JPS63151834U - - Google Patents
Info
- Publication number
- JPS63151834U JPS63151834U JP4462387U JP4462387U JPS63151834U JP S63151834 U JPS63151834 U JP S63151834U JP 4462387 U JP4462387 U JP 4462387U JP 4462387 U JP4462387 U JP 4462387U JP S63151834 U JPS63151834 U JP S63151834U
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- moisture
- resin
- proof
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 claims 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000004898 kneading Methods 0.000 claims 1
- 239000005022 packaging material Substances 0.000 claims 1
Landscapes
- Wrappers (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
Description
第１図は、本考案の一実施例の部分断面図を示
すものである。
１……基材フイルム、２……防湿層、３……導
電性樹脂層。
FIG. 1 shows a partial sectional view of an embodiment of the present invention. 1... Base film, 2... Moisture-proof layer, 3... Conductive resin layer.
Claims (1)
層としてエチレン―ビニルアルコール共重合樹脂
または塩化ビニリデン樹脂からなるフイルムを少
なくとも一層積層してなる積層体の防湿層上に、
ヒートシール性を有する樹脂に導電性材料を混練
した導電性樹脂層を設けてなる、防湿性を有する
導電性包装材料。 On one side of a conductive base film, at least one film made of ethylene-vinyl alcohol copolymer resin or vinylidene chloride resin is laminated as a moisture-proof layer, on the moisture-proof layer of a laminate,
A moisture-proof conductive packaging material comprising a conductive resin layer made by kneading a conductive material into a heat-sealable resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4462387U JP2586519Y2 (en) | 1987-03-26 | 1987-03-26 | Conductive packaging material for electronic components with moisture resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4462387U JP2586519Y2 (en) | 1987-03-26 | 1987-03-26 | Conductive packaging material for electronic components with moisture resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63151834U true JPS63151834U (en) | 1988-10-05 |
| JP2586519Y2 JP2586519Y2 (en) | 1998-12-09 |
Family
ID=30862610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4462387U Expired - Lifetime JP2586519Y2 (en) | 1987-03-26 | 1987-03-26 | Conductive packaging material for electronic components with moisture resistance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2586519Y2 (en) |
-
1987
- 1987-03-26 JP JP4462387U patent/JP2586519Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2586519Y2 (en) | 1998-12-09 |