JPS63155652U - - Google Patents
Info
- Publication number
- JPS63155652U JPS63155652U JP1987046709U JP4670987U JPS63155652U JP S63155652 U JPS63155652 U JP S63155652U JP 1987046709 U JP1987046709 U JP 1987046709U JP 4670987 U JP4670987 U JP 4670987U JP S63155652 U JPS63155652 U JP S63155652U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- light emitting
- package
- light receiving
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987046709U JPS63155652U (enFirst) | 1987-03-31 | 1987-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987046709U JPS63155652U (enFirst) | 1987-03-31 | 1987-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63155652U true JPS63155652U (enFirst) | 1988-10-12 |
Family
ID=30866620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987046709U Pending JPS63155652U (enFirst) | 1987-03-31 | 1987-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63155652U (enFirst) |
-
1987
- 1987-03-31 JP JP1987046709U patent/JPS63155652U/ja active Pending