ、7 wt%t%以
下る。B: Preferably added in order to improve the fluidity of the alloy when it is melted and to make it easier for the molten solder during brazing to spread throughout the joint gap. However, if too much is added, the ribbon becomes brittle and the corrosion resistance of the brazed joint deteriorates.
1 stomach (not more than 1%. Preferably not more than Q, 7wt%t%).
F e + Co + M oについては所望により接
合部の強度改善に少なくとも1種添加するが、例えば、
構造材のろう付は等を行う場合には好ましい。Regarding Fe + Co + Mo, at least one kind may be added if desired to improve the strength of the joint, but for example,
Brazing of structural materials is preferred when performing such operations.
Fe:接合部の強度を向上させるため、もしくは高価な
Niの代替として添加することが好ましいが、あまり多
量に加えると、接合部の耐食性が劣化し、また合金の融
点が上昇するため30w t%以下とする。好ましくは
10−t%以下である。Fe: It is preferable to add Fe to improve the strength of the joint or as a substitute for expensive Ni, but if it is added in too large a quantity, the corrosion resistance of the joint will deteriorate and the melting point of the alloy will increase, so Fe should be added at 30wt%. The following shall apply. Preferably it is 10-t% or less.
co=接合部の耐食性、高温強度を高めるため添加する
。しかし高価なため10−t%以下とする。co=Added to increase the corrosion resistance and high-temperature strength of the joint. However, since it is expensive, it is limited to 10-t% or less.
Mo: Coの場合と同様に、接合部の耐食性、高温強
度を高めるため添加するが、高価なため10−t%以下
とする。Mo: As in the case of Co, Mo is added to improve the corrosion resistance and high-temperature strength of the joint, but it is expensive, so it is limited to 10-t% or less.
次に、本発明にあっては、急冷凝固により結晶粒径を1
0μm以下の微細結晶とするが、ろう薄帯の延性を確保
するため10μm以下、好ましくは2μm以下、より好
ましくは1μm以下の結晶粒径とし、ろう付時の接合強
度を高くするためバインダー、気泡等が混入せず均質な
ものとする。かかる結晶粒径は急冷凝固速度を変えるこ
とによって変更でき、103°C/sec以上の冷却速
度を確保することによって結晶粒径を′10μm以下と
することができる。Next, in the present invention, the crystal grain size is reduced to 1 by rapid solidification.
The grain size is 0 μm or less, but in order to ensure the ductility of the brazing ribbon, the crystal grain size is 10 μm or less, preferably 2 μm or less, and more preferably 1 μm or less. It should be homogeneous without contamination. The crystal grain size can be changed by changing the rapid solidification rate, and by ensuring a cooling rate of 103°C/sec or more, the crystal grain size can be made 10 μm or less.
第1図falおよび(blは、本発明にかかる結晶質急
冷凝固薄帯を製造する装置の概略図である。図中、溶湯
収容器10からの溶湯11はノズル口12を経て高速で
移動更新する回転冷却ドラム]3上に注がれ、急速凝固
して、薄帯14が作製される。第1図ta+の場合を単
ロール方式、第1図fblの場合を双ロール方式と称す
る。溶湯超急冷装置の形式は特にとねない。要するに移
動更新する冷却体上に溶湯を噴出し凝固、冷却し、薄帯
を形成できればよい。Figures 1 and 1 are schematic diagrams of an apparatus for manufacturing a crystalline rapidly solidified ribbon according to the present invention. In the figure, the molten metal 11 from the molten metal container 10 moves at high speed through the nozzle port 12 and is renewed. The molten metal is poured onto a rotating cooling drum 3 and rapidly solidified to produce a ribbon 14. The case of ta+ in Fig. 1 is called a single-roll method, and the case of fbl in Fig. 1 is called a double-roll method. There is no particular limitation on the type of ultra-quenching device.In short, it is sufficient as long as it can eject molten metal onto a moving and renewing cooling body, solidify and cool it, and form a ribbon.
上記の合金組成の溶湯を第1図に示すような溶湯超急冷
装置を用いて103℃/秒以上の冷却速度で冷却凝固せ
しめ、好ましくは20〜200 μmWの薄帯とする。The molten metal having the above alloy composition is cooled and solidified at a cooling rate of 103° C./sec or more using a molten metal ultra-quenching device as shown in FIG. 1, preferably into a thin ribbon of 20 to 200 μmW.
それより薄いと結晶質の製造が困難なため20μm以上
とし、−Fluに上限は特に問わない。しかし、ろう材
の効率的利用および冷却速度の低下をきたすことから2
00 μm以下の厚さが好ましい。If it is thinner than that, it is difficult to produce a crystalline material, so the thickness is set to 20 μm or more, and there is no particular upper limit to -Flu. However, since it reduces the efficient use of brazing filler metal and reduces the cooling rate,
A thickness of 00 μm or less is preferred.
これらの薄帯ばほとんど表面酸化もなく、そのままでろ
う付に有用であるが、十分な靭性を持っているため、複
雑な形状に切断およびプレス加工した後、ろう付に使用
できる。These thin strips have almost no surface oxidation and are useful for brazing as they are, but they have sufficient toughness so they can be used for brazing after being cut and pressed into complex shapes.
本発明のろう薄帯は、オーステナイト系、二相系、フェ
ライト系の各種ステンレス口ならびにNi、Moあるい
はCo、 W等を多量に含有する高合金鋼のいずれのろ
う接に対しても適用可能である。The brazing ribbon of the present invention can be applied to various types of austenitic, two-phase, and ferritic stainless steels as well as high alloy steels containing large amounts of Ni, Mo, Co, W, etc. be.
以下に、本発明を実施例によりさらに具体的に説明する
。EXAMPLES Below, the present invention will be explained in more detail with reference to Examples.
実施例1
第1表の10種の合金溶湯を第1図(alに示すような
3000r、p、m、で回転する直径300mmの鋼製
ロール表面上に開口部0.5mm X 14mmの矩形
ノズルを用い噴射し、幅14mm、厚さ35μmの薄帯
を作製した。Example 1 A rectangular nozzle with an opening of 0.5 mm x 14 mm was placed on the surface of a steel roll with a diameter of 300 mm rotating at 3000 r, p, m as shown in Figure 1 (al). A ribbon with a width of 14 mm and a thickness of 35 μm was produced.
また合金Cについては50mm X 50mm x 2
0mmの鋳型に鋳込んだ鋳塊より100 μm厚の1!
板を切り出し、本発明にかかるろう薄帯も含めて直径2
0mmの円形に打ち抜き可能であるかを調べた。For alloy C, 50mm x 50mm x 2
1! 100 μm thicker than the ingot cast into a 0 mm mold!
A plate is cut out and has a diameter of 2 including the wax ribbon according to the present invention.
It was investigated whether it was possible to punch out a circle of 0 mm.
これらの薄帯を14mm X 14mmの大きさに切断
した後、2つの14mm X 14mm x 60mm
の511S304角材の14mm X 14mm端面に
はさみ、l kg/mm”の圧縮応力を加えなから(,
4囲気中にて1250“C15分間の加熱により、薄帯
を溶融し接合した。また、比較例として、JIS規格B
Ni −14のNi系粉末シートろうを用い同様に接合
した。After cutting these thin strips into a size of 14mm x 14mm, two 14mm x 14mm x 60mm
Sandwich the 14mm x 14mm end face of a 511S304 square piece and apply a compressive stress of 1 kg/mm.
The ribbons were melted and bonded by heating at 1250"C for 15 minutes in a 4-air atmosphere. Also, as a comparative example, JIS standard B
Bonding was carried out in the same manner using Ni-14 Ni-based powder sheet solder.
その後、接合強度の測定のため、接合した角材を切削加
工により月S Z2201の形状の試験片を作成し、引
張試験を行った。また、接合部耐食試験は、接合した角
材よりろう接部を中心として厚さ3mm x幅10mm
X長さ40mmなろびに厚さ2mm X直径11mm
の試験片を加工し、ステンレス鋼の硫酸−硫酸銅腐食試
験(JiS GO575゜以下、“ストラウス試験”と
いう)ならびに孔食電位測定を行った。Thereafter, in order to measure the joint strength, a test piece in the shape of Moon SZ2201 was created by cutting the joined square pieces, and a tensile test was conducted. In addition, the joint corrosion resistance test was conducted using a piece of 3 mm thick x 10 mm wide centering on the soldered part from the joined square pieces.
X length 40mm, thickness 2mm X diameter 11mm
A test piece was processed and a stainless steel sulfuric acid-copper sulfate corrosion test (JiS GO575° or less, referred to as the "Strauss test") and pitting potential measurement were performed.
ストラウス試験の試験片は湿式600番エメリー紙研磨
仕上げとし、試験後にUベンド曲げを実施して割れの有
無を顕微鏡を用いて判定した。The test piece for the Strauss test was finished by wet polishing with No. 600 emery paper, and after the test, U-bend bending was performed and the presence or absence of cracks was determined using a microscope.
孔食電位測定は0.01M NaCQ水溶液、60℃、
Ar脱気下で掃引速度20mV/minの動電位法にて
測定した。Pitting corrosion potential was measured using 0.01M NaCQ aqueous solution at 60°C.
Measurement was performed by potentiodynamic method at a sweep rate of 20 mV/min under Ar degassing.
n数は3である。The number n is 3.
以上の結果を第2表にまとめて示す。The above results are summarized in Table 2.
また合金Cから作製した薄帯の組織は第2図の透過電子
顕微鏡金属組織写真に示すように非常に微細(0,3μ
m程度の結晶粒)であり、本発明にがかるろう薄帯の全
ては柔軟であり、打抜き加工等も容易に行えた。In addition, the structure of the ribbon made from Alloy C is extremely fine (0.3μ
The solder ribbons of the present invention were all flexible and could be easily punched out.
しかし、従来法で作製した合金Cの薄板では打抜き時に
いずれも破壊した。However, all of the thin plates of Alloy C produced by the conventional method were broken during punching.
第3図(alは、前記台金Cの薄帯のX線回折図であり
、結晶質特有の鋭いピークがみられるのが分かる。FIG. 3 (al) is an X-ray diffraction diagram of the ribbon of the base metal C, and it can be seen that sharp peaks characteristic of crystalline materials are observed.
なお、本例ではその組成のため薄帯の厚さを薄くして急
冷速度を高めても非晶質のものは得られなかったが、参
考までに製造し?:5i=4.2%、B−2,0%:C
r=19%を含む厚さ10μmの非結晶質薄帯について
のX&5i回折図を第3図Fb+に示す。非結晶質特有
のブロードなピークがみられる。この非結晶質薄帯を使
ってろう付は接合を行ったところ、前記ストラウス試験
において貫通割れが生し、耐食性は母材レヘル以下であ
った。また第2表に示したよう二こ、本発明のろう薄帯
を用いてろう付けを行った場合、ストラウス試験でのυ
1れも発生せず、孔食型イiも比較を才よりも高く、耐
食性に優れた接合が行えることが明らη・である。In this example, due to its composition, even if the thickness of the ribbon was reduced and the quenching rate was increased, an amorphous ribbon could not be obtained. :5i=4.2%, B-2,0%:C
The X&5i diffractogram for a 10 μm thick amorphous ribbon containing r=19% is shown in FIG. 3 Fb+. Broad peaks characteristic of amorphous materials are observed. When brazing was performed using this amorphous ribbon, penetration cracking occurred in the Strauss test, and the corrosion resistance was lower than the base metal level. In addition, as shown in Table 2, when brazing is performed using the solder ribbon of the present invention, υ in the Strauss test
No pitting corrosion occurred, and the pitting corrosion type (i) was also higher than that of the comparative example, which clearly shows that a joint with excellent corrosion resistance can be achieved.
第1表
第 2 表
実施例2
実施例1のC合金組成の溶湯を同しく第1図(alの装
置により、250Or、p、m、で回転する直径300
mmのFI製フロール表面上、開口部0.6mm x
20mmの矩形ノズルより噴射し、幅20mm、 Hさ
30μmのろう薄帯を作製した。Table 1 Table 2 Example 2 The molten metal of the C alloy composition of Example 1 was heated using the same equipment shown in Figure 1 (Al) with a diameter of 300 mm rotated at 250 Or, p, m.
mm FI flor surface, opening 0.6 mm x
A wax ribbon with a width of 20 mm and a height of 30 μm was produced by spraying from a 20 mm rectangular nozzle.
SO5304a裂の直径25.4mm x j¥さ1.
Omm x長さ100 mmのパイプを実施例1のC合
金組成のろう薄帯をインサート−材として接合面に挿入
し、アルゴン雰囲気中で、接合温度1250’c、接合
時間200秒、圧縮応力1 kg/mm”で接合した。SO5304a fissure diameter 25.4mm x j¥S 1.
A pipe with a length of 100 mm x 100 mm was inserted into the joining surface using the C alloy composition brazing ribbon of Example 1 as an insert material, and in an argon atmosphere, the joining temperature was 1250'C, the joining time was 200 seconds, and the compressive stress was 1. kg/mm".
この接合部より4箇所の板状引張試験片、および腐食試
験片を採取した。Four plate-shaped tensile test pieces and a corrosion test piece were taken from this joint.
第3表 パイプ接合部の強度と耐食性本発明のろう薄
帯をパイプ接合に適用しても何ら問題はなく、母材レベ
ルの接合強度が得られた。Table 3 Strength and Corrosion Resistance of Pipe Joints There was no problem when the brazed ribbon of the present invention was applied to pipe joints, and joint strength comparable to that of the base metal was obtained.
また、耐食性についても実施例1と同)pの条件で評価
を行ったが、第3表に示すごとく良好な耐食性が確認さ
れた。Furthermore, the corrosion resistance was also evaluated under the same conditions as in Example 1), and as shown in Table 3, good corrosion resistance was confirmed.
(発明の効果)
以上のように、本発明によれば、産業上非常に有用なス
テンレス鋼および高合金接合用のろう薄帯およびそのた
めのろう薄帯の製造方法が得られる。また本発明によれ
ば、非晶質のものと比較して厚さの大きいものが得られ
、B、Siの含有量を低くできるため七分な延性を確保
でき1.1用心時の溶融流動性にすぐれ、接合部の耐食
性も改善される。(Effects of the Invention) As described above, according to the present invention, it is possible to obtain a solder ribbon for joining stainless steels and high alloys, which is very useful industrially, and a method for manufacturing the solder ribbon therefor. In addition, according to the present invention, a product with a larger thickness can be obtained compared to an amorphous one, and since the content of B and Si can be lowered, seven-fold ductility can be ensured. 1.1 Melt flow during precautions It has excellent corrosion resistance and improves the corrosion resistance of joints.
第1図falおよび市)は、本発明にかかる急冷凝固ろ
う薄帯の製造装置の略式説明図;
第2図は、本発明にかかる凝固ろう薄帯の透過電子顕微
鏡金属m織写真;および
第3図は、本発明によるろう薄帯のX線回折図fa+を
非晶質のそれfblに比較して示すグラフである。
10:溶湯収容器 11ニア容湯12: ノズル
口 13:回転冷却ドラム14・薄帯FIG. 1 is a schematic explanatory diagram of an apparatus for producing a rapidly solidified solder ribbon according to the present invention; FIG. 2 is a transmission electron microscope metal weave photograph of the solidified solder ribbon according to the present invention; FIG. 3 is a graph showing a comparison of the X-ray diffraction pattern fa+ of the wax ribbon according to the present invention with that of an amorphous ribbon fbl. 10: Molten metal container 11 Near molten metal 12: Nozzle port 13: Rotating cooling drum 14/thin ribbon
Claims (4)
%以下、B:0.001%以上、1%以下を含有し、残
部が実質的にNiである、10μm以下の微細結晶から
なるNi基結晶質急冷凝固ろう薄帯。(1) In weight%, Cr: 10% or more and 30% or less, Si: 5% or more, 10
% or less, B: 0.001% or more and 1% or less, the balance being substantially Ni, a Ni-based crystalline rapidly solidified brazing ribbon consisting of fine crystals of 10 μm or less.
%以下、B:0.001%以上、1%以下を含有し、な
らびにFe:30%以下、Co:10%以下およびMo
:10%以下のうち少なくとも1種をさらに含有し、残
部が実質的にNiである、10μm以下の微細結晶から
なるNi基結晶質急冷凝固ろう薄帯。(2) In weight%, Cr: 10% or more and 30% or less, Si: 5% or more, 10
% or less, B: 0.001% or more and 1% or less, and Fe: 30% or less, Co: 10% or less, and Mo
: A Ni-based crystalline rapidly solidified brazing ribbon consisting of fine crystals of 10 μm or less, further containing at least one of the following: 10% or less, the remainder being substantially Ni.
%以下、B:0.001%以上、1%以下を含有し、残
部が実質的にNiである溶融合金を移動更新する冷却体
上に噴出し、10^3℃/sec以上の冷却速度で凝固
冷却することを特徴とする、10μm以下の結晶粒から
なるNi基結晶質急冷凝固ろう薄帯の製造方法。(3) In weight%, Cr: 10% or more and 30% or less, Si: 5% or more, 10
% or less, B: 0.001% or more and 1% or less, the balance being substantially Ni, is spouted onto a cooling body that moves and renews it, at a cooling rate of 10^3 ° C / sec or more. A method for producing a rapidly solidified Ni-based crystalline brazing ribbon comprising crystal grains of 10 μm or less, which comprises solidifying and cooling.
%以下、B:0.001%以上、1%以下を含有し、な
らびにFe:30%以下、Co:10%以下およびMo
:10%以下のうち少なくとも1種をさらに含有し、残
部が実質的にNiである溶融合金を移動更新する冷却体
上に噴出し、10^3℃/sec以上の冷却速度で凝固
冷却することを特徴とする、10μm以下の結晶粒から
なるNi基結晶質急冷凝固ろう薄帯の製造方法。(4) In weight%, Cr: 10% or more and 30% or less, Si: 5% or more, 10
% or less, B: 0.001% or more and 1% or less, and Fe: 30% or less, Co: 10% or less, and Mo
: Spraying a molten alloy further containing at least one of 10% or less and the remainder being substantially Ni onto a moving and renewing cooling body, and solidifying and cooling at a cooling rate of 10^3°C/sec or more. A method for producing a Ni-based crystalline rapidly solidified brazing ribbon consisting of crystal grains of 10 μm or less, characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30594986A JPH0825053B2 (en) | 1986-12-22 | 1986-12-22 | Ni-based crystalline brazing ribbon |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30594986A JPH0825053B2 (en) | 1986-12-22 | 1986-12-22 | Ni-based crystalline brazing ribbon |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63157793A true JPS63157793A (en) | 1988-06-30 |
JPH0825053B2 JPH0825053B2 (en) | 1996-03-13 |
Family
ID=17951232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30594986A Expired - Lifetime JPH0825053B2 (en) | 1986-12-22 | 1986-12-22 | Ni-based crystalline brazing ribbon |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0825053B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03128756U (en) * | 1990-04-03 | 1991-12-25 | ||
JPH09243860A (en) * | 1996-03-11 | 1997-09-19 | Fujikura Ltd | Ferrule made of quartz glass and apparatus for production thereof |
US6589670B2 (en) | 2000-03-08 | 2003-07-08 | Emitec Gesellschaft Fuer Emissionstechnologie Mbh | Composite of metal foils with a soldering material |
WO2012081346A1 (en) * | 2010-12-16 | 2012-06-21 | 福田金属箔粉工業株式会社 | Nickel-based brazing filler metal with excellent heat resistance |
DE112022002930T5 (en) | 2021-08-17 | 2024-03-21 | Hilltop Corporation | METHOD FOR PRODUCING AN FE-SI-B BASED, THICK-LAYERED, QUICKLY SOLID ALLOY STRIP |
-
1986
- 1986-12-22 JP JP30594986A patent/JPH0825053B2/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03128756U (en) * | 1990-04-03 | 1991-12-25 | ||
JPH09243860A (en) * | 1996-03-11 | 1997-09-19 | Fujikura Ltd | Ferrule made of quartz glass and apparatus for production thereof |
US6589670B2 (en) | 2000-03-08 | 2003-07-08 | Emitec Gesellschaft Fuer Emissionstechnologie Mbh | Composite of metal foils with a soldering material |
JP2003525749A (en) * | 2000-03-08 | 2003-09-02 | エミテック ゲゼルシヤフト フユア エミツシオンス テクノロギー ミツト ベシユレンクテル ハフツング | Metal foil composite containing brazing filler metal |
WO2012081346A1 (en) * | 2010-12-16 | 2012-06-21 | 福田金属箔粉工業株式会社 | Nickel-based brazing filler metal with excellent heat resistance |
DE112022002930T5 (en) | 2021-08-17 | 2024-03-21 | Hilltop Corporation | METHOD FOR PRODUCING AN FE-SI-B BASED, THICK-LAYERED, QUICKLY SOLID ALLOY STRIP |
Also Published As
Publication number | Publication date |
---|---|
JPH0825053B2 (en) | 1996-03-13 |
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