JPS63149645U - - Google Patents
Info
- Publication number
- JPS63149645U JPS63149645U JP4078987U JP4078987U JPS63149645U JP S63149645 U JPS63149645 U JP S63149645U JP 4078987 U JP4078987 U JP 4078987U JP 4078987 U JP4078987 U JP 4078987U JP S63149645 U JPS63149645 U JP S63149645U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- heating element
- duct
- surrounded
- blower
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 claims 1
- 238000011144 upstream manufacturing Methods 0.000 claims 1
- 230000003321 amplification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
Description
第１図は本考案に係る電子機器の冷却構造の一
実施例を示す平面図、第２図は従来の電子機器の
冷却構造を示す平面図である。
１……筐体、２……電源部（第１の発熱体）、
３……電力増幅部（第２の発熱体）、５……送風
機、８……ダクト、９……放熱フイン、１０，１
１……調整弁。
FIG. 1 is a plan view showing an embodiment of a cooling structure for an electronic device according to the present invention, and FIG. 2 is a plan view showing a conventional cooling structure for an electronic device. 1... Housing, 2... Power supply unit (first heating element),
3...Power amplification section (second heating element), 5...Blower, 8...Duct, 9...Radiation fin, 10,1
1...Adjustment valve.
Claims (1)
機器の冷却構造において、筐体内に設けられ両端
が筐体外に開口した冷却空気搬送用ダクトと、こ
のダクトに取付けられた放熱フイン及び送風機と
を具備し、第１の発熱体を前記筐体と前記ダクト
及び放熱フインとにより密閉されて囲まれた部分
に配設し、第２の発熱体を前記放熱フインの前記
第１の発熱体とは反対側に直接取付けるとともに
、前記ダクトの入出口近傍に取付けられた前記送
風機のそれぞれ下流側及び上流側に、前記冷却空
気を前記第１の発熱体側にそれぞれ排気及び吸気
する１対の調整弁を回動可能に設けたことを特徴
とする電子機器の冷却構造。 In a cooling structure for an electronic device in which a plurality of heating elements are housed in a housing, there is provided a cooling air conveying duct provided inside the housing and having both ends open to the outside of the housing, and a heat dissipation fin and a blower attached to this duct. A first heating element is disposed in a part sealed and surrounded by the housing, the duct, and the heat radiation fin, and a second heating element is arranged in a part sealed and surrounded by the heat radiation fin and the first heating element. a pair of regulating valves are attached directly to opposite sides, and are disposed on the downstream and upstream sides of the blower, which are attached near the inlet and outlet of the duct, respectively, for exhausting and inhaling the cooling air to the first heating element side. A cooling structure for electronic equipment, characterized in that it is rotatably provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4078987U JPS63149645U (en) | 1987-03-23 | 1987-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4078987U JPS63149645U (en) | 1987-03-23 | 1987-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63149645U true JPS63149645U (en) | 1988-10-03 |
Family
ID=30855186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4078987U Pending JPS63149645U (en) | 1987-03-23 | 1987-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63149645U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0377493U (en) * | 1989-11-30 | 1991-08-05 | ||
| JPH0818462A (en) * | 1994-06-29 | 1996-01-19 | Nec Corp | Outdoor device |
| JP2009512218A (en) * | 2005-10-14 | 2009-03-19 | ジーイー・アビエイション・システムズ・エルエルシー | Cross-flow surplus air cooling method for highly reliable electronic equipment |
| JP2014123591A (en) * | 2012-12-20 | 2014-07-03 | Hitachi Ltd | Control unit and method of cooling the same |
| JP2016167185A (en) * | 2015-03-10 | 2016-09-15 | 沖電気工業株式会社 | Automatic transaction device |
-
1987
- 1987-03-23 JP JP4078987U patent/JPS63149645U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0377493U (en) * | 1989-11-30 | 1991-08-05 | ||
| JPH0818462A (en) * | 1994-06-29 | 1996-01-19 | Nec Corp | Outdoor device |
| JP2009512218A (en) * | 2005-10-14 | 2009-03-19 | ジーイー・アビエイション・システムズ・エルエルシー | Cross-flow surplus air cooling method for highly reliable electronic equipment |
| JP2014123591A (en) * | 2012-12-20 | 2014-07-03 | Hitachi Ltd | Control unit and method of cooling the same |
| JP2016167185A (en) * | 2015-03-10 | 2016-09-15 | 沖電気工業株式会社 | Automatic transaction device |