JPS63149547U - - Google Patents
Info
- Publication number
- JPS63149547U JPS63149547U JP1987043097U JP4309787U JPS63149547U JP S63149547 U JPS63149547 U JP S63149547U JP 1987043097 U JP1987043097 U JP 1987043097U JP 4309787 U JP4309787 U JP 4309787U JP S63149547 U JPS63149547 U JP S63149547U
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- heat
- heat dissipation
- electronic component
- mounting hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987043097U JPS63149547U (US20080293856A1-20081127-C00150.png) | 1987-03-24 | 1987-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987043097U JPS63149547U (US20080293856A1-20081127-C00150.png) | 1987-03-24 | 1987-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63149547U true JPS63149547U (US20080293856A1-20081127-C00150.png) | 1988-10-03 |
Family
ID=30859633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987043097U Pending JPS63149547U (US20080293856A1-20081127-C00150.png) | 1987-03-24 | 1987-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63149547U (US20080293856A1-20081127-C00150.png) |
-
1987
- 1987-03-24 JP JP1987043097U patent/JPS63149547U/ja active Pending
