JPS63155627A - Wire-bonding system - Google Patents
Wire-bonding systemInfo
- Publication number
- JPS63155627A JPS63155627A JP61302271A JP30227186A JPS63155627A JP S63155627 A JPS63155627 A JP S63155627A JP 61302271 A JP61302271 A JP 61302271A JP 30227186 A JP30227186 A JP 30227186A JP S63155627 A JPS63155627 A JP S63155627A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- arm
- capillary
- locking mechanism
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 2
- 230000001133 acceleration Effects 0.000 abstract description 4
- 239000000470 constituent Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はワイヤボンディング装置のキャピラリ上下駆
動機構に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a capillary vertical drive mechanism for a wire bonding device.
第３図は従来のワイヤボンディング装置の一例を示す。 FIG. 3 shows an example of a conventional wire bonding device.
半導体チップ（１）はリードフレーム（２）のグイパッ
ド部に接合され、受台（３）上に位置決めされている。A semiconductor chip (1) is bonded to a pad portion of a lead frame (2) and positioned on a pedestal (3).
ＸＹテーブル（４）に載ったボンディングヘッド（５）
にはキャピラリ（６）を支持するボンディングアーム（
′７）を回転自在に支持するとともにワイヤクランパ（
８）を支持する揺動アーム（９）が回転中心（１０）に
支持されており、Ｚ軸モ−タ（図示は略す）により二重
矢印に示す如く揺動運動を行なうものである。またボン
ディングヘッド（５）上の取付台（１１）に取りつけら
れたスプール（１２）に巻きつけられているワイヤ（１
３）は案内筒（１４）およびガイド（１５）を通り、キ
ャピラリ（６）内に供給される。Bonding head (5) on XY table (4)
has a bonding arm (6) that supports the capillary (6).
'7) is rotatably supported, and a wire clamper (
A swinging arm (9) supporting the arm (8) is supported at the rotation center (10), and swings as shown by the double arrow by a Z-axis motor (not shown). Also, the wire (1) is wound around the spool (12) attached to the mount (11) on the bonding head (5).
3) is supplied into the capillary (6) through the guide tube (14) and guide (15).
このようなワイヤボンディング装置では、キャピラリ（
６）はＸＹテーブル（由によりパッド上の半導体チップ
（１）の上方へ位置決めされた後、下降してそこへワイ
ヤをボンディングし、続いて上昇しなからＸＹテーブル
（４）によりリードフレーム（２）に移動位置決めされ
、再び下降してそこへワイヤをボンディングする。その
後、ワイヤクランパ（８）が作動してワイヤをクランプ
し、キャピラリ（６）と共に上昇してワイヤを切断する
。In such wire bonding equipment, the capillary (
After the XY table (6) is positioned above the semiconductor chip (1) on the pad, it descends to bond the wire there, and then rises to bond the lead frame (2) with the XY table (4). ) and moves down again to bond the wire there.The wire clamper (8) then operates to clamp the wire and moves up with the capillary (6) to cut the wire.
第４図は例えば特開昭５５−７４１５２号公報に記載さ
れた従来のキャピラリ上下駆動機構をモデル化した側面
図である。揺動アーム（９）には電磁ソレノイド（１６
）および接点（１７）が取りつけられている。ソレノイ
ド（１６）に吸引されて下方に移動するプランジャ（１
８）の軸先端はボンディングアーム（７）の上部に取り
つけられた補助アーム（１９）の先端に位置する。FIG. 4 is a side view of a conventional capillary vertical drive mechanism described in, for example, Japanese Unexamined Patent Publication No. 55-74152. The swing arm (9) is equipped with an electromagnetic solenoid (16
) and contacts (17) are attached. The plunger (1) moves downward as it is attracted by the solenoid (16).
The tip of the shaft 8) is located at the tip of the auxiliary arm (19) attached to the top of the bonding arm (7).
キャピラリ（６）が上昇下降する際には、電磁ソレノイ
ド（１６）に通電してプランジャ（１８）を吸引し、ア
ーム（１９）を接点（１７）に押しつける。これにより
ボンディングアーム（′７）を揺動アーム（９）に固定
して、揺動アーム（９）と一体に揺動運動させる。そし
て揺動アーム（９）の先端が下降したとき、キャピラリ
（６）がボンディング面に接触する直前に通電電流を弱
める。これによりキャピラリ（６）がボンディング面に
接触してボンディングを行なうが、アーム（１９）が接
点（１７）から離れて揺動アーム（９）の更なる降下を
許容してボンディング面の衝撃を軽減する。When the capillary (6) moves up and down, the electromagnetic solenoid (16) is energized to attract the plunger (18) and press the arm (19) against the contact (17). Thereby, the bonding arm ('7) is fixed to the swing arm (9) and is caused to swing integrally with the swing arm (9). Then, when the tip of the swing arm (9) descends, the applied current is weakened just before the capillary (6) contacts the bonding surface. As a result, the capillary (6) contacts the bonding surface and performs bonding, but the arm (19) separates from the contact point (17), allowing the swinging arm (9) to further descend, reducing the impact on the bonding surface. do.
さて、ワイヤボンディングは以上のような一連の動作で
行なわれるが、キャピラリ（６）の動きの安定性および
振動の大小がボンディングの信頼性を大きく左右する。Now, wire bonding is performed through a series of operations as described above, but the reliability of bonding is greatly influenced by the stability of the movement of the capillary (6) and the magnitude of vibration.
従って、半導体の生産性向上のために高信頼性を保ちつ
つワイヤボンディングを高速化するためには、ＸＹテー
ブルおよび２軸モータが高速化されてもキャピラリ上下
駆動機構が振動の少ない安定して作動する構造にしなけ
ればならない。Therefore, in order to speed up wire bonding while maintaining high reliability in order to improve semiconductor productivity, the capillary vertical drive mechanism must operate stably with less vibration even if the XY table and two-axis motor are increased in speed. It is necessary to create a structure that allows
ところが従来のキャピラリ上下駆動機構は以上のような
構成になっているため、回転中心（１０）より上方にク
ランパ（８）やロック機構などの各構成要素が集゛中し
ている。そのため、ボンディングヘッド全体がＹ方向に
移動する際に加減速されると各構成要素に慣性力が働き
、その慣性力により生じる回転中心（１０）に関する慣
性モーメントが一方向に集中し、そのモーメントの方向
はキャピラリ（６）の上下動に関係なくＹ方向の移動加
速度の方向とともに変化する。However, since the conventional capillary vertical drive mechanism has the above-described configuration, components such as the clamper (8) and the locking mechanism are concentrated above the rotation center (10). Therefore, when the entire bonding head is accelerated or decelerated while moving in the Y direction, an inertial force acts on each component, and the moment of inertia about the center of rotation (10) generated by the inertial force is concentrated in one direction, and the moment The direction changes along with the direction of the movement acceleration in the Y direction, regardless of the vertical movement of the capillary (6).
そのため高速ボンディングを行なうためにＸＹテーブル
を高速駆動させるに従いキャピラリ（６）を上下動させ
るのに必要な回転トルクに変動が生じ、安定な動作が出
来なくなり、ボンデイングの信頼性が低下する。また、
キャピラリ（６）を高速に上下させるべく揺動アーム（
９）の回転角加速度を大きくすると、ボンディングアー
ム（′７）の慣性モーメントも大きくなるため、電磁ソ
レノイド（１６）の吸引力も大きくして揺動アーム（９
）とボンディングアーム（７）の結合をより強固にしな
ければならない。ところが、第４図に示す構造では、吸
引力の反力が回転中心（１０）に生じるため、ボンディ
ングア−ムを上げるに従い回転中心（１０）にかかる力
が大きくなり、電磁ソレノイド（１６）のＯＮ −ＯＦ
Ｆの繰り返しにより回転中心に振動が発生し、安定なボ
ンディングが出来ないという問題点があった。Therefore, as the XY table is driven at high speed to perform high-speed bonding, the rotational torque required to move the capillary (6) up and down varies, making stable operation impossible and reducing the reliability of bonding. Also,
The swinging arm (
If the rotational angular acceleration of the bonding arm ('7) is increased, the moment of inertia of the bonding arm ('7) will also be increased, so the attraction force of the electromagnetic solenoid (16) is also increased to
) and the bonding arm (7) must be made stronger. However, in the structure shown in Fig. 4, the reaction force of the attraction force is generated at the rotation center (10), so as the bonding arm is raised, the force applied to the rotation center (10) increases, causing the electromagnetic solenoid (16) to ON-OF
There was a problem in that vibrations were generated at the center of rotation by repeating F, making stable bonding impossible.
この発明は上記のような問題を解決するためになされた
もので、信頼性の高い高速ボンディングが可能なワイヤ
ボンディング装置を得ることを目的とする。The present invention was made to solve the above problems, and an object of the present invention is to obtain a wire bonding device capable of high-speed bonding with high reliability.
この発明に係るワイヤボンディング装置は、ボンディン
グアームを揺動アームに固定してボンデイングアームの
振動を抑制するロック機構を、揺動アームの回転中心よ
り下方に設けたものである。更にはそのロック機構は揺
動アームに取りつけた電磁ソレノイドと、ボンディング
アームに取りつけたプランジャと、それらの内部に設け
た接点とにより構成したものである。The wire bonding device according to the present invention is provided with a locking mechanism below the rotation center of the swing arm for fixing the bonding arm to the swing arm and suppressing vibration of the bonding arm. Furthermore, the locking mechanism is composed of an electromagnetic solenoid attached to the swing arm, a plunger attached to the bonding arm, and contacts provided inside them.
この発明におけるワイヤボンディング装置は、ロック機
構を揺動アームの回転中心の下方に設けたことにより、
キャピラリ上下駆動機構の各構成要素がＹ方向への並進
運動したときに生じる回転中心回りの慣性モーメントが
つり合い（あるいは小さくなり）、キャピラリを上下動
させる回転トルクの変動が発生しないため高速時でも振
動が少なく安定したボンディングが行なえる。またロッ
ク機構の接点を電磁ツレ／イドの内部に設けたことによ
り、吸引力の反力が回転中心に生じないため、回転中心
の振動がなくなりボンディングの信頼性が向上する。The wire bonding device according to the present invention has the locking mechanism provided below the center of rotation of the swing arm.
The moment of inertia around the center of rotation that occurs when each component of the capillary vertical drive mechanism translates in the Y direction is balanced (or reduced), and there is no fluctuation in the rotational torque that moves the capillary up and down, so there is no vibration even at high speeds. Stable bonding can be performed with less friction. Further, by providing the contact point of the locking mechanism inside the electromagnetic slide/id, a reaction force of the attraction force is not generated at the rotation center, thereby eliminating vibration at the rotation center and improving bonding reliability.
以下この発明の一実施例を図について説明する。第１図
、第２図において、電磁ソレノイド（２１）は回転中心
（１０）の下方で揺動アーム（９）にネジ（２２）によ
り取りつけられ、その中心には接点１（２３）が取りつ
けられている。An embodiment of the present invention will be described below with reference to the drawings. In Figures 1 and 2, the electromagnetic solenoid (21) is attached to the swinging arm (9) with a screw (22) below the rotation center (10), and the contact 1 (23) is attached to the center of the swing arm (9). ing.
またプランジャ（２４）の中心には接点２ （２５）が
ねじ込まれ、絶縁リング（２６）および絶縁ブツシュ（
２７）を介してプランジャ取付板（２８）にナツト（２
９）により取りつけられている。なお、プランジャ取付
板（２８）はボンディングアーム（′７）に取りつけら
れている。Contact 2 (25) is screwed into the center of the plunger (24), and an insulating ring (26) and an insulating bush (25) are screwed into the center of the plunger (24).
Attach the nut (27) to the plunger mounting plate (28) via the nut (27).
9). Note that the plunger mounting plate (28) is attached to the bonding arm ('7).
次に動作について説明する。キャピラリ（６）が上下に
移動するとき、電磁ソレノイド（２工）に通電してプラ
ンジャ（２４）を吸引し、揺動アーム（９）に取りつけ
られた接点１（２３）がボンディングアーム（７）のプ
ランジャ取付板（２８）に取りつけられた接点２（２５
）に押しつけられてボンディングアーム（力は揺動アー
ム（９）に固定されて、揺動アームの回転運動がボンデ
ィングアームに伝達される。そしてキャピラリ（６）が
下降してボンディング面に接触する直前に電磁ソレノイ
ド（２１）への通′ｆＭ、電流を少なくして、吸引力を
小さくする。キャピラリがボンディング面に接触し、そ
れ以上下降できなくなると、接点１（２３）と接点２（
２５）かはなれ、吸引力に応じた力がキャピラリに付勢
される。Next, the operation will be explained. When the capillary (6) moves up and down, the electromagnetic solenoid (2 parts) is energized to attract the plunger (24), and the contact 1 (23) attached to the swing arm (9) connects to the bonding arm (7). Contact 2 (25) attached to the plunger mounting plate (28) of
) is pressed against the bonding arm (the force is fixed on the swinging arm (9) and the rotational movement of the swinging arm is transmitted to the bonding arm. Then, just before the capillary (6) descends and contacts the bonding surface Then, the current to the electromagnetic solenoid (21) is reduced to reduce the attraction force.When the capillary contacts the bonding surface and cannot descend any further, contact 1 (23) and contact 2 (
25) Once separated, a force corresponding to the suction force is applied to the capillary.
さて、上記のようなキャピラリ上下駆動機構において、
全体がＸＹテーブル（４１によりＹ方向に移動するとき
の加減速加速度によりキャピラリ上下駆動機構の各構成
要素に慣性力が作用したとき、回転中心（１０）のまわ
りの慣性モーメントが釣り合うようにロック機構を回転
中心（１０）の下方に設けているため、キャピラリを上
下動させるための回転トルクに変動が生じず、キャピラ
リの動きが安定して信頼性の高いボンディングを行なう
ことが出来る。Now, in the capillary vertical drive mechanism as described above,
A locking mechanism that balances the moment of inertia around the center of rotation (10) when inertial force acts on each component of the capillary vertical drive mechanism due to acceleration and deceleration when the whole moves in the Y direction by the XY table (41). Since the capillary is provided below the center of rotation (10), there is no fluctuation in the rotational torque for moving the capillary up and down, and the movement of the capillary is stable and highly reliable bonding can be performed.
またロック機構において、揺動アーム（９）とボンディ
ングアーム（ｒ）をロックするための吸引力を、揺動ア
ーム（９）側の電磁ソレノイド（２１）およびボンディ
ングアーム（７）側のプランジャ（２４）にそれぞれ設
けられた接点１ （２３）。In addition, in the locking mechanism, the attraction force for locking the swinging arm (9) and the bonding arm (r) is applied to the electromagnetic solenoid (21) on the swinging arm (9) side and the plunger (24) on the bonding arm (7) side. ) contacts 1 (23) provided in each case.
２（２５）が直接対接して受けているため、吸引力の反
力が回転中心に生じない。なお、理解を助けるために説
明を付加すると、従来のキャピラリ上下駆動機構では、
プランジャ（１８）はいずれのアームからも浮いた状態
から先ず補助アーム（１９）に対接し、その後更に電磁
ソレノイド（１６）の吸引力の反作用として揺動アーム
（９）を回転中心（１０）のまわりの回転を惹起して接
点（１７）を補助アーム（１９）に対接させ、しかして
補助アーム（１９）を揺動アーム（９）に固定するので
ある。つまり従来例では二段構えでボンディングアーム
（′７１を揺動アーム（９）に固定しているのである。2 (25) are directly opposed and received, so no reaction force of the suction force is generated at the center of rotation. To help you understand, the conventional capillary vertical drive mechanism
The plunger (18) first comes into contact with the auxiliary arm (19) while floating from either arm, and then moves the swinging arm (9) to the center of rotation (10) as a reaction to the attraction force of the electromagnetic solenoid (16). This causes the contact point (17) to come into contact with the auxiliary arm (19) by causing rotation around it, thereby fixing the auxiliary arm (19) to the swinging arm (9). In other words, in the conventional example, the bonding arm ('71) is fixed to the swing arm (9) in two stages.
しかし、本発明ではプランジャ（２４）が直接ボンディ
ングアーム（′７）に取り付けられ電磁ソレノイド（２
１）の吸引力は即ボンディングアーム（７）の引き着は
力となっていてかつ接点１および接点２が対接してボン
ディングアーム（′７）と揺動アーム（９）とを固定し
ている。そのため、ボンティング動作中にくり返される
吸引力の強弱の変動が回転中心に伝わり振動をひき起こ
すことがなく、キャピラリに余分な振動が加わらず安定
したボンディングが行なえる。However, in the present invention, the plunger (24) is directly attached to the bonding arm ('7) and the electromagnetic solenoid (24) is attached directly to the bonding arm ('7).
The suction force in 1) is a force that immediately attracts the bonding arm (7), and contacts 1 and 2 are in contact with each other to fix the bonding arm ('7) and the swinging arm (9). . Therefore, repeated fluctuations in the strength of the suction force during the bonding operation are not transmitted to the rotation center and cause vibrations, and stable bonding can be performed without adding unnecessary vibrations to the capillary.
また、接点２（２５）はプランジャ取付板（２８）に対
して絶縁されているため、接点１（２３）と接点２（２
５）をボンディング面高さ検出接点としても利用できる
。In addition, since contact 2 (25) is insulated from the plunger mounting plate (28), contact 1 (23) and contact 2 (2
5) can also be used as a bonding surface height detection contact.
なお、上記実施例では、ロック機構に電磁ソレノイドを
用いたものを示したが、リニアモータの吸引力を用いて
もよい。In the above embodiment, an electromagnetic solenoid is used as the locking mechanism, but the attraction force of a linear motor may also be used.
以上のように、この発明によれば揺動アームとボンディ
ングアームを固定するロック機構を回転中心の下方は設
けたことにより、ＸＹテーブルによるＹ方向への移動か
ら生じるキャピラリ上下駆動機構のトルク変動が発生し
ない。また、ロック機構の固定点を電磁ソレノイドの中
心に設けたことにより、吸引力ａ反力が回転中心に作用
しない。これらのことより、安定した信頼性の高いボン
ディングが可能となり、ボンディングの高速化にも対応
できる。As described above, according to the present invention, by providing a locking mechanism below the center of rotation for fixing the swing arm and the bonding arm, torque fluctuations in the capillary vertical drive mechanism caused by movement in the Y direction by the XY table can be prevented. Does not occur. Further, by providing the fixing point of the locking mechanism at the center of the electromagnetic solenoid, the attraction force a reaction force does not act on the rotation center. These features enable stable and highly reliable bonding, and can also support high-speed bonding.
第１図はこの発明の一実施例によるワイヤボンディング
装置のキャピラリ上下駆動機構を示す側面図、第２図は
第１図におけるＡ部の詳細側面断面図、第３図は従来の
ワイヤボンディング装置の一例を示す側面概略図、第４
図は従来のキャピラリ上下駆動機構を示す側面概略図で
ある。
図において、（６）はキャピラリ、（７１はボンディン
グアーム、（８）はワイヤクランパ、（９）は揺動アー
ム、（１０）は回転中心、（２１）はロック機構の電磁
ソレノイド、（２３）は接点１、（２４）はロック機構
のプランジャ、（２５）は接点２、（２６）は絶縁リン
グ、（２７）は絶縁ブツシュ、（２８）はプランジャ取
付板、（２９）はナツトを示す。
なお、各図中同一符号は同一部材、または相当部分を示
す。FIG. 1 is a side view showing a capillary vertical drive mechanism of a wire bonding device according to an embodiment of the present invention, FIG. 2 is a detailed side sectional view of section A in FIG. 1, and FIG. 3 is a side view of a conventional wire bonding device. Side schematic diagram showing an example, 4th
The figure is a schematic side view showing a conventional capillary vertical drive mechanism. In the figure, (6) is the capillary, (71 is the bonding arm, (8) is the wire clamper, (9) is the swing arm, (10) is the rotation center, (21) is the electromagnetic solenoid of the locking mechanism, (23) (24) is the plunger of the lock mechanism, (25) is the contact 2, (26) is the insulating ring, (27) is the insulating bushing, (28) is the plunger mounting plate, and (29) is the nut. Note that the same reference numerals in each figure indicate the same members or corresponding parts.
Claims (3)
ンディングアームと、このボンディングアームが回転自
在に取りつけられ揺動運動する揺動アームと、ボンディ
ングアームを揺動アームに固定してボンディングアーム
の振動を抑制するロック機構とからなるキャピラリ上下
駆動機構において、上記ロック機構を揺動アームの回転
中心より下に設けたことを特徴とするワイヤボンディン
グ装置。(1) A bonding arm that holds a capillary through which a wire passes inside, a swinging arm to which this bonding arm is rotatably attached and swings, and a bonding arm that is fixed to the swinging arm to suppress vibration of the bonding arm. 1. A wire bonding apparatus, characterized in that the capillary vertical drive mechanism includes a locking mechanism for suppressing the movement of the capillary, and the locking mechanism is provided below the center of rotation of the swinging arm.
れた電磁ソレノイドと、上記ボンディングアームに取り
つけられ上記電磁ソレノイドにより吸引されるプランジ
ャと、プランジャの吸引行程を制限するためにソレノイ
ドの内部で対接するようにプランジャ側とソレノイド側
に各々設けられて互いに対接する接合点とからなること
を特徴とする特許請求の範囲第１項記載のワイヤボンデ
ィング装置。(2) The locking mechanism includes an electromagnetic solenoid attached to the swinging arm, a plunger attached to the bonding arm and attracted by the electromagnetic solenoid, and a pair inside the solenoid to limit the attraction stroke of the plunger. The wire bonding device according to claim 1, characterized in that the wire bonding device comprises bonding points that are provided on the plunger side and the solenoid side so as to be in contact with each other and that are in contact with each other.
ィング面に接触したことを検知するボンディング面高さ
検出接点を兼ねていることを特徴とする特許請求の範囲
第１項、第２項記載のワイヤボンディング装置。(3) The contact point in the locking mechanism also serves as a bonding surface height detection contact for detecting that the capillary has contacted the bonding surface. Wire bonding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61302271A JPS63155627A (en) | 1986-12-18 | 1986-12-18 | Wire-bonding system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61302271A JPS63155627A (en) | 1986-12-18 | 1986-12-18 | Wire-bonding system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63155627A true JPS63155627A (en) | 1988-06-28 |
Family
ID=17906999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61302271A Pending JPS63155627A (en) | 1986-12-18 | 1986-12-18 | Wire-bonding system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63155627A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002134549A (en) * | 2000-10-30 | 2002-05-10 | Nec Corp | Wire bonder |
| JP2002368035A (en) * | 2001-06-06 | 2002-12-20 | Nec Corp | Wire clamp device for wire bonder |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5758054A (en) * | 1981-07-27 | 1982-04-07 | Hitachi Ltd | Terminal sealing of suction pipe |
| JPS5911636A (en) * | 1982-07-12 | 1984-01-21 | Marine Instr Co Ltd | Bonding device |
-
1986
- 1986-12-18 JP JP61302271A patent/JPS63155627A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5758054A (en) * | 1981-07-27 | 1982-04-07 | Hitachi Ltd | Terminal sealing of suction pipe |
| JPS5911636A (en) * | 1982-07-12 | 1984-01-21 | Marine Instr Co Ltd | Bonding device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002134549A (en) * | 2000-10-30 | 2002-05-10 | Nec Corp | Wire bonder |
| JP2002368035A (en) * | 2001-06-06 | 2002-12-20 | Nec Corp | Wire clamp device for wire bonder |
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