JPS63154661U - - Google Patents
Info
- Publication number
- JPS63154661U JPS63154661U JP4534587U JP4534587U JPS63154661U JP S63154661 U JPS63154661 U JP S63154661U JP 4534587 U JP4534587 U JP 4534587U JP 4534587 U JP4534587 U JP 4534587U JP S63154661 U JPS63154661 U JP S63154661U
- Authority
- JP
- Japan
- Prior art keywords
- sputtering
- metal
- back plate
- screwed
- comes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005477 sputtering target Methods 0.000 claims description 3
- 239000013077 target material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は本考案によるネジ止メ式スパツタリン
グ用ターゲツトの断面図である。第２図は従来方
式によるスパツタリング用ターゲツトの断面図で
ある。
１……裏板（リン青銅板）、２……ターゲツト
材（アルミニウム板）、３……ターゲツト材固定
用止めネジ、４……ボンデイング面。
FIG. 1 is a sectional view of a screw-on sputtering target according to the present invention. FIG. 2 is a sectional view of a conventional sputtering target. 1... Back plate (phosphor bronze plate), 2... Target material (aluminum plate), 3... Set screw for fixing target material, 4... Bonding surface.
Claims (1)
ツタリングする際に使用する金属ターゲツトにお
いて、冷却系と直接接触する裏板部にターゲツト
材金属をネジ止めしたことを特徴とするスパツタ
リング用ターゲツト。 A sputtering target used when sputtering metal in a vacuum or gas atmosphere, characterized in that a target material metal is screwed to a back plate portion that comes into direct contact with a cooling system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4534587U JPS63154661U (en) | 1987-03-26 | 1987-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4534587U JPS63154661U (en) | 1987-03-26 | 1987-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63154661U true JPS63154661U (en) | 1988-10-11 |
Family
ID=30863998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4534587U Pending JPS63154661U (en) | 1987-03-26 | 1987-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63154661U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0432565A (en) * | 1990-05-29 | 1992-02-04 | Tokuda Seisakusho Ltd | Method for fixing target of sputtering device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59179784A (en) * | 1983-03-31 | 1984-10-12 | Fujitsu Ltd | Sputtering device |
-
1987
- 1987-03-26 JP JP4534587U patent/JPS63154661U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59179784A (en) * | 1983-03-31 | 1984-10-12 | Fujitsu Ltd | Sputtering device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0432565A (en) * | 1990-05-29 | 1992-02-04 | Tokuda Seisakusho Ltd | Method for fixing target of sputtering device |
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