JPS63155668U - - Google Patents
Info
- Publication number
- JPS63155668U JPS63155668U JP4890287U JP4890287U JPS63155668U JP S63155668 U JPS63155668 U JP S63155668U JP 4890287 U JP4890287 U JP 4890287U JP 4890287 U JP4890287 U JP 4890287U JP S63155668 U JPS63155668 U JP S63155668U
- Authority
- JP
- Japan
- Prior art keywords
- copper layer
- printed wiring
- marks
- marks formed
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4890287U JPS63155668U (es) | 1987-03-30 | 1987-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4890287U JPS63155668U (es) | 1987-03-30 | 1987-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63155668U true JPS63155668U (es) | 1988-10-12 |
Family
ID=30870868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4890287U Pending JPS63155668U (es) | 1987-03-30 | 1987-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63155668U (es) |
-
1987
- 1987-03-30 JP JP4890287U patent/JPS63155668U/ja active Pending