JPS6315045U - - Google Patents
Info
- Publication number
- JPS6315045U JPS6315045U JP10680586U JP10680586U JPS6315045U JP S6315045 U JPS6315045 U JP S6315045U JP 10680586 U JP10680586 U JP 10680586U JP 10680586 U JP10680586 U JP 10680586U JP S6315045 U JPS6315045 U JP S6315045U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- wire
- guide hole
- led out
- width direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78317—Shape of other portions
- H01L2224/78318—Shape of other portions inside the capillary
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10680586U JPS6315045U (no) | 1986-07-14 | 1986-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10680586U JPS6315045U (no) | 1986-07-14 | 1986-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6315045U true JPS6315045U (no) | 1988-02-01 |
Family
ID=30982506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10680586U Pending JPS6315045U (no) | 1986-07-14 | 1986-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6315045U (no) |
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1986
- 1986-07-14 JP JP10680586U patent/JPS6315045U/ja active Pending