JPS6314476Y2 - - Google Patents

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Publication number
JPS6314476Y2
JPS6314476Y2 JP1978128353U JP12835378U JPS6314476Y2 JP S6314476 Y2 JPS6314476 Y2 JP S6314476Y2 JP 1978128353 U JP1978128353 U JP 1978128353U JP 12835378 U JP12835378 U JP 12835378U JP S6314476 Y2 JPS6314476 Y2 JP S6314476Y2
Authority
JP
Japan
Prior art keywords
vacuum chuck
microelectronic
suction
movable cylinder
microelectronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1978128353U
Other languages
Japanese (ja)
Other versions
JPS5545260U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978128353U priority Critical patent/JPS6314476Y2/ja
Publication of JPS5545260U publication Critical patent/JPS5545260U/ja
Application granted granted Critical
Publication of JPS6314476Y2 publication Critical patent/JPS6314476Y2/ja
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 本考案はチツプ抵抗、チツプコンデンサ等の微
小電子部品を真空チヤツクにて吸着しプリント基
板上等へ供給する機構において、微小電子部品の
吸着確認を簡単にして行うことのできる微小電子
部品の吸着検出装置を提供しようとするものであ
る。
[Detailed description of the invention] The present invention is a mechanism for sucking microelectronic components such as chip resistors and chip capacitors using a vacuum chuck and supplying them onto a printed circuit board, etc., to easily check the suction of microelectronic components. The present invention aims to provide a suction detection device for microelectronic components that is capable of detecting microelectronic components.

以下、本考案の一実施例について図面とともに
説明する。図に示すように、クレーン1に取付け
られ上下移動する真空チヤツク2の外周には検出
用の可動筒3が装着されており、この可動筒3は
弱いバネ4(もしくは自重)によつて常に下方へ
押し下げられている。また、上記可動筒3の上部
近傍には一対のセンサー5が備えられており、6
は上記真空チヤツク2の先端部に吸着される微小
電子部品である。
An embodiment of the present invention will be described below with reference to the drawings. As shown in the figure, a movable cylinder 3 for detection is attached to the outer periphery of a vacuum chuck 2 that is attached to a crane 1 and moves up and down. being pushed down to Further, a pair of sensors 5 are provided near the top of the movable cylinder 3.
is a microelectronic component that is attracted to the tip of the vacuum chuck 2.

今、真空チヤツク2の先端部に真空圧により微
小電子部品6が吸着されると、真空チヤツクの吸
引孔が、吸着された微小電子部品6によつて塞が
れ、真空チヤツク内部が気密室となり、真空圧が
下がる。この真空圧の変化によつて可動筒3がバ
ネ4の付勢力(または可動筒3の自重)に抗して
押し上げられる。第1図は吸着時、第2図は非吸
着時の状態をそれぞれ示している。この時に発生
する可動筒3の上下移動量をセンサー5によつて
検出することにより、真空チヤツク2による微小
電子部品6の吸着確認を行うことができる。な
お、上記センサー5は光電式、無接点式のいずれ
でも採用可能である。
Now, when the microelectronic component 6 is attracted to the tip of the vacuum chuck 2 by vacuum pressure, the suction hole of the vacuum chuck is blocked by the attracted microelectronic component 6, and the inside of the vacuum chuck becomes an airtight chamber. , the vacuum pressure decreases. Due to this change in vacuum pressure, the movable cylinder 3 is pushed up against the biasing force of the spring 4 (or the own weight of the movable cylinder 3). FIG. 1 shows the state during adsorption, and FIG. 2 shows the state during non-adsorption. By detecting the amount of vertical movement of the movable cylinder 3 that occurs at this time using the sensor 5, it is possible to confirm that the microelectronic component 6 is attracted by the vacuum chuck 2. Note that the sensor 5 can be either a photoelectric type or a non-contact type.

以上のように本考案は構成されているものであ
り、微小部品が吸着された場合のみ可動筒が移動
するため、真空チヤツクによる微小電子部品の吸
着確認を正確に、かつ簡単にして行うことがで
き、微小電子部品の自動組立機等に採用した場合
に吸着もれによる誤動作を防止できる等、その実
用価値は大なるものである。
The present invention is constructed as described above, and since the movable cylinder moves only when a microscopic component is suctioned, it is possible to accurately and easily confirm the suction of a microelectronic component using a vacuum chuck. It has great practical value, such as being able to prevent malfunctions due to suction leakage when used in automatic assembly machines for microelectronic parts.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案装置の一実施例を示す吸着時の
断面図、第2図は同非吸着時の断面図、第3図は
同装置にて吸着される微小電子部品の斜視図であ
る。 2……真空チヤツク、3……可動筒、4……バ
ネ、6……微小電子部品。
Fig. 1 is a cross-sectional view of an embodiment of the device of the present invention when it is suctioned, Fig. 2 is a cross-sectional view of the device when it is not suctioned, and Fig. 3 is a perspective view of a microelectronic component being suctioned by the device. . 2...Vacuum chuck, 3...Movable tube, 4...Spring, 6...Minute electronic parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 微小電子部品を吸着する真空チヤツクの外周
に、先端部が微小電子部品に当接する検出用の可
動筒を自重もしくは弱いバネによつて常に下方へ
押し下げられている状態で装着し、この可動筒を
介して真空チヤツクにより微小電子部品を吸着す
るようにし、かつ可動筒の移動レベルによつて上
記微小電子部品の吸着確認を行うように構成した
微小電子部品の吸着検出装置。
A movable cylinder for detection, the tip of which touches the microelectronic components, is attached to the outer periphery of the vacuum chuck that adsorbs microelectronic components, with the movable cylinder constantly pushed downward by its own weight or a weak spring. A suction detection device for a microelectronic component, which is configured to suction a microelectronic component with a vacuum chuck through the vacuum chuck, and to confirm suction of the microelectronic component based on the movement level of a movable tube.
JP1978128353U 1978-09-18 1978-09-18 Expired JPS6314476Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978128353U JPS6314476Y2 (en) 1978-09-18 1978-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978128353U JPS6314476Y2 (en) 1978-09-18 1978-09-18

Publications (2)

Publication Number Publication Date
JPS5545260U JPS5545260U (en) 1980-03-25
JPS6314476Y2 true JPS6314476Y2 (en) 1988-04-22

Family

ID=29091963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978128353U Expired JPS6314476Y2 (en) 1978-09-18 1978-09-18

Country Status (1)

Country Link
JP (1) JPS6314476Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI799111B (en) * 2022-01-26 2023-04-11 東佑達自動化科技股份有限公司 Automatic production line feeding device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023427U (en) * 1973-06-18 1975-03-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023427U (en) * 1973-06-18 1975-03-17

Also Published As

Publication number Publication date
JPS5545260U (en) 1980-03-25

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