JPS63140649U - - Google Patents
Info
- Publication number
- JPS63140649U JPS63140649U JP3363087U JP3363087U JPS63140649U JP S63140649 U JPS63140649 U JP S63140649U JP 3363087 U JP3363087 U JP 3363087U JP 3363087 U JP3363087 U JP 3363087U JP S63140649 U JPS63140649 U JP S63140649U
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin
- light receiving
- receiving element
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3363087U JPH0632695Y2 (ja) | 1987-03-06 | 1987-03-06 | 受光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3363087U JPH0632695Y2 (ja) | 1987-03-06 | 1987-03-06 | 受光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63140649U true JPS63140649U (US07714131-20100511-C00001.png) | 1988-09-16 |
JPH0632695Y2 JPH0632695Y2 (ja) | 1994-08-24 |
Family
ID=30841415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3363087U Expired - Lifetime JPH0632695Y2 (ja) | 1987-03-06 | 1987-03-06 | 受光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0632695Y2 (US07714131-20100511-C00001.png) |
-
1987
- 1987-03-06 JP JP3363087U patent/JPH0632695Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0632695Y2 (ja) | 1994-08-24 |