JPS63141195U

JPS63141195U -

Info

Publication number: JPS63141195U
Application number: JP3374687U
Authority: JP
Priority date: 1987-03-10
Filing date: 1987-03-10
Publication date: 1988-09-16

Description

[Brief explanation of the drawing]

第１図は本考案の第１実施例を示す平面図、第
２図は第１図の―線に沿う断面図、第３図は
第１図の斜視図、第４図は第１実施例の異なる使
用状態を示す平面図、第５図は温度試験装置を模
式的に示す平面図、第６図は第５図の要部側面図
、第７図は本考案の第２実施例を示す断面図、第
８図は第２実施例の要部を模式的に示す斜視図、
第９図は本考案の第３実施例の要部を模式的に示
す斜視図、第１０図は本考案の第４実施例を示す
断面図、第１１図は第４実施例の要部を模式的に
示す斜視図、第１２図は従来例を示す断面図であ
る。１６…ＩＣ、１７…搬送装置、１８…パレツト
、２２…位置決め治具、２３…係入ピン、２４…
係入孔、２５…ＩＣ、３１…位置決め治具、３２
…係入ピン、４１…位置決め治具、４２…係入ピ
ン。 Fig. 1 is a plan view showing the first embodiment of the present invention, Fig. 2 is a sectional view taken along the line - in Fig. 1, Fig. 3 is a perspective view of Fig. 1, and Fig. 4 is the first embodiment. Fig. 5 is a plan view schematically showing the temperature test device, Fig. 6 is a side view of the main part of Fig. 5, and Fig. 7 shows a second embodiment of the present invention. A sectional view, FIG. 8 is a perspective view schematically showing main parts of the second embodiment,
Fig. 9 is a perspective view schematically showing the main part of the third embodiment of the present invention, Fig. 10 is a sectional view showing the fourth embodiment of the invention, and Fig. 11 is the main part of the fourth embodiment. FIG. 12 is a schematic perspective view and a sectional view showing a conventional example. 16...IC, 17...transport device, 18...pallet, 22...positioning jig, 23...engaging pin, 24...
Engagement hole, 25...IC, 31...positioning jig, 32
... Engagement pin, 41... Positioning jig, 42... Engagement pin.

Claims

[Scope of utility model registration request]

What is claimed is: 1. An electronic component transportation device for transporting electronic components mounted on a pallet, characterized in that a positioning jig for positioning the electronic components at a predetermined position on the pallet is detachable from the pallet.