JPS63151832U - - Google Patents
Info
- Publication number
- JPS63151832U JPS63151832U JP4462487U JP4462487U JPS63151832U JP S63151832 U JPS63151832 U JP S63151832U JP 4462487 U JP4462487 U JP 4462487U JP 4462487 U JP4462487 U JP 4462487U JP S63151832 U JPS63151832 U JP S63151832U
- Authority
- JP
- Japan
- Prior art keywords
- moisture
- conductive
- proof
- layer
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000005022 packaging material Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Description
第１図は、本考案の一実施例を示す部分断面図
、第２図は比較例を示す部分断面図である。
１……基材フイルム、２……防湿層、３……導
電性樹脂層、６……アルミ箔、７……アルミ蒸着
層。
FIG. 1 is a partial sectional view showing an embodiment of the present invention, and FIG. 2 is a partial sectional view showing a comparative example. DESCRIPTION OF SYMBOLS 1... Base film, 2... Moisture-proof layer, 3... Conductive resin layer, 6... Aluminum foil, 7... Aluminum vapor deposition layer.
Claims (1)
層として金属箔及び金属蒸着を施したフイルムを
それぞれ積層してなる積層体の防湿層上に、ヒー
トシール性を有する樹脂に導電性材料を混練した
導電性樹脂層を設けてなる、防湿性を有する導電
性包装材料。 A conductive material is kneaded into a resin with heat-sealing properties on the moisture-proof layer of a laminate made by laminating a metal foil and a metal-deposited film as a moisture-proof layer on one side of a conductive base film. A moisture-proof conductive packaging material comprising a conductive resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4462487U JPH0533330Y2 (en) | 1987-03-26 | 1987-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4462487U JPH0533330Y2 (en) | 1987-03-26 | 1987-03-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63151832U true JPS63151832U (en) | 1988-10-05 |
| JPH0533330Y2 JPH0533330Y2 (en) | 1993-08-25 |
Family
ID=30862612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4462487U Expired - Lifetime JPH0533330Y2 (en) | 1987-03-26 | 1987-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0533330Y2 (en) |
-
1987
- 1987-03-26 JP JP4462487U patent/JPH0533330Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0533330Y2 (en) | 1993-08-25 |