JPS63150783U - - Google Patents
Info
- Publication number
- JPS63150783U JPS63150783U JP4289887U JP4289887U JPS63150783U JP S63150783 U JPS63150783 U JP S63150783U JP 4289887 U JP4289887 U JP 4289887U JP 4289887 U JP4289887 U JP 4289887U JP S63150783 U JPS63150783 U JP S63150783U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- copper
- layer
- plated
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229910001295 No alloy Inorganic materials 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 239000012943 hotmelt Substances 0.000 description 1
Landscapes
- Coating With Molten Metal (AREA)
- Non-Insulated Conductors (AREA)
Description
第１図は本考案の一実施例を示す断面図。第２
図および第３図は従来の半田めつき線を示す断面
図。
符号の説明、１…電気半田めつき層、２…銅線
、３…溶融めつき層。
FIG. 1 is a sectional view showing an embodiment of the present invention. Second
3 and 3 are cross-sectional views showing conventional solder-plated wires. Explanation of symbols: 1...Electric solder plating layer, 2...Copper wire, 3...Hot melt plating layer.
Claims (1)
５〜１５μｍの電気半田めつき層と、該電気半田
めつき層の外周に形成された厚さ０．０５〜３μ
ｍの溶融半田めつき層を有し、銅と半田めつき層
の間に合金層が形成されていないことを特徴とす
る耐熱半田めつき線。 Thickness 0.0mm formed on the outer periphery of copper or copper-covered steel wire.
An electric solder plating layer of 5 to 15 μm and a thickness of 0.05 to 3 μm formed on the outer periphery of the electric solder plating layer.
1. A heat-resistant solder-plated wire having a molten solder-plated layer of m, and characterized in that no alloy layer is formed between the copper and the solder-plated layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4289887U JPS63150783U (en) | 1987-03-24 | 1987-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4289887U JPS63150783U (en) | 1987-03-24 | 1987-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63150783U true JPS63150783U (en) | 1988-10-04 |
Family
ID=30859249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4289887U Pending JPS63150783U (en) | 1987-03-24 | 1987-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63150783U (en) |
-
1987
- 1987-03-24 JP JP4289887U patent/JPS63150783U/ja active Pending
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