JPS63145136U - - Google Patents
Info
- Publication number
- JPS63145136U JPS63145136U JP3734887U JP3734887U JPS63145136U JP S63145136 U JPS63145136 U JP S63145136U JP 3734887 U JP3734887 U JP 3734887U JP 3734887 U JP3734887 U JP 3734887U JP S63145136 U JPS63145136 U JP S63145136U
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- lead
- sensing element
- heat sensing
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012212 insulator Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 239000011148 porous material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- 238000012856 packing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
第1図は本考案の一実施例のモールドする前の
熱感知素子を示す斜視図、第2図は同上の外観を
示す正面図、第3図a〜dは同上に用いられる夫
々別の絶縁体を示す斜視図、第4図は第3図dの
絶縁体を用いた熱感知素子のモールドする前の斜
視図、第5図は同上を用いた熱感知器を示す断面
図、第6図は同上の熱感知器に用いられるパツキ
ンの斜視図、第7図a,bは同上の熱感知素子へ
の取付説明図、第8図は熱感知器の要部断面図、
第9図は従来例の構造を示す説明図、第10図は
同上のプリント基板への取付説明図、第11図は
同上を用いた熱感知器に用いられるパツキンを示
す斜視図、第12図はパツキンの断面図、第13
図a〜cは同上のパツキンへの熱感知素子の取付
説明図、第14図は同上の問題点を示す説明図で
ある。
1は熱感知素子、2はサーミスタ、3はリード
、4は樹脂、5は絶縁体、6は溝、7は孔である
。
Fig. 1 is a perspective view showing a heat sensing element before molding according to an embodiment of the present invention, Fig. 2 is a front view showing the external appearance of the same, and Figs. 4 is a perspective view of a heat sensing element using the insulator shown in FIG. 3d before molding; FIG. 5 is a sectional view showing a heat sensor using the same; FIG. 6 is a perspective view of the gasket used in the above heat sensor, FIGS. 7a and 7b are explanatory diagrams of attachment to the above heat sensing element, and FIG. 8 is a sectional view of the main parts of the heat sensor.
FIG. 9 is an explanatory diagram showing the structure of a conventional example, FIG. 10 is an explanatory diagram of mounting the same to a printed circuit board, FIG. 11 is a perspective view showing a packing used in a heat sensor using the same, and FIG. 12 is an explanatory diagram showing the structure of a conventional example. is a cross-sectional view of the packing, No. 13
Figures a to c are explanatory diagrams for attaching the heat sensing element to the packing same as above, and Fig. 14 is an explanatory diagram showing the problem of the same. 1 is a heat sensing element, 2 is a thermistor, 3 is a lead, 4 is a resin, 5 is an insulator, 6 is a groove, and 7 is a hole.
Claims (1)
るとともに、サーミスタの両側に接続された2本
のリードを所定以上の間隔を保つて下方に導出す
る導出部を絶縁体に形成し、上記リードの下端部
を残して上部を樹脂にてモールドして成ることを
特徴とする熱感知素子。 (2) 上記絶縁体を円柱状に形成し、この絶縁体
の導出部を周面に上下方向に形成した溝として成
ることを特徴とする実用新案登録請求の範囲第1
項記載の熱感知素子。 (3) 上記絶縁体の導出部を絶縁体内を挿通する
挿通孔として成ることを特徴とする実用新案登録
請求の範囲第1項記載の熱感知素子。 (4) 上記絶縁体を多孔質材料で形成して成るこ
とを特徴とする実用新案登録請求の範囲第1項記
載の熱感知素子。 (5) 上記絶縁体の下部を裾広がりに形成して成
ることを特徴とする実用新案登録請求の範囲第1
項記載の熱感知素子。[Claims for Utility Model Registration] (1) A thermistor is placed on the top surface of a columnar insulator, and a lead-out part that leads out two leads connected to both sides of the thermistor downward with a predetermined distance or more between them. A heat sensing element characterized in that the lead is formed of an insulator, and the upper part of the lead is molded with resin, leaving the lower end of the lead. (2) Utility model registration claim 1, characterized in that the insulator is formed in a cylindrical shape, and the lead-out portion of the insulator is formed as a groove formed in the vertical direction on the circumferential surface.
The heat sensing element described in . (3) The heat sensing element according to claim 1, wherein the lead-out portion of the insulator is an insertion hole inserted into the insulator. (4) The heat sensing element according to claim 1, wherein the insulator is made of a porous material. (5) Utility model registration claim 1, which is characterized in that the lower part of the insulator is formed to have a wide base.
The heat sensing element described in .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987037348U JPH0633393Y2 (en) | 1987-03-14 | 1987-03-14 | Thermal sensing element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987037348U JPH0633393Y2 (en) | 1987-03-14 | 1987-03-14 | Thermal sensing element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63145136U true JPS63145136U (en) | 1988-09-26 |
JPH0633393Y2 JPH0633393Y2 (en) | 1994-08-31 |
Family
ID=30848597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987037348U Expired - Lifetime JPH0633393Y2 (en) | 1987-03-14 | 1987-03-14 | Thermal sensing element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0633393Y2 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893840U (en) * | 1981-12-21 | 1983-06-25 | 松下電器産業株式会社 | temperature detector |
JPS58156236U (en) * | 1982-04-14 | 1983-10-19 | 株式会社日立製作所 | temperature sensor |
JPS60151102U (en) * | 1984-03-19 | 1985-10-07 | 株式会社村田製作所 | Electrical element with lead wire |
JPS6122308U (en) * | 1984-07-12 | 1986-02-08 | ティーディーケイ株式会社 | thermistor |
-
1987
- 1987-03-14 JP JP1987037348U patent/JPH0633393Y2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893840U (en) * | 1981-12-21 | 1983-06-25 | 松下電器産業株式会社 | temperature detector |
JPS58156236U (en) * | 1982-04-14 | 1983-10-19 | 株式会社日立製作所 | temperature sensor |
JPS60151102U (en) * | 1984-03-19 | 1985-10-07 | 株式会社村田製作所 | Electrical element with lead wire |
JPS6122308U (en) * | 1984-07-12 | 1986-02-08 | ティーディーケイ株式会社 | thermistor |
Also Published As
Publication number | Publication date |
---|---|
JPH0633393Y2 (en) | 1994-08-31 |
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