JPS63151466A - Line type thermal head - Google Patents
Line type thermal headInfo
- Publication number
- JPS63151466A JPS63151466A JP30030686A JP30030686A JPS63151466A JP S63151466 A JPS63151466 A JP S63151466A JP 30030686 A JP30030686 A JP 30030686A JP 30030686 A JP30030686 A JP 30030686A JP S63151466 A JPS63151466 A JP S63151466A
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- protective cover
- layer part
- coefficient
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000007769 metal material Substances 0.000 claims abstract description 9
- 238000005452 bending Methods 0.000 claims abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 32
- 229910052742 iron Inorganic materials 0.000 claims description 16
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 abstract description 4
- 239000010959 steel Substances 0.000 abstract description 4
- 230000008859 change Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract 7
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 25
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 239000000758 substrate Substances 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 5
- 238000004512 die casting Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
Abstract
Description
この発明は、温度変化によって反りが生じることがなく
、また、十分な強度を持たせながら、薄型化しうるよう
に改良されたライン型サーマルヘッドに関する。The present invention relates to a line-type thermal head that has been improved so that it does not warp due to temperature changes, has sufficient strength, and can be made thinner.
サーマルヘッドの中でも最も一般的なライン型のサーマ
ルヘッドは、放熱板の上に、発熱抵抗体、およびこの発
熱抵抗体のドライバ回路ならびにこのドライバ回路へ電
力を供給する櫛歯状の入力端子部を有するセラミック基
板が一体的に取付けられている。そして、上記入力端子
部と対応する櫛歯状の接続端子部を有する合成樹脂製フ
ィルムと、このフィルムの下側に配される補強板とを備
えた外部接続用基板が、上記放熱板側の入力端子部と上
記接続端子部とを重合接触させるようにして、上記放熱
板およびセラミック基板に重ね合わせられ、この外部接
続用基板とこの外部接続用基板の上から保護カバーが、
上記放熱板にねじ手段により圧着固定されている。また
、保護カバーの下面に形成された保持溝に保持された押
えゴムが、上記外部接続用基板の上記接続端子部と対応
する上面を押圧して、上記接続端子部と入力端子部とを
弾性接触させるようにしている。
ところで、最近のサーマルヘッドは、これを装着するプ
リンタ装置等の小型化に伴い、薄型化が要望されており
、そのためには上記放熱板を薄くして、サーマルヘッド
の薄型化を達成する必要がある。ところが、上記放熱板
は、通常剛性の低いアルミニウムで形成されているため
、放熱板を薄くするとサーマルヘッド自体の物理的強度
に支障が出てくる。このため従来は、上記放熱板をアル
ミニウムに比べて高い強度をもつ鉄で形成し、放熱板を
薄クシてもサーマルヘッドの強度に問題が生じないよう
にして、サーマルヘッドの薄型化を図っていた。The most common line-type thermal head has a heat-generating resistor, a driver circuit for the heat-generating resistor, and a comb-shaped input terminal for supplying power to the driver circuit on a heat sink. A ceramic substrate is integrally attached. Then, an external connection board including a synthetic resin film having a comb-shaped connection terminal portion corresponding to the input terminal portion, and a reinforcing plate disposed below the film is placed on the heat sink side. The input terminal section and the connection terminal section are superimposed on the heat sink and the ceramic substrate so as to be in overlapping contact with each other, and a protective cover is placed over the external connection board and the external connection board.
It is crimped and fixed to the heat sink by screw means. Further, the presser rubber held in the holding groove formed on the lower surface of the protective cover presses the upper surface of the external connection board that corresponds to the connection terminal section, thereby elastically connecting the connection terminal section and the input terminal section. I'm trying to make contact. By the way, recent thermal heads are required to be thinner due to the miniaturization of printer devices, etc. to which they are installed, and for this purpose, it is necessary to make the heat sink thinner to achieve a thinner thermal head. be. However, since the heat sink is usually made of aluminum, which has low rigidity, making the heat sink thinner will impede the physical strength of the thermal head itself. For this reason, in the past, the heat sink was made of iron, which has higher strength than aluminum, so that even if the heat sink was made thinner, there would be no problem with the strength of the thermal head, in order to make the thermal head thinner. Ta.
しかしながら、上述のようにして薄型化したサーマルへ
ラドにおいては、次のような問題があった。
サーマルヘッドの上記保護カバーは、通常アルミニム製
であり、アルミニウムは上記放熱板を形成する鉄よりも
線膨張率が大きい。このため、サーマルヘッドの発熱抵
抗体に発生する熱に起因した頻繁な温度変化によって、
両者が膨張する場合に保護カバーの方が放熱板よりも大
きな膨張率を呈するために、サーマルヘッドに反りが生
しる不都合があった。
このような反りを防止するために、保護カバーも鉄製に
することが考えられるが、保護カバーの下面には、上記
各端子部の良好な接触状態を確保するために、上述のよ
うに上記各端子部を押圧する上記押えゴムを確実に保持
してこれを圧接するための上記保持溝を形成する微細加
工が要求される。しかし、押出しやダイカストによって
微細な形状を容易に形成できるアルミニウムに比べて、
鉄を微細加工するためには、複数の加工工程を踏まねば
ならず、アルミニウム製に比べてコストに著しい差異が
ある。
本発明は、上述のような事情のもとで考え出されたもの
で、上記の従来の問題を解決し、コストを増加させるこ
となく、また、温度変化によって反りが発生することも
なく、十分な強度をもちながら薄型化されたサーマルヘ
ッドを提供することをその課題とする。However, the thermal helad, which has been made thinner as described above, has the following problems. The protective cover of the thermal head is usually made of aluminum, and aluminum has a higher coefficient of linear expansion than iron forming the heat sink. For this reason, frequent temperature changes caused by heat generated in the heating resistor of the thermal head,
When both expand, the protective cover has a larger expansion coefficient than the heat sink, which causes the thermal head to warp. In order to prevent such warping, it is possible to make the protective cover also made of iron, but the bottom surface of the protective cover has the above-mentioned parts in order to ensure good contact between the above-mentioned terminals. Fine machining is required to form the holding grooves to reliably hold and press the presser rubber that presses the terminal portion. However, compared to aluminum, which can be easily formed into fine shapes by extrusion or die casting,
In order to finely process iron, it is necessary to go through multiple processing steps, and there is a significant difference in cost compared to aluminum. The present invention was devised under the circumstances as described above, and it solves the above-mentioned conventional problems without increasing costs or causing warping due to temperature changes. The objective is to provide a thermal head that is thin and has a high strength.
上記の問題を解決するため、本発明では、次の技術的手
段を講じている。
すなわち、表面にドライバ回路、およびその入力端子部
ならびに上記ドライバ回路によって駆動される発熱抵抗
体を有する放熱板と、裏面に上記入力端子部と対応する
接続端子部を有し、接続端子部が上記入力端子部に対応
して接触するように上記放熱板上に重ねられる基板と、
この基板上にさらに重ねられるようにして上記放熱板な
いし基板に対して互いに固定され、裏面に形成した保持
溝内に保持させた弾性体が、上記基板の上記接続端子部
と対応する上面を押圧して上記接続端子部と上記入力端
子部どうしが弾性接触させられるようにする保護カバー
とを備えるライン型サーマルヘッドにおいて、
上記放熱板を曲げ剛性の大きい鉄系の材料で形成すると
ともに、上記保護カバーを、上記放熱板と同等もしくは
それ以下の線膨張率をもつ鉄系材料でできた上層部と、
加工性に優れた軽金属材料でできた下層部との積層構造
としている。In order to solve the above problem, the present invention takes the following technical measures. That is, it has a heat sink having a driver circuit, its input terminal portion, and a heating resistor driven by the driver circuit on the front surface, and a connecting terminal portion corresponding to the input terminal portion on the back surface, and the connecting terminal portion has the above-mentioned connection terminal portion. a substrate stacked on the heat sink so as to correspond to and contact the input terminal portion;
An elastic body that is further stacked on this board and fixed to the heat sink or board, and held in a holding groove formed on the back surface, presses the top surface of the board that corresponds to the connection terminal part. In the line type thermal head, the heat dissipation plate is formed of an iron-based material with high bending rigidity, and the protective cover allows the connection terminal portion and the input terminal portion to come into elastic contact with each other. The cover has an upper layer made of an iron-based material having a coefficient of linear expansion equal to or lower than that of the heat sink;
It has a laminated structure with a lower layer made of a light metal material with excellent workability.
すなわち、本発明では、放熱板の入力端子部とこの放熱
板に重ね合わされる基板の接続端子部との重合接触部位
を圧接する保護カバーの下層部を形成する軽金属材料を
、放熱板を形成する鉄系材料と、保護カバーの上層部を
形成し放熱板の形成材料と同等もしくはそれ以下の線膨
張率をもつ鉄系材料とで挟み込んでいる。
ところで、鉄系材料と軽金属材料とでは、一般的に軽金
属材料の方が線膨張率が大きいため、鉄系材料と軽金属
材料だけの積層構造だと温度変化によって両者が膨張す
る際に、軽金属材料の方が大きい膨張率を呈するため、
全体としての形状に反りが生じてしまう。ところが、本
案では、従来例とは異なり、上述のように、軽金属製の
保護カバーの下層部を、鉄系材料製の放熱板とこの放熱
板と同等あるいはこれ以下の線膨張率をもつ材料で形成
された保護カバーの上層部とで挟み込んでいるので、保
護カバーの下層部が放熱板および上層部よりも大きく膨
張しようとしても、放熱板および上層部によってそれを
抑制され、しかも、保護カバーの上層部は、放熱板に対
して同等もしくはそれ以下の膨張率を呈する。したがっ
て、本案では、発熱素子であるサーマルヘッドの避ける
ことのできない温度変化によってサーマルヘッドに反り
が発生するという従来例の問題を完全に解決できる。
また、保護カバーの下層部には、入力端子部と接続端子
部の接触部位を圧接する弾性体を確実に保持するための
保持溝を形成するといった、微細な加工が要求されるが
、本案では、加工性に優れた軽金属材料で保護カバーの
Ｆ７１部を形成するので、低コストで容易に保護カバー
の下層部を微細な形状に形成できる。
そして、放熱板においては、従来のアルミニウムに代え
てこれより強度の大きい鉄系材料で形成するので、サー
マルヘッドの強度に支障を来すことなく、放熱板を薄く
形成してサーマルヘッドの薄型化を達成することができ
る。
以上のように、本発明に係るサーマルヘッドにおいては
、材料の特性を上手く活かした構成を採ることにより、
十分な強度を持たせながらサーマルヘッドの薄型化を図
りうるとともに、保護カバーの端子部に対する圧接部分
の微細加工が低コストで行え、また、温度変化によって
、サーマルヘッドに反りが発生する不都合も全くない。That is, in the present invention, the light metal material that forms the lower layer of the protective cover that presses the overlapping contact area between the input terminal portion of the heat sink and the connection terminal portion of the board overlaid on the heat sink is used to form the heat sink. It is sandwiched between an iron-based material and an iron-based material that forms the upper layer of the protective cover and has a coefficient of linear expansion equal to or lower than that of the material forming the heat sink. By the way, when it comes to iron-based materials and light metal materials, light metal materials generally have a higher coefficient of linear expansion, so in a laminated structure of only iron-based materials and light metal materials, when both expand due to temperature changes, the light metal material has a larger expansion coefficient, so
Warpage occurs in the overall shape. However, in this case, unlike the conventional example, as mentioned above, the lower layer of the light metal protective cover is made of a heat sink made of iron-based material and a material with a coefficient of linear expansion equal to or lower than that of the heat sink. Since it is sandwiched between the formed upper layer of the protective cover, even if the lower layer of the protective cover tries to expand more than the heat sink and the upper layer, it is suppressed by the heat sink and the upper layer. The upper layer exhibits an expansion coefficient equal to or lower than that of the heat sink. Therefore, the present invention can completely solve the conventional problem of warping of the thermal head due to unavoidable temperature changes in the thermal head, which is a heating element. In addition, fine processing is required on the lower layer of the protective cover, such as forming a holding groove to securely hold the elastic body that presses the contact area between the input terminal part and the connection terminal part. Since the F71 portion of the protective cover is formed of a light metal material with excellent workability, the lower layer portion of the protective cover can be easily formed into a fine shape at low cost. The heat dissipation plate is made of a stronger iron-based material instead of conventional aluminum, so the heat dissipation plate can be made thinner and the thermal head can be made thinner without affecting the strength of the thermal head. can be achieved. As described above, in the thermal head according to the present invention, by adopting a configuration that takes advantage of the characteristics of the material,
The thermal head can be made thinner while maintaining sufficient strength, and the pressure contact part of the protective cover can be micro-fabricated at low cost, and there is no inconvenience of warping of the thermal head due to temperature changes. do not have.
以下、本発明に係る一実施例を第１＠および第２図を参
照しながら具体的に説明する。
本例に係るサーマルヘッドは、放熱板１を十分な強度を
もった鉄系材料で形成し、また、保護カバー２の上層部
２ａを上記放熱板１の形成材料と同等もしくはそれ以下
の線膨張率をもつ鉄系材料で形成することにより、強度
的な問題や温度変化による反りが生ずることなく、薄型
化しうるように構成したものであり、その他の構成は従
来のものとほぼ同様である。
すなわち、第１図に示すように、ねじ孔１ａを有する放
熱板１の上に、一端側から、発熱抵抗体３、およびこの
発熱抵抗体３を駆動するためのドライバ回路４、ならび
にこのドライバ回路４へ電力を供給する櫛歯状の入力端
子部４ａを有するセラミック基板５が一体的に取付けら
れており、この放熱板ｌおよびセラミック基板５の上に
は、外部接続用基板６が重ねられている。
上記外部接続用基板６は、第２図に示すように、裏面一
端部に上記入力端子部４ａと対応する櫛歯状の接続端子
部７ａをもつ半透明の合成樹脂製フィルム７と、このフ
ィルム７の下側に取付けられた補強板８とを備えており
、放熱板１例の上記入力端子部４ａに上記接続端子部７
ａを重ねるようにして、外部接続用基板６が放熱板ｌに
重ね合わされている。そして、この外部接続用基板６の
上にさらに保護カバー２が重ねられており、この保護カ
バー２に形成されたねじ通孔２ｃないし上記外部接続用
基板６のねじ通孔６ａを介して取付ねじ９を上記ねじ孔
１ａに螺締することにより、上記放熱板１と外部接続用
基板６と保護カバー２とが圧着固定されている。なお、
図中、符号１１はサーマルヘッドの入力信号接続回路部
、１２はドライバ回路４を保護するコーティング層、１
３は感熱紙、１４は感熱紙駆動用プラテンを、それぞれ
示す。
さて、本例では、−例として、上記放熱板１を、従来の
アルミニウムに代えて、曲げ剛性が大きい一般構造用圧
延鋼材（ＳＳ材）で形成している。
また、上記保護カバー２は、上記入力端子部４ａに接続
端子部７ａを圧接させるための弾性体としての丸棒状の
押えゴム１０を保持する保持γ１Ｉ２ｄを下面一端部に
形成された下層部２ｂと、一端縁が弓形状に延びて上記
ドライバ回路４までを覆う上層部２ａとから成る。そし
て、上記下層部２ｂは、従来通りアルミニウムで形成し
ており、上記上層部２ａは、上記放熱板１を形成した一
般構造用圧延鋼材とほぼ同等の線膨張率を有するステン
レスａＣ３ＬＩＳ材）で形成している。
すなわち、本例に係るサーマルヘッドは、略同等の線膨
張率をもつ放熱板１と保護カバー２の上層部２ａとによ
って、これらとは線膨張率が異なる保護カバー２の下層
部２ｂを挟み込んだサンドインチ構造となっている。し
たがって、上記発熱抵抗体３から発生する熱によるサー
マルヘッドの温度変化により、保護カバー２の下層部２
ｂが、放熱板１および上層部２ａに対して異なる膨張率
を示しても、この下層部２ｂを挟み込んだ放熱板１と上
層部２ａとは同等の膨張率を示すので、従来例のように
サーマルヘッドに反りが発生するようなことは一切無い
。
また、放熱板ｌは強度の大きい一般構造用圧延鋼材で形
成しているので、放熱板ｌを薄く形成してもアルミニウ
ムのように強度的に不安定になることがないので、この
ように放熱板１を薄く形成することにより、強度を落と
すことなくサーマルへ、ドの薄型化を図りうる。そして
、上記各端子部４ａ、７ａの圧接部位である保護カバー
２の下層部２ｂは、ダイカストや押出しによって緻細形
状の形成を簡単に行いうるアルミニウムで形成している
ので、上述のように上記保持溝２ｄを設けるにあたって
は、低コストでこれを行いうる。
以上のように、本発明に係るサーマルヘッドにおいては
、従来の一切の問題を解決して、薄型化を達成すること
ができる。
なお、本発明の範囲は、上述した実施例に限定されるも
のではなく、たとえば、放熱板および保護カバーの形成
材料は上記実施例の場合に限定されない、そして、保護
カバーの構造も上記実施例以外にも種々設計変更可能で
ある。Hereinafter, one embodiment of the present invention will be specifically described with reference to FIG. 1 and FIG. In the thermal head according to this example, the heat dissipation plate 1 is formed of an iron-based material with sufficient strength, and the upper layer 2a of the protective cover 2 has a linear expansion equal to or less than that of the material forming the heat dissipation plate 1. By forming it from an iron-based material with a high tensile strength, it is constructed so that it can be made thinner without causing strength problems or warping due to temperature changes, and the other constructions are almost the same as the conventional one. That is, as shown in FIG. 1, a heat generating resistor 3, a driver circuit 4 for driving the heat generating resistor 3, and this driver circuit are placed on a heat sink 1 having a screw hole 1a from one end side. A ceramic substrate 5 having a comb-shaped input terminal portion 4a for supplying power to the ceramic substrate 4 is integrally attached, and an external connection substrate 6 is stacked on the heat dissipation plate l and the ceramic substrate 5. There is. As shown in FIG. 2, the external connection board 6 includes a translucent synthetic resin film 7 having a comb-shaped connection terminal portion 7a corresponding to the input terminal portion 4a on one end of the back surface, and 7 and a reinforcing plate 8 attached to the lower side of the connecting terminal part 7 to the input terminal part 4a of one example of the heat sink.
The external connection board 6 is superimposed on the heat dissipation plate l so that the points a are superimposed. A protective cover 2 is further stacked on top of this external connection board 6, and a mounting screw is inserted through the screw through hole 2c formed in this protective cover 2 or the screw through hole 6a of the external connection board 6. 9 into the screw hole 1a, the heat sink 1, the external connection board 6, and the protective cover 2 are crimped and fixed. In addition,
In the figure, reference numeral 11 indicates an input signal connection circuit section of the thermal head, 12 indicates a coating layer that protects the driver circuit 4, and 1
3 represents thermal paper, and 14 represents a platen for driving the thermal paper. Now, in this example, as an example, the heat sink 1 is made of a general structural rolled steel material (SS material) having high bending rigidity, instead of the conventional aluminum. The protective cover 2 also includes a lower layer part 2b formed at one end of the lower surface, and a holding γ1I2d that holds a presser rubber 10 in the shape of a round bar as an elastic body for press-contacting the connection terminal part 7a to the input terminal part 4a. , and an upper layer portion 2a whose one end edge extends in a bow shape and covers up to the driver circuit 4. The lower layer part 2b is made of aluminum as before, and the upper layer part 2a is made of stainless steel (aC3LIS material) which has almost the same coefficient of linear expansion as the general structural rolled steel material from which the heat dissipation plate 1 is formed. are doing. That is, in the thermal head according to this example, the lower layer 2b of the protective cover 2, which has a different coefficient of linear expansion, is sandwiched between the heat sink 1 and the upper layer 2a of the protective cover 2, which have substantially the same coefficient of linear expansion. It has a sand inch structure. Therefore, due to the temperature change of the thermal head due to the heat generated from the heat generating resistor 3, the lower part of the protective cover 2
Even if b shows a different expansion coefficient with respect to the heat sink 1 and the upper layer part 2a, the heat sink 1 and the upper layer part 2a sandwiching the lower layer part 2b show the same expansion coefficient. There is no occurrence of warpage in the thermal head. In addition, the heat dissipation plate l is made of general structural rolled steel material with high strength, so even if the heat dissipation plate l is made thin, it will not become unstable in terms of strength unlike aluminum. By forming the plate 1 thinly, it is possible to reduce the thickness of the thermal conductor without reducing the strength. The lower layer part 2b of the protective cover 2, which is the press-contact part of each of the terminal parts 4a and 7a, is made of aluminum that can be easily formed into a fine shape by die-casting or extrusion. The holding groove 2d can be provided at low cost. As described above, in the thermal head according to the present invention, all the conventional problems can be solved and a reduction in thickness can be achieved. Note that the scope of the present invention is not limited to the above-described embodiments; for example, the materials for forming the heat sink and the protective cover are not limited to those in the above-mentioned embodiments, and the structure of the protective cover is also the same as in the above-described embodiments. Various other design changes are possible.
第１図は本発明の一実施例の拡大断面図、第２図は実施
例の分解斜視図である。
ｌ・・・放熱板、２・・・保護カバー、２ａ・・・（保
護カバーの）上層部、２ｂ・・・（保護カバーの）下層
部、２ｄ・・・保持溝、３・・・発熱抵抗体、４・・・
ドライバ回路、４ａ・・・入力端子部、６・・・基板（
外部接続用基板）、７ａ・・・接続端子部、１０・・・
弾性体（押えゴム）。FIG. 1 is an enlarged sectional view of an embodiment of the present invention, and FIG. 2 is an exploded perspective view of the embodiment. l... Heat sink, 2... Protective cover, 2a... Upper layer part (of the protective cover), 2b... Lower layer part (of the protective cover), 2d... Holding groove, 3... Heat generation Resistor, 4...
Driver circuit, 4a...input terminal section, 6...board (
external connection board), 7a... connection terminal section, 10...
Elastic body (presser rubber).
Claims (1)
びに上記ドライバ回路によって駆動される発熱抵抗体を
有する放熱板と、裏面に上記入力端子部と対応する接続
端子部を有し、接続端子部が上記入力端子部に対応して
接触するように上記放熱板上に重ねられる基板と、この
基板上にさらに重ねられるようにして上記放熱板ないし
基板に対して互いに固定され、裏面に形成した保持溝内
に保持させた弾性体が、上記基板の上記接続端子部と対
応する上面を押圧して上記接続端子部と上記入力端子部
どうしが弾性接触させられるようにする保護カバーとを
備えるライン型サーマルヘッドにおいて、 上記放熱板を曲げ剛性の大きい鉄系の材料 で形成するとともに、上記保護カバーを、上記放熱板と
同等もしくはそれ以下の線膨張率をもつ鉄系材料ででき
た上層部と、加工性に優れた軽金属材料でできた下層部
との積層構造としたことを特徴とする、ライン型サーマ
ルヘッド。(1) A heat sink having a driver circuit, its input terminal portion, and a heating resistor driven by the driver circuit on the front surface, and a connecting terminal portion corresponding to the input terminal portion on the back surface, and the connecting terminal portion is A board stacked on the heat sink so as to be in contact with the input terminal portion, and a holding groove formed on the back surface of the board that is further stacked on top of the board and fixed to the heat sink or the board. a protective cover, wherein an elastic body held inside presses an upper surface of the board corresponding to the connection terminal section so that the connection terminal section and the input terminal section are brought into elastic contact with each other; In the head, the heat dissipation plate is formed of an iron-based material with high bending rigidity, and the protective cover is formed with an upper layer made of an iron-based material having a coefficient of linear expansion equal to or lower than that of the heat dissipation plate. A line-type thermal head characterized by a laminated structure with a lower layer made of a light metal material with excellent properties.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30030686A JPS63151466A (en) | 1986-12-16 | 1986-12-16 | Line type thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30030686A JPS63151466A (en) | 1986-12-16 | 1986-12-16 | Line type thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63151466A true JPS63151466A (en) | 1988-06-24 |
Family
ID=17883188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30030686A Pending JPS63151466A (en) | 1986-12-16 | 1986-12-16 | Line type thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63151466A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6478859A (en) * | 1987-09-21 | 1989-03-24 | Kyocera Corp | Thermal head |
| DE3940545A1 (en) * | 1988-12-08 | 1990-06-13 | Rohm Co Ltd | THERMAL PRINT HEAD |
| US4963886A (en) * | 1989-05-01 | 1990-10-16 | Rohm Co., Ltd. | Thermal printing head |
| JPH03101635U (en) * | 1990-02-06 | 1991-10-23 | ||
| DE4042448C2 (en) * | 1989-05-01 | 1997-05-28 | Rohm Co Ltd | Thermal printing head esp. for facsimile machine |
| US10603934B2 (en) | 2016-10-19 | 2020-03-31 | Seiko Epson Corporation | Winding apparatus and printing apparatus |
-
1986
- 1986-12-16 JP JP30030686A patent/JPS63151466A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6478859A (en) * | 1987-09-21 | 1989-03-24 | Kyocera Corp | Thermal head |
| DE3940545A1 (en) * | 1988-12-08 | 1990-06-13 | Rohm Co Ltd | THERMAL PRINT HEAD |
| US4972205A (en) * | 1988-12-08 | 1990-11-20 | Rohm Co., Ltd. | Thermal printing head |
| US4963886A (en) * | 1989-05-01 | 1990-10-16 | Rohm Co., Ltd. | Thermal printing head |
| DE4042448C2 (en) * | 1989-05-01 | 1997-05-28 | Rohm Co Ltd | Thermal printing head esp. for facsimile machine |
| DE4042449C2 (en) * | 1989-05-01 | 1997-05-28 | Rohm Co Ltd | Thermal print head |
| JPH03101635U (en) * | 1990-02-06 | 1991-10-23 | ||
| US10603934B2 (en) | 2016-10-19 | 2020-03-31 | Seiko Epson Corporation | Winding apparatus and printing apparatus |
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