JPS63142275A - Inspection of conductive pattern - Google Patents
Inspection of conductive patternInfo
- Publication number
- JPS63142275A JPS63142275A JP61289023A JP28902386A JPS63142275A JP S63142275 A JPS63142275 A JP S63142275A JP 61289023 A JP61289023 A JP 61289023A JP 28902386 A JP28902386 A JP 28902386A JP S63142275 A JPS63142275 A JP S63142275A
- Authority
- JP
- Japan
- Prior art keywords
- patterns
- conductive pattern
- probe
- electrode
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title description 8
- 239000000523 sample Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 12
- 230000007547 defect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 13
- 230000002950 deficient Effects 0.000 abstract description 3
- 238000005259 measurement Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、タッチパネルあるいは各種ディスプレーなど
のマトリックス状電稿を構成するために用いられる絶縁
基板上の平行導電ストリップ、あるいはプリント基板上
の導電パターンなどの検査、特に、液晶表示装置に用い
られるプラスチックフィルムを基板にした導電パターン
の検査方法に関する。[Detailed Description of the Invention] [Technical Field] The present invention relates to the inspection of parallel conductive strips on an insulating substrate, conductive patterns on a printed circuit board, etc. used to construct a matrix-like electronic document such as a touch panel or various displays. In particular, the present invention relates to a method of inspecting a conductive pattern using a plastic film as a substrate used in a liquid crystal display device.
従来、このような導電パターンの断線あるいは一部欠落
などの異常を検出する方法として、一つの導電パターン
の両端にそれぞれプローブを接触させて当該導電パター
ンの電気抵抗を測定し、これを繰り返してすべての導電
パターンを検査する方式がある。しかしながら、このよ
うに各導電パターン毎に1つずつ検査を行う方法では全
パターンを検査するのに時間がかかるので全数検査を必
要とする場合には好ましくない。Conventionally, as a method for detecting abnormalities such as disconnections or missing parts of a conductive pattern, the electrical resistance of the conductive pattern is measured by touching each end of the conductive pattern with a probe, and this is repeated to detect all There is a method for inspecting conductive patterns. However, such a method of inspecting each conductive pattern one by one takes time to inspect all patterns, and is therefore not preferable when 100% inspection is required.
また、検査の対象となる導電パターンの形状に合わせて
多数のプローブを配設したヘッドを使用し、このヘッド
によって各導電パターンにプローブを同時に接触させる
ようにして検査を行う方法があるが、この方法ではプロ
ーブおよび抵抗測定器を多数必要とするばかりでなく、
導電パターンの異なる基板毎にヘッドを準備する必要が
あり、さらに、ヘッドに配設するプローブの間隔がプロ
ーブの大きさによって制限をうけるので、高密度で配設
された導電パターンに対して適用するのは困難である。Another method is to use a head with a number of probes arranged according to the shape of the conductive pattern to be inspected, and use this head to bring the probes into contact with each conductive pattern at the same time. The method not only requires a large number of probes and resistance measuring instruments;
It is necessary to prepare a head for each substrate with a different conductive pattern, and furthermore, the spacing between the probes placed on the head is limited by the size of the probes, so it is not suitable for use with conductive patterns arranged in high density. is difficult.
本発明は、基板に形成されたi電パターンの断線あるい
は一部欠落などを抵抗値によって検査する際に、その検
査を容易かつ迅速に行い得るようにするとともに、高密
度の3電パターンに対しても容易に検査を行えるように
した導電パターンの検査方法を提供することを目的とす
る。The present invention makes it possible to easily and quickly inspect disconnection or partial missing of an i-electrode pattern formed on a substrate by resistance value, and also enables inspection for high-density tri-electrode patterns. It is an object of the present invention to provide a method for inspecting a conductive pattern that can be easily inspected.
本発明の構成について、以下、第1図図示の実施例に基
づいて説明する。The configuration of the present invention will be explained below based on the embodiment shown in FIG.
共通電極2とプローブ3が抵抗測定器4の各測定端子に
それぞれ接続されており、液晶表示装置のプラスチック
基板などの基板工に形成された格子状電極などの導電パ
ターンPのそれぞれの導電パターンの一端を上記共通電
極2に接続する。A common electrode 2 and a probe 3 are respectively connected to each measurement terminal of a resistance measuring device 4, and each conductive pattern P such as a grid electrode formed on a substrate such as a plastic substrate of a liquid crystal display device is connected to a common electrode 2 and a probe 3. One end is connected to the common electrode 2 mentioned above.
上記プローブ3の4電パターンに対する接触部は1つの
導電パターンの一端を独立に接触し得るだけの巾になっ
ており、このプローブ3を上記導電パターンPの共通電
極2に接続されていない端部上を摺動して順次移動させ
、各導電パターンの電気抵抗を上記抵抗測定器4によて
順次測定する。The contact portion of the probe 3 with respect to the four-electrode pattern is wide enough to independently contact one end of one conductive pattern, and the probe 3 is connected to the end of the conductive pattern P that is not connected to the common electrode 2. The electrical resistance of each conductive pattern is sequentially measured by the resistance measuring device 4 by sliding the conductive pattern on the conductive pattern.
導電パターンに断線あるいは一部欠落などが生じていれ
ば、その欠陥のある導電パターンの電気抵抗は正常なも
のの電気抵抗と異なるので、上記のように各導電パター
ンの電気抵抗を測定すれば欠陥のある導電パターンが検
出できる。If a conductive pattern is broken or partially missing, the electrical resistance of the defective conductive pattern will be different from the normal electrical resistance, so measuring the electrical resistance of each conductive pattern as described above will identify the defect. A certain conductive pattern can be detected.
なお、この実施例における抵抗測定器は図に示したよう
に、一方の測定端子は抵抗器5を介して直流電源6の一
方の電源端子に接続し、他方の測定端子を上記直流電源
6の他方の電源端子に接続して測定端子間のに接続され
たX−Yレコーダ7によって、プローブ3が摺動される
間に検出した電圧を各導電パターンの電気抵抗として記
録するようにしである。As shown in the figure, the resistance measuring device in this embodiment has one measuring terminal connected to one power terminal of the DC power source 6 via the resistor 5, and the other measuring terminal connected to one of the power terminals of the DC power source 6. An X-Y recorder 7 connected to the other power supply terminal and between the measurement terminals records the voltage detected while the probe 3 is sliding as the electrical resistance of each conductive pattern.
第2図は、上記第1図について説明したそれぞれの導電
パターンの一端への共通電極の接続を圧接電極によって
行うようにした具体例を示す図であり、絶縁支持体22
によって圧接電極8が取り付けられた電極ホルダー21
は定盤ステージTに固定された軸Oを回転支点として回
転自在になっており、この電極ホルダー21の上記回転
支点の反対側に設けられたクランプ23を定盤ステージ
Tのフック24に係合・固定し、このクランプ23のス
プリングの力によって圧接電極8を定盤ステージTに設
置された基板1の導電パターンの片側のそれぞれの一端
に圧接すようにしたものである。FIG. 2 is a diagram showing a specific example in which the common electrode is connected to one end of each of the conductive patterns described in FIG.
Electrode holder 21 to which pressure contact electrode 8 is attached
is rotatable about an axis O fixed to the surface plate stage T as a rotational fulcrum, and a clamp 23 provided on the opposite side of the rotational fulcrum of this electrode holder 21 is engaged with a hook 24 of the surface plate stage T. - The pressure contact electrode 8 is pressed against one end of each side of the conductive pattern of the substrate 1 set on the surface plate stage T by the force of the spring of the clamp 23.
なお、上記圧接電極8としては例えばシリコンゴムに炭
素微粉末を配合した導電膜等を使用することができる。As the pressure contact electrode 8, for example, a conductive film made of silicone rubber mixed with fine carbon powder can be used.
第3図は、本発明を適用した検査を行う検査装置の例を
示す図であり、基板1の電極パターンのそれぞれの一端
は上記第2図について説明した機構によて圧接電極8が
接触され、プローブ3が設置されたプローブ取付基板1
1がモータ12の軸に固定されたプーリ13とベルト1
4によってガイドシャフト15に保持された状態で図の
矢印の方向に移動されてプローブ3を移動させるような
機構になっている。FIG. 3 is a diagram showing an example of an inspection apparatus for carrying out an inspection to which the present invention is applied, in which one end of each electrode pattern on the substrate 1 is brought into contact with a pressure contact electrode 8 by the mechanism explained in connection with FIG. 2 above. , probe mounting board 1 on which probe 3 is installed
1 is a pulley 13 fixed to the shaft of a motor 12 and a belt 1
4, the probe 3 is moved in the direction of the arrow in the figure while being held on the guide shaft 15.
このプローブ取付基板11に取付けられたプローブ3は
、スプリングが配設されたスリーブにプローブ先端が収
納されたものであり、また、このプローブ3はエアシリ
ンダやスプリングとプランジャー等により上下し、上記
スリーブのスプリングの力によって接触圧が適度に調節
される。The probe 3 attached to the probe mounting board 11 has a probe tip housed in a sleeve provided with a spring, and the probe 3 is moved up and down by an air cylinder, a spring, a plunger, etc. The contact pressure is appropriately adjusted by the force of the sleeve spring.
また、定盤ステージTに基板1を設置する方法としては
、吸着による方法や機械的なりランプ等によって行う方
法がある。さらに、この定盤ステージTに回転、前後左
右の微調整が可能なものを使用するようにすれば一層作
業性が良くなることはいうまでもない。Further, as a method for installing the substrate 1 on the surface plate stage T, there are a method using suction, a method using a mechanical lamp, or the like. Furthermore, it goes without saying that the workability will be further improved if the surface plate stage T is capable of rotation and fine adjustment in the front, rear, left, and right directions.
本発明によれば、抵抗測定器の一方の測定端子に接続さ
れた共通電極に基板上に形成された導電パターンのそれ
ぞれの一端を接続し、他方測定端子に接続されたプロー
ブを導電パターンの他のそれぞれの端部上を順次移動さ
せてプローブの摺動により各導電パターンを検査するよ
うにしたので、導電パターンの検査を迅速に行うことが
でき、さらに、上記のように摺動によって1つのプロー
ブを各導電パターンの端部に接触するようにしたので、
プローブの接触部の中程度のピンチを有する高密度の導
電パターンの検査を行うことができる。According to the present invention, one end of each of the conductive patterns formed on the substrate is connected to a common electrode connected to one measuring terminal of a resistance measuring device, and a probe connected to the other measuring terminal is connected to the other end of the conductive pattern. Since each conductive pattern is inspected by sliding the probe sequentially over each end of the probe, the conductive pattern can be inspected quickly. Since the probe was placed in contact with the end of each conductive pattern,
Inspection of dense conductive patterns with moderate pinch of probe contacts can be performed.
第1図は本発明の実施例を示す図、第2図は圧接電極の
具体例を示す図、第3図は本発明を適用した検査装置を
示す図である。
1は基板、2は共通電極、3はプローブ、4は抵抗測定
器、Pは導電パターンである。FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram showing a specific example of a pressure contact electrode, and FIG. 3 is a diagram showing an inspection apparatus to which the present invention is applied. 1 is a substrate, 2 is a common electrode, 3 is a probe, 4 is a resistance measuring device, and P is a conductive pattern.
Claims (2)
P)のそれぞれ一方の電極端子あるいは端部に抵抗測定
器(3)の一方の測定端子に接続された共通電極(2)
を接続し、上記抵抗測定器の他方の測定端子に接続され
たプローブ(3)を上記導電パターンの他方の電極端子
あるいは端部上を順次移動させて各導電パターンの電気
抵抗を上記抵抗測定器によって順次測定し、これによっ
て導電パターンの欠陥を検出することを特徴とする導電
パターンの検査方法。(1) A plurality of conductive patterns (
A common electrode (2) connected to one measuring terminal of the resistance measuring device (3) at each one electrode terminal or end of P)
The probe (3) connected to the other measuring terminal of the resistance measuring device is sequentially moved over the other electrode terminal or end of the conductive pattern to measure the electrical resistance of each conductive pattern using the resistance measuring device. 1. A method for inspecting a conductive pattern, the method comprising sequentially measuring and detecting defects in the conductive pattern.
れら複数の導電パターンの端子あるいは端部を短絡する
圧接電極(8)によって行われることを特徴とする特許
請求の範囲第1項記載の導電パターンの検査方法。(2) The electrical conductivity according to claim 1, characterized in that the connection to the plurality of conductive patterns by the common electrode is performed by a pressure contact electrode (8) that short-circuits the terminals or ends of the plurality of conductive patterns. How to inspect patterns.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61289023A JPS63142275A (en) | 1986-12-05 | 1986-12-05 | Inspection of conductive pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61289023A JPS63142275A (en) | 1986-12-05 | 1986-12-05 | Inspection of conductive pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63142275A true JPS63142275A (en) | 1988-06-14 |
Family
ID=17737826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61289023A Pending JPS63142275A (en) | 1986-12-05 | 1986-12-05 | Inspection of conductive pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63142275A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9394000B2 (en) | 2011-10-05 | 2016-07-19 | Hino Motors, Ltd. | Body frame connection member, and body frame structure |
-
1986
- 1986-12-05 JP JP61289023A patent/JPS63142275A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9394000B2 (en) | 2011-10-05 | 2016-07-19 | Hino Motors, Ltd. | Body frame connection member, and body frame structure |
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