JPS63140647U - - Google Patents
Info
- Publication number
- JPS63140647U JPS63140647U JP1987032972U JP3297287U JPS63140647U JP S63140647 U JPS63140647 U JP S63140647U JP 1987032972 U JP1987032972 U JP 1987032972U JP 3297287 U JP3297287 U JP 3297287U JP S63140647 U JPS63140647 U JP S63140647U
- Authority
- JP
- Japan
- Prior art keywords
- mounting component
- connection terminals
- basic circuit
- circuit
- electrical connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987032972U JPS63140647U (es) | 1987-03-06 | 1987-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987032972U JPS63140647U (es) | 1987-03-06 | 1987-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63140647U true JPS63140647U (es) | 1988-09-16 |
Family
ID=30840145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987032972U Pending JPS63140647U (es) | 1987-03-06 | 1987-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63140647U (es) |
-
1987
- 1987-03-06 JP JP1987032972U patent/JPS63140647U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63140647U (es) | ||
| JPS58195484U (ja) | プリント基板取付構造 | |
| JPS5952744U (ja) | 小形無線機 | |
| JPH032669U (es) | ||
| JPS6073271U (ja) | プリント配線板 | |
| JPS60141139U (ja) | Ｉｃの取付装置 | |
| JPS6022764U (ja) | プリント基板実装用コネクタ | |
| JPS6013765U (ja) | プリント基板 | |
| JPS5918459U (ja) | 電気素子取付構造 | |
| JPS63273U (es) | ||
| JPS5878678U (ja) | プリント基板装置 | |
| JPS6127276U (ja) | チツプ部品の取付構造 | |
| JPS58124990U (ja) | プリント配線板 | |
| JPS5952658U (ja) | チツプ部品装着プリント基板 | |
| JPS587378U (ja) | 電子部品の実装構造 | |
| JPS5933275U (ja) | プリント基板と導電板の接続装置 | |
| JPS5810382U (ja) | 接続装置 | |
| JPS61190177U (es) | ||
| JPS59131175U (ja) | 電気部品の端子 | |
| JPS5820542U (ja) | プリント板搭載端子付電子部品の構造 | |
| JPS59138771U (ja) | 電流・電圧変換抵抗の接続構造 | |
| JPS5991773U (ja) | プリント板 | |
| JPS59189250U (ja) | 半導体素子の実装パツケ−ジ | |
| JPS59123359U (ja) | プリント基板 | |
| JPS5864087U (ja) | Ｉｃソケツト |